Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MPF100TS-1FCG484I by Microchip is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its package is a square grid array with 484 ball terminals, suitable for applications requiring programmable gate arrays in compact designs.
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This material is lightweight, durable, and cost-effective, making the FPGA ideal for applications where weight and budget restrictions are key considerations.
Surface mount technology eliminates the need for holes or leads on the PCB, allowing for higher component density and more efficient assembly processes.
The high maximum supply voltage allows for flexibility in power input, ensuring compatibility with a wide range of systems and applications.
CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the FPGA energy-efficient and reliable for various tasks.
With a high number of inputs, the FPGA can handle complex operations and processes, making it suitable for demanding applications that require extensive connectivity.
The square package shape allows for efficient use of space on the PCB, maximizing component density and enabling compact designs in tight layouts.
The ball terminals provide reliable electrical connections, easy soldering, and enhanced thermal performance, ensuring stable operation and longevity of the FPGA.
The high number of terminals allows for extensive connectivity options, enabling the FPGA to interface with a wide range of external devices and systems.
Being a field-programmable device offers flexibility and versatility, allowing for customization and reconfiguration of the FPGA to meet specific application requirements.
The grid array package style enables easy alignment and soldering during assembly, ensuring efficient manufacturing processes and reliable electrical connections.
The low minimum supply voltage allows for efficient power management and reduced energy consumption, making the FPGA suitable for battery-powered applications.
The high maximum operating temperature range ensures reliable performance in harsh environments and industrial applications where temperature fluctuations are common.
The 1mm pitch of terminals allows for high-density mounting on the PCB, enabling compact designs and efficient use of available space for other components.
The wide minimum operating temperature range makes the FPGA suitable for use in extreme conditions and outdoor environments where temperature variations can occur.
The bottom terminal position facilitates easy and efficient PCB layout design, making it convenient for assembly and ensuring secure electrical connections.
The low maximum seated height allows for slim and compact product designs, reducing overall device thickness and enabling space-saving solutions.
The width measurement provides an indication of the physical size of the FPGA, enabling designers to assess compatibility and integration within their system requirements.
The high number of outputs allows for extensive signal routing and data transmission capabilities, making the FPGA suitable for applications that require multiple output channels.
The length measurement indicates the physical dimensions of the FPGA, providing information on the form factor and size constraints for PCB layout and system integration.
Field Programmable Gate Arrays (FPGA) MPF100TS-1FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology
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MPF100TS-1FCG484I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Software 19/Apr/2023
PCN Design/Specification - MPFxxx/RTPF 10/May/2023 Software 19/Apr/2023
PCN Assembly/Origin - Manufacturing Change 23/Feb/2021
PCN Other - Security change 29/May/2019
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
2N2222A
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
General Diode
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
Silicon Transistor
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
BSS123NH6327XTSA1
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
DS18B20+
Analog Devices
DS18B20+ by Analog Devices is a 12-bit temperature sensor with 3.3/5V supply, -55 to 125°C range, and ±0.50°C accuracy. It features a 1-Wire interface for digital output and is commonly used in applications requiring precise temperature monitoring in various industries.
A3P1000-FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC6SLX45-3FGG484I
Xilinx
Xilinx XC6SLX45-3FGG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and moisture sensitivity level of MSL3, it offers reliable performance in harsh environments.
A3PN250-VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
10M16SCU169I7G
Intel
Intel's 10M16SCU169I7G FPGA boasts 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. Ideal for industrial applications requiring high-performance programmable ICs with a max operating temperature of 100°C.
XC6SLX150T-2FGG676C
Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.
XC6SLX9-2TQG144I
The Xilinx XC6SLX9-2TQG144I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100°C and is ideal for industrial applications requiring high-speed processing and programmable ICs.
10M08DCF256C8G
The Intel 10M08DCF256C8G is a Field Programmable Gate Array (FPGA) with 8000 logic cells and 500 configurable logic blocks (CLBs). It operates at a max supply voltage of 1.25V and is suitable for applications requiring programmable ICs in various industries.
EP4CGX30CF23C7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10CL055YF484I7G
Intel's 10CL055YF484I7G FPGA features 3491 CLBs, operates at -40 to 100 °C, with a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact GRID ARRAY package style.
XQR5VFX130-1CN1752B
Xilinx XQR5VFX130-1CN1752B is a 131072 logic cell FPGA with 10240 CLBs, operating at -55 to 125 °C. It uses CMOS technology, has a max supply voltage of 1.05 V, and total dose of 1M Rad(Si). Ideal for military applications requiring high-performance computing in harsh environments.
10M08SAU169C8G
The Intel 10M08SAU169C8G FPGA features 8000 logic cells, 500 CLBs, and a max supply voltage of 3.15V. Ideal for applications requiring high-speed data processing, such as telecommunications equipment and industrial automation systems.
XC7S50-2FGGA484I
The Xilinx XC7S50-2FGGA484I is a Field Programmable Gate Array with 52160 logic cells and 4075 CLBs. It operates at a max clock frequency of 1286 MHz, making it ideal for industrial applications requiring high-speed processing. With a package style of grid array and surface mount capability, this FPGA offers versatile programmability in various electronic systems.
XCAU25P-2SFVB784I
FIELD PROGRAMMABLE GATE ARRAY;
XC6SLX16-3CSG324C
The Xilinx XC6SLX16-3CSG324C is a FPGA with 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for applications requiring high-speed processing in compact form factors like telecommunications equipment and industrial automation systems.
XC7A15T-2CSG325C
Xilinx XC7A15T-2CSG325C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock freq of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation due to its low profile grid array package style.
10M16SCU169A7G
Intel's 10M16SCU169A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and 0.8mm terminal pitch.
XC7A100T-1FGG676C
Xilinx XC7A100T-1FGG676C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85°C and is ideal for high-speed digital applications requiring programmable ICs in a grid array package.
ICE40HX4K-TQ144
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
MPF100TS-1FCVG484I
Microchip Technology
MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.
10M08SAE144I7G
Intel's 10M08SAE144I7G FPGA boasts 8000 logic cells, 500 CLBs, and 250 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15V and operating temperatures ranging from -40 to 100°C.
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MPF100T-1FCSG325I
MPF100T-1FCSG325I by Microchip: FPGA with 170 inputs/outputs, CMOS tech, 0.97V to 1.03V supply range. Ideal for high-performance computing applications due to low profile grid array package and fine pitch terminals.
MPF100T-FCSG325I
MPF100T-FCSG325I by Microchip Tech is a CMOS FPGA with 170 inputs/outputs. It operates b/w -40 to 100°C, with supply voltage range of 0.97-1.03V. This low-profile, fine-pitch GRID ARRAY package is ideal for high-performance applications in electronics.
MPF100T-1FCG484E
MPF100T-1FCG484E by Microchip is a CMOS FPGA with 244 inputs/outputs, 484 terminals, and max supply voltage of 1.03V. Ideal for applications requiring high-density programmable logic in compact spaces due to its small form factor and grid array package style.
MPF100T-1FCVG484I
MPF100T-1FCVG484I by Microchip Technology is a CMOS FPGA with 109K logic cells, 284 inputs/outputs. Operating at -40 to 100°C, it's ideal for industrial applications requiring high-density programmable logic solutions in a compact 19x19mm grid array package.
MPF100T-FCG484E
MPF100T-FCG484E by Microchip: FPGA with 244 inputs/outputs, CMOS tech, 1.03V max supply voltage. Ideal for high-performance applications requiring programmable gate arrays in a compact 23x23mm grid array package.
MPF100T-FCVG484I
MPF100T-FCVG484I by Microchip is a CMOS FPGA with 284 inputs/outputs, operating temp range of -40 to 100°C. It features a grid array package with 0.8mm terminal pitch, suitable for industrial applications requiring high-density programmable logic solutions.
MPF100T-1FCG484I
Microchip Technology's MPF100T-1FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring programmable gate arrays in surface-mount technology.
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 284;
MPF100T-FCSG325E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE;
MPF100T-FCG484I
Microchip Technology's MPF100T-FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. This grid array package has 484 terminals on a square body, suitable for applications requiring programmable gate arrays in surface-mount technology.
MPF100T-FCVG484E
MPF100TS-FCG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MPF100T-1FCG484T2
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
MPF100T-1FCVG484E
MPF100T-1FCVG484E by Microchip is a CMOS FPGA with 284 inputs/outputs, operating b/w 0-100°C. It features a grid array package style with 0.8mm terminal pitch, suitable for applications requiring high-density programmable logic solutions.
MPF100TL-FCSG325I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA325,21X21,20;
MPF100TL-FCVG484E
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;
MPF100TLS-FCVG484I
MPF100TLS-FCVG484I by Microchip: FPGA with 284 inputs/outputs, CMOS tech, 0.97V to 1.03V supply voltage range. Ideal for high-performance computing applications due to fine-pitch grid array package style and operating temp of -40°C to 100°C.
MPF100TL-FCVG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;
MPF100TS-FCSG325I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: SQUARE; Width: 11 mm;
MPF100TL-FCG484I
MPF100TL-FCG484I by Microchip: FPGA with 244 inputs/outputs, CMOS tech, 1.03V max supply. Ideal for high-performance applications requiring programmable gate arrays in a compact 23x23mm grid array package.
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