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XE169FH200F100LABKXUMA1

Infineon Technologies

XE169FH200F100LABKXUMA1 by Infineon Technologies

Infineon XE169FH200F100LABKXUMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for automotive applications, it features 147 I/O lines, PWM channels, and ADC channels for versatile control and monitoring functions.

Median Price

$26.531

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$26.531

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-

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32

$26.531

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Vyrian

USA . 2,580 parts In-Stock

1+ parts

-

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2,580

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Digiode

USA . 425 parts In-Stock

1+ parts

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425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 487 parts In-Stock

1+ parts

$5.000

100+ parts

-

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487

$5.000

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$16.520

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342

$16.520

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Modulus Dynamics

Lithuania . 1,868 parts In-Stock

1+ parts

$21.908

100+ parts

$21.032

1k+ parts

$20.155

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-

1,868

$21.908

$21.032

$20.155

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Continental Prestige Electronics

USA . 1,866 parts In-Stock

1+ parts

$26.531

100+ parts

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1k+ parts

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10k+ parts

$26.001

1,866

$26.531

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-

$26.001

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$35.858

100+ parts

$32.631

1k+ parts

$29.404

10k+ parts

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15

$35.858

$32.631

$29.404

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Microchip USA

USA . 1,780 parts In-Stock

1+ parts

$47.795

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1,780

$47.795

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Corohmni

South Africa . 46 parts In-Stock

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$53.966

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46

$53.966

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Aztec Data Supply Inc.

USA . 2,007 parts In-Stock

1+ parts

$74.610

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2,007

$74.610

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Argo Parts USA

USA . 4,365 parts In-Stock

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4,365

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$26.001

1k+ parts

$25.205

10k+ parts

$24.674

1,000

-

$26.001

$25.205

$24.674

Corphita

USA . 105 parts In-Stock

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105

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Overview

Experience the cutting-edge technology of the XE169FH200F100LABKXUMA1 microcontroller by Infineon Technologies. With a focus on quality and innovation, Infineon is a trusted manufacturer known for producing top-of-the-line components. This microcontroller is versatile and can be applied in various industries such as automotive, consumer electronics, and industrial automation. Offering a wide range of benefits including high performance, low power consumption, and reliable operation, the XE169FH200F100LABKXUMA1 is the perfect choice for customers looking for a superior solution to their microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power source requirements.

Address Bus Width: 24

Allows for a larger range of memory addressing, enabling complex operations and calculations.

Package Shape: SQUARE

A space-efficient shape that fits well in various electronic designs.

Bit Size: 16

A good balance between processing power and energy efficiency for many applications.

No. of Terminals: 176

Offers multiple connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions, ensuring consistent performance.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for reliable electrical connections.

ADC Channels: YES

Built-in analog-to-digital converters allow for interfacing with analog sensors and signals.

Maximum Seated Height: 1.6 mm

Low profile design enables compact and slim device form factors.

External Data Bus Width: 16

Efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

High clock speed for rapid processing of instructions and tasks.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Technology: CMOS

Complementary metal-oxide-semiconductor technology for low power consumption and high speed.

Nominal Supply Voltage: 3.3 V

Common voltage level suitable for many electronic devices and systems.

PWM Channels: YES

Pulse width modulation support for precise control of analog devices like motors or LEDs.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of firmware.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during storage and assembly processes.

Speed: 100 rpm

Operates at a moderate speed suitable for various real-time applications.

No. of I/O Lines: 147

Sufficient input/output lines for interfacing with a wide range of peripheral devices.

Technical Specifications

Microcontrollers XE169FH200F100LABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

147

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

XE169FH200F100LABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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