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XE164F48F66LACFXUMA1

Infineon Technologies

XE164F48F66LACFXUMA1 by Infineon Technologies

Infineon's XE164F48F66LACFXUMA1 microcontroller features 16-bit CPU, 40 MHz clock frequency, and 24-bit address bus width. Ideal for industrial applications, it offers 73 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact square package.

Median Price

$14.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,791 parts In-Stock

1+ parts

-

100+ parts

$12.720

1k+ parts

$11.380

10k+ parts

$10.710

1,791

-

$12.720

$11.380

$10.710

Verical

USA . 1,621 parts In-Stock

1+ parts

-

100+ parts

$15.900

1k+ parts

$14.225

10k+ parts

$13.387

1,621

-

$15.900

$14.225

$13.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.000

-

-

-

Digiode

USA . 784 parts In-Stock

1+ parts

$13.442

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$13.442

-

-

-

Vyrian

USA . 4,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,422

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

$0.950

10k+ parts

$0.930

500

$1.000

-

$0.950

$0.930

Ampacity Inc.

Singapore . 1,669 parts In-Stock

1+ parts

$12.030

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$12.030

-

-

-

Corphita

USA . 440 parts In-Stock

1+ parts

$12.735

100+ parts

-

1k+ parts

-

10k+ parts

-

440

$12.735

-

-

-

AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$15.290

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$15.290

-

-

-

Modulus Dynamics

Lithuania . 505 parts In-Stock

1+ parts

$47.132

100+ parts

$45.247

1k+ parts

$43.361

10k+ parts

-

505

$47.132

$45.247

$43.361

-

Component Stockers USA

USA . 540 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$99.990

-

-

-

Argo Parts USA

USA . 5,110 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,110

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-

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Microchip USA

USA . 4,328 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,328

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-

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Continental Prestige Electronics

USA . 4,205 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,205

-

-

-

-

Overview

Unlock the potential of your next project with the XE164F48F66LACFXUMA1 microcontroller from Infineon Technologies. Manufactured with precision and expertise, this versatile device offers a wide range of applications in various industries. With its advanced features and reliable performance, you can trust that this microcontroller will provide value, benefits, and advantages to meet your specific needs. Experience seamless integration and enhanced functionality with the XE164F48F66LACFXUMA1, delivering quality and innovation for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Maximum Supply Voltage: 1.6 V

With a maximum supply voltage of 1.6V, this microcontroller is power-efficient and can operate at lower power levels, making it suitable for battery-operated devices.

Address Bus Width: 24

A wider address bus width allows for increased memory addressing capabilities, making the microcontroller suitable for applications requiring large memory capacities.

Bit Size: 16

A 16-bit architecture provides enhanced performance and processing capabilities compared to lower bit sizes, making this microcontroller suitable for complex computing tasks.

Power Supplies (V): 1.5,3.3/5

Support for multiple power supply voltages allows for flexibility in design and compatibility with a variety of power sources.

No. of Terminals: 100

A higher number of terminals provide more I/O options and connectivity, making the microcontroller versatile and suitable for a wide range of applications.

ROM Words: 393216

With a large ROM capacity, the microcontroller can store a significant amount of program data, making it suitable for applications requiring extensive programming.

RAM Bytes: 16384

A generous RAM capacity allows for efficient data storage and processing, making the microcontroller suitable for tasks that require temporary data storage during operation.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables fast processing and operation speeds, making the microcontroller suitable for applications that require quick response times.

Technical Specifications

Microcontrollers XE164F48F66LACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

XE164F48F66LACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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