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MPF300TLS-FCG784I

Microchip Technology

MPF300TLS-FCG784I by Microchip Technology

MPF300TLS-FCG784I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.

Median Price

$758.774

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 309 parts In-Stock

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$758.774

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309

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Vyrian

USA . 8,989 parts In-Stock

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Chip Stock

USA . 1,244 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 647 parts In-Stock

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$8.726

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647

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Aztec Data Supply Inc.

USA . 2,251 parts In-Stock

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$30.110

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Corohmni

South Africa . 589 parts In-Stock

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$79.746

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Vigor

Singapore . 567 parts In-Stock

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$605.100

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$678.900

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Semicontronic

India . 1 parts In-Stock

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$678.900

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$661.928

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$658.533

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$678.900

$661.928

$658.533

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Corphita

USA . 50 parts In-Stock

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$718.839

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LMD Electronica

Estonia . 6,973 parts In-Stock

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Montano Global Distributors

Canada . 5,025 parts In-Stock

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NIA Electronics

USA . 4,878 parts In-Stock

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Ledger Components

France . 4,878 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,422 parts In-Stock

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Continental Prestige Electronics

USA . 2,103 parts In-Stock

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Argo Parts USA

USA . 943 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MPF300TLS-FCG784I by Microchip Technology. This Field Programmable Gate Array offers unmatched quality and reliability, making it the top choice for a wide range of applications. With its innovative design and advanced features, this FPGA provides customers with unparalleled value and benefits. Say goodbye to limitations and hello to endless possibilities with the MPF300TLS-FCG784I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging for the FPGA, ensuring reliability and ease of handling.

No. of Logic Cells: 300000

Large number of logic cells allows for complex and high-performance designs to be implemented on the FPGA.

Surface Mount: YES

Surface mount technology enables easy and efficient integration of the FPGA onto circuit boards.

Maximum Supply Voltage: 1.03 V

Operates efficiently within a low voltage range, enhancing power efficiency and reducing heat generation.

Technology Used: CMOS

CMOS technology offers high speed performance and low power consumption, making the FPGA suitable for a wide range of applications.

No. of Inputs: 388

Offers a large number of inputs for versatile connectivity and input/output options in FPGA designs.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, optimizing overall design layout.

Form Of Terminal: BALL

Ball terminals provide reliable connections and facilitate easy soldering during the assembly process.

No. of Terminals: 784

High number of terminals allows for extensive connectivity options and provides flexibility in circuit board design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA, the device offers reconfigurable logic and can be programmed and customized for specific applications, providing flexibility and versatility.

Package Style (Meter): GRID ARRAY

Grid array packaging offers high I/O density and optimal signal integrity, enhancing performance and reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

Wide supply voltage range ensures compatibility with various power sources and allows for flexible design configurations.

Maximum Operating Temperature: 100 °C

High operating temperature tolerance allows the FPGA to be used in demanding environments without compromising performance.

Pitch Of Terminal: 1 mm

Standard terminal pitch of 1mm enables compatibility with widely used assembly processes and components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in extreme cold environments, making the FPGA suitable for a variety of applications.

Position Of Terminal: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing, facilitating efficient design and assembly processes.

Maximum Seated Height: 3.47 mm

Low seated height allows for compact and space-efficient PCB designs, enabling the FPGA to be used in small form factor applications.

Width: 29 mm

Compact width dimension enables easy integration of the FPGA into tight spaces on circuit boards, contributing to overall design efficiency.

No. of Outputs: 388

Balanced number of output pins ensures versatile connectivity options and efficient signal routing in FPGA designs.

Length: 29 mm

Optimal length dimension allows for efficient placement of the FPGA on circuit boards, contributing to overall design integrity.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TLS-FCG784I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF300TLS-FCG784I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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