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XE164F96F80LACFXUMA1

Infineon Technologies

XE164F96F80LACFXUMA1 by Infineon Technologies

Infineon XE164F96F80LACFXUMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at up to 40 MHz. Ideal for industrial applications, it features 73 I/O lines, Flash ROM programmability, and PWM channels for precise control in various systems.

Median Price

$15.516

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 59 parts In-Stock

1+ parts

$15.516

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59

$15.516

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Vyrian

USA . 1,936 parts In-Stock

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1,936

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Digiode

USA . 199 parts In-Stock

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199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 138 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

10k+ parts

-

138

$1.000

$0.975

$0.970

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AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$5.647

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372

$5.647

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Ampacity Inc.

Singapore . 1,530 parts In-Stock

1+ parts

$13.000

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1,530

$13.000

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Continental Prestige Electronics

USA . 4,523 parts In-Stock

1+ parts

$14.770

100+ parts

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10k+ parts

$14.475

4,523

$14.770

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$14.475

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$15.516

100+ parts

$15.206

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2,000

$15.516

$15.206

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Aztec Data Supply Inc.

USA . 1,122 parts In-Stock

1+ parts

$36.490

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1,122

$36.490

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Corohmni

South Africa . 181 parts In-Stock

1+ parts

$69.604

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181

$69.604

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Modulus Dynamics

Lithuania . 1,119 parts In-Stock

1+ parts

$72.707

100+ parts

$69.799

1k+ parts

$66.890

10k+ parts

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1,119

$72.707

$69.799

$66.890

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Component Stockers USA

USA . 566 parts In-Stock

1+ parts

$99.990

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566

$99.990

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Microchip USA

USA . 4,155 parts In-Stock

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4,155

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Argo Parts USA

USA . 1,296 parts In-Stock

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Corphita

USA . 938 parts In-Stock

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938

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Overview

Unlock new possibilities with the XE164F96F80LACFXUMA1 microcontroller by Infineon Technologies. Experience unparalleled quality and reliability from a trusted manufacturer in the industry. This versatile device is perfect for a wide range of applications, offering customers seamless integration and enhanced performance. Elevate your projects with the value, benefits, and advantages that only Infineon can deliver. Upgrade to the XE164F96F80LACFXUMA1 and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliability in various environments.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.6 V

Operates efficiently with a low maximum supply voltage, reducing power consumption and heat generation.

Address Bus Width: 24

Enables a large memory addressing capability, suitable for complex applications and data storage requirements.

Package Shape: SQUARE

Provides a compact form factor for easier integration into electronic designs.

Bit Size: 16

Offers a good balance between computational power and resource efficiency for various applications.

Power Supplies (V): 1.5,3.3/5

Supports multiple power supply options, increasing flexibility in system design and implementation.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.4 V

Allows for operation at low voltages, maximizing energy efficiency and extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments and extended use cases.

CPU Family: C166SV2

Comes from a trusted and established CPU family, ensuring compatibility with existing software and development tools.

ADC Channels: YES

Includes analog-to-digital conversion capabilities, enabling sensor interfacing and data acquisition in the system.

ROM Words: 786432

Provides a large ROM capacity for storing program instructions and data, supporting complex software requirements.

Maximum Seated Height: 1.6 mm

Offers a low-profile design for space-constrained applications, allowing for slim and compact product designs.

External Data Bus Width: 16

Enables efficient data transfer between the microcontroller and external memory or peripherals, improving overall system performance.

Maximum Clock Frequency: 40 MHz

Supports high-speed operation, enabling fast and responsive execution of tasks in real-time applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, offering integrated peripherals and features tailored for embedded system applications.

RAM Bytes: 65536

Provides a generous amount of RAM for storing temporary data and variables, supporting multitasking and data processing requirements.

Technology: CMOS

Utilizes CMOS technology for low power consumption, reducing heat dissipation and extending battery life in battery-powered devices.

PWM Channels: YES

Includes pulse-width modulation (PWM) capabilities for precise control of analog outputs, suitable for motor control and power regulation applications.

ROM Programmability: FLASH

Utilizes flash memory for program storage, allowing for easy reprogramming and updating of firmware in the field.

Technical Specifications

Microcontrollers XE164F96F80LACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XE164F96F80LACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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