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XE167FH200F100LABFXUMA1

Infineon Technologies

XE167FH200F100LABFXUMA1 by Infineon Technologies

Infineon XE167FH200F100LABFXUMA1 is a 16-bit microcontroller with 24-bit address bus, operating at up to 40 MHz. Ideal for industrial applications, it features 115 I/O lines, PWM channels, and ADC support. With a wide temperature range (-40 to 85 °C) and low profile package style, it suits various embedded systems needs.

Median Price

$23.541

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$23.541

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50

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Vyrian

USA . 6,763 parts In-Stock

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Digiode

USA . 764 parts In-Stock

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764

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Chip Stock

USA . 265 parts In-Stock

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265

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Distributors (Availability)

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AZTECH Wire

Italy . 657 parts In-Stock

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$7.968

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$7.968

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Ampacity Inc.

Singapore . 968 parts In-Stock

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$8.000

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968

$8.000

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Aranea Global

USA . 2,000 parts In-Stock

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$23.071

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$22.148

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$23.071

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$22.148

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Continental Prestige Electronics

USA . 1,226 parts In-Stock

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$23.541

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$23.071

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Aztec Data Supply Inc.

USA . 3,791 parts In-Stock

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$23.630

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Semicontronic

India . 1,298 parts In-Stock

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$25.000

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$24.375

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$24.250

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Corohmni

South Africa . 68 parts In-Stock

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$42.179

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Microchip USA

USA . 1,329 parts In-Stock

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$51.628

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Modulus Dynamics

Lithuania . 2,249 parts In-Stock

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$60.803

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$58.371

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$55.939

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Argo Parts USA

USA . 1,581 parts In-Stock

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Eastek

USA . 500 parts In-Stock

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$28.050

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Infinite Electronics LLP (Excess)

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Corphita

USA . 385 parts In-Stock

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Overview

Unlock limitless possibilities with the XE167FH200F100LABFXUMA1 by Infineon Technologies. This microcontroller boasts top-notch quality and reliability, offering unparalleled performance for a wide range of applications. Whether you're working on automotive electronics, industrial automation, or consumer goods, this product delivers exceptional value with its advanced features and benefits. Trust in Infineon Technologies to provide cutting-edge solutions that elevate your projects to the next level. Discover the difference with the XE167FH200F100LABFXUMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of cost and durability, making the product affordable yet reliable.

Surface Mount: YES

Surface mount technology allows for easy integration onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility.

Address Bus Width: 24

A wider address bus allows for more memory addressing capability, making this microcontroller suitable for applications requiring extensive memory access.

Package Shape: SQUARE

The square package shape facilitates efficient use of space on a PCB, promoting compact and organized designs.

Bit Size: 16

The 16-bit architecture offers a good balance between performance and cost, making it suitable for a wide range of applications.

No. of Terminals: 144

A high number of terminals provide ample I/O capabilities, enabling connectivity with a variety of external devices and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with a low profile, making it ideal for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in battery-powered or low-power scenarios, increasing the product's versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions, expanding the range of applications this microcontroller can be used in.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, making the product suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection to the PCB, simplifying assembly processes.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim profile, making the microcontroller suitable for applications where space is limited.

Width: 20 mm

The compact width of the microcontroller enables it to be used in small form factor devices, increasing the product's applicability.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer, enhancing the microcontroller's performance in data-intensive applications.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency ensures fast processing speeds, making the microcontroller suitable for applications requiring real-time data processing.

Length: 20 mm

The compact length of the microcontroller enhances its versatility in applications where space is a constraint.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the microcontroller suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers high performance and efficiency, making it suitable for a wide range of applications requiring fast processing speeds.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure connections, enhancing the reliability of the microcontroller.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard voltage levels, making the microcontroller easy to integrate into existing systems.

PWM Channels: YES

The presence of PWM channels enables precise control of analog devices such as motors and LEDs, increasing the versatility of the microcontroller.

ROM Programmability: FLASH

The flash ROM programmability allows for easy firmware updates and reprogramming, enhancing the flexibility and longevity of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch provides high-density packaging, enabling more terminals in a smaller space and increasing the microcontroller's connectivity capabilities.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the microcontroller is suitable for reflow soldering processes, simplifying manufacturing and assembly.

Speed: 100 rpm

The high speed performance of the microcontroller makes it suitable for applications requiring fast data processing and response times.

No. of I/O Lines: 115

The high number of I/O lines allows for versatile connectivity options, enabling the microcontroller to interface with a wide variety of external devices and peripherals.

Technical Specifications

Microcontrollers XE167FH200F100LABFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XE167FH200F100LABFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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