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XE167FM72F80LRABKXUMA1

Infineon Technologies

XE167FM72F80LRABKXUMA1 by Infineon Technologies

Infineon XE167FM72F80LRABKXUMA1 microcontroller features 16-bit architecture, 40 MHz clock frequency, and 144 terminals. Ideal for automotive applications with a wide temperature range (-40 to 125 °C) and Flash ROM programmability. Offers 32768 bytes of RAM, ADC channels, and PWM channels for versatile functionality in automotive systems.

Median Price

$8.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 572 parts In-Stock

1+ parts

$8.830

100+ parts

$6.170

1k+ parts

$4.530

10k+ parts

-

572

$8.830

$6.170

$4.530

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$12.310

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870

$12.310

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Vyrian

USA . 3,233 parts In-Stock

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3,233

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Chip Stock

USA . 2,600 parts In-Stock

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2,600

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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1,000

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Digiode

USA . 201 parts In-Stock

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201

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Distributors (Availability)

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Semicontronic

India . 199 parts In-Stock

1+ parts

$7.510

100+ parts

$7.322

1k+ parts

$7.285

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199

$7.510

$7.322

$7.285

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Ampacity Inc.

Singapore . 185 parts In-Stock

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$7.510

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185

$7.510

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Modulus Dynamics

Lithuania . 2,087 parts In-Stock

1+ parts

$10.451

100+ parts

$10.033

1k+ parts

$9.615

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2,087

$10.451

$10.033

$9.615

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Corohmni

South Africa . 18 parts In-Stock

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$10.451

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18

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AZTECH Wire

Italy . 104 parts In-Stock

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$11.420

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104

$11.420

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Continental Prestige Electronics

USA . 2,510 parts In-Stock

1+ parts

$12.128

100+ parts

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$11.886

2,510

$12.128

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-

$11.886

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$12.310

100+ parts

$11.694

1k+ parts

-

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$10.956

10

$12.310

$11.694

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$10.956

Aztec Data Supply Inc.

USA . 252 parts In-Stock

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$24.171

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252

$24.171

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QUARKTWIN TECHNOLOGY LTD

USA . 24,922 parts In-Stock

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Microchip USA

USA . 3,434 parts In-Stock

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3,434

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Futuretech Components

Singapore . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,784 parts In-Stock

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1,784

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 830 parts In-Stock

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830

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Robosynatics

Brazil . 100 parts In-Stock

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$7.259

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$7.259

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$7.259

100

-

$7.259

$7.259

$7.259

Lucentia Tech

USA . 100 parts In-Stock

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$7.259

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$7.259

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$7.259

100

-

$7.259

$7.259

$7.259

Overview

Unleash the power of innovation with the XE167FM72F80LRABKXUMA1 microcontroller by Infineon Technologies. Designed with precision and expertise, this advanced device offers unmatched reliability and performance in a wide range of applications. Whether you're working on automotive electronics, industrial automation, or consumer electronics, this microcontroller delivers exceptional value and efficiency. Elevate your projects to new heights with the cutting-edge technology of Infineon. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily integrated into a variety of electronic devices, saving space and simplifying assembly.

Maximum Supply Voltage: 1.6 V

Operating at a maximum supply voltage of 1.6V ensures power efficiency and helps prevent damage to the microcontroller, making it a reliable choice for low-power applications.

Address Bus Width: 24

The wide address bus width of 24 allows for efficient data transfer and processing, enhancing the performance and speed of the microcontroller.

Package Shape: SQUARE

The square package shape provides a compact and uniform design, making it easier to integrate the microcontroller into different electronic systems.

Bit Size: 16

With a bit size of 16, this microcontroller offers optimal processing capabilities for a wide range of applications, ensuring efficient performance.

Power Supplies (V): 1.5,3.3/5

Supporting multiple power supply options (1.5V, 3.3V, 5V) offers versatility and compatibility with various electronic components, making it a versatile choice.

No. of Terminals: 144

The high number of terminals (144) provides ample connectivity options for external devices, enhancing the microcontroller's functionality and flexibility in system design.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design, ideal for applications where size and weight are critical factors.

Minimum Supply Voltage: 1.4 V

Operating at a minimum supply voltage of 1.4V ensures reliable performance even under low power conditions, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand harsh environmental conditions, ensuring reliable operation in various applications, even in automotive settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this microcontroller to function effectively in cold environments, making it suitable for a wide range of temperature conditions.

ADC Channels: YES

Featuring analog-to-digital converter channels, this microcontroller enables precise conversion of analog signals to digital data, enhancing its versatility in sensor-based applications.

Terminal Position: QUAD

The quad terminal position provides a standardized and easy-to-use interface for connecting external components, simplifying the integration process and ensuring compatibility.

ROM Words: 589824

With a large ROM capacity of 589824 words, this microcontroller can store a significant amount of program data, allowing for complex algorithms and applications to be implemented.

Width: 20 mm

The compact width of 20mm makes this microcontroller suitable for applications with space constraints, offering versatility in design and integration options.

External Data Bus Width: 16

The wide external data bus width of 16 enables efficient data transfer between the microcontroller and external devices, enhancing performance and speed in data processing.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40MHz enables fast processing and execution of instructions, enhancing the overall performance of the microcontroller.

Length: 20 mm

The length of 20mm provides a balanced form factor for this microcontroller, ensuring compatibility with a wide range of electronic devices and applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent temperature and reliability requirements of the automotive industry, making it a reliable choice for automotive systems.

RAM Bytes: 32768

With a substantial RAM capacity of 32768 bytes, this microcontroller can efficiently store and access data during program execution, improving performance and responsiveness.

Technology: CMOS

Operating on CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for a variety of applications.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure and reliable connections with external devices, enhancing the durability and longevity of the microcontroller.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5V provides stability and efficiency in power consumption, making this microcontroller ideal for low-power applications.

PWM Channels: YES

Featuring pulse-width modulation channels, this microcontroller can accurately control analog signals, enabling precise control of motors, LEDs, and other devices.

ROM Programmability: FLASH

Utilizing flash ROM programmability offers flexibility in programming and updating firmware, allowing for easy customization and reprogramming of the microcontroller.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers precise and compact terminal spacing, facilitating easy soldering and integration into circuit boards.

Moisture Sensitivity Level (MSL): 3

Rated at MSL 3, this microcontroller can withstand moderate exposure to moisture during handling and assembly, ensuring reliability in various environmental conditions.

Speed: 80 rpm

Operating at a speed of 80 rpm, this microcontroller can effectively process instructions and data, delivering efficient performance in a wide range of applications.

No. of I/O Lines: 119

With 119 I/O lines, this microcontroller offers ample connectivity options for input/output devices, enabling versatile and customizable system configurations.

Technical Specifications

Microcontrollers XE167FM72F80LRABKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

589824

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

XE167FM72F80LRABKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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