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XE164FN40F80LRABKXUMA1

Infineon Technologies

XE164FN40F80LRABKXUMA1 by Infineon Technologies

Infineon XE164FN40F80LRABKXUMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. It features 73 I/O lines, CAN and SIO connectivity, and peripherals like DMA(8) and RTC. Ideal for industrial applications requiring high-speed processing and multiple communication interfaces.

Median Price

$11.455

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$11.455

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450

$11.455

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Vyrian

USA . 2,356 parts In-Stock

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2,356

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Digiode

USA . 262 parts In-Stock

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262

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,444 parts In-Stock

1+ parts

$9.961

100+ parts

$9.563

1k+ parts

$9.164

10k+ parts

-

4,444

$9.961

$9.563

$9.164

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Continental Prestige Electronics

USA . 3,603 parts In-Stock

1+ parts

$11.455

100+ parts

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$11.226

3,603

$11.455

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$11.226

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$11.460

100+ parts

$10.887

1k+ parts

-

10k+ parts

$10.199

40

$11.460

$10.887

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$10.199

AZTECH Wire

Italy . 725 parts In-Stock

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$12.699

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725

$12.699

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Microchip USA

USA . 2,839 parts In-Stock

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$23.949

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2,839

$23.949

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Ampacity Inc.

Singapore . 1,546 parts In-Stock

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$30.000

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1,546

$30.000

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Component Stockers USA

USA . 576 parts In-Stock

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$147.200

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576

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Argo Parts USA

USA . 3,522 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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Overview

Discover the power and precision of the XE164FN40F80LRABKXUMA1 by Infineon Technologies. Crafted with expertise and quality in mind, this microcontroller offers unparalleled performance for a wide range of applications. From industrial automation to automotive systems, this device delivers reliability and efficiency like no other. Unlock the potential of your projects with the cutting-edge technology and innovative features of the XE164FN40F80LRABKXUMA1. Experience seamless connectivity, advanced peripherals, and high-speed operation - all in a compact and durable package. Elevate your designs and elevate your success with this exceptional microcontroller from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.6 V

Operates within a safe voltage range, minimizing the risk of damage due to overvoltage.

Address Bus Width: 24

Wide address bus width enables efficient memory addressing and data transfer, enhancing overall performance.

Bit Size: 16

16-bit architecture provides good balance between performance and power consumption, making it suitable for a wide range of applications.

No. of Terminals: 100

Sufficient number of terminals allow for easy connectivity with other components and peripherals, enhancing functionality.

Minimum Supply Voltage: 1.4 V

Ability to operate at low supply voltage levels can save power consumption, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, expanding the range of sensors and devices that can be interfaced with the microcontroller.

ROM Words: 327680

Large ROM capacity allows for ample program storage, accommodating complex algorithms and applications.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller peripherals provide additional functionality and flexibility for system integration and control.

RAM Bytes: 34816

Sufficient RAM capacity enables efficient data storage and processing, supporting multitasking and advanced computations.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing and response times, enhancing overall system performance.

Connectivity: CAN(4), SIO(6)

Support for CAN and SIO connectivity standards enable seamless interfacing with external devices and networks, expanding the range of applications.

Technical Specifications

Microcontrollers XE164FN40F80LRABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

16 ADC INPUT LINES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

34816

ROM Words:

327680

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(4), SIO(6)

Peripherals:

DMA(8), RTC, TIMER(12), WDT

Trade Compliance

XE164FN40F80LRABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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