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XE164K96F66LACFXUMA1

Infineon Technologies

XE164K96F66LACFXUMA1 by Infineon Technologies

Infineon XE164K96F66LACFXUMA1 is a 16-bit microcontroller with 24-bit address bus, operating at up to 40 MHz. Ideal for industrial applications, it features 73 I/O lines, Flash ROM programmability, and PWM channels for precise control in compact designs.

Median Price

$12.252

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$10.890

1k+ parts

$9.740

10k+ parts

$9.170

2,800

-

$10.890

$9.740

$9.170

Verical

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$13.613

1k+ parts

$12.175

10k+ parts

$11.463

2,800

-

$13.613

$12.175

$11.463

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,629

-

-

-

-

Digiode

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

802

-

-

-

-

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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650

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,693 parts In-Stock

1+ parts

$10.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

$10.300

-

-

-

Semicontronic

India . 2,394 parts In-Stock

1+ parts

$10.300

100+ parts

$10.042

1k+ parts

$9.991

10k+ parts

-

2,394

$10.300

$10.042

$9.991

-

AZTECH Wire

Italy . 902 parts In-Stock

1+ parts

$14.360

100+ parts

-

1k+ parts

-

10k+ parts

-

902

$14.360

-

-

-

Microchip USA

USA . 1,962 parts In-Stock

1+ parts

$34.201

100+ parts

-

1k+ parts

-

10k+ parts

-

1,962

$34.201

-

-

-

Corohmni

South Africa . 921 parts In-Stock

1+ parts

$36.236

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$36.236

-

-

-

Modulus Dynamics

Lithuania . 2,463 parts In-Stock

1+ parts

$73.561

100+ parts

$70.619

1k+ parts

$67.676

10k+ parts

-

2,463

$73.561

$70.619

$67.676

-

Aztec Data Supply Inc.

USA . 2,354 parts In-Stock

1+ parts

$80.690

100+ parts

-

1k+ parts

-

10k+ parts

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2,354

$80.690

-

-

-

Component Stockers USA

USA . 736 parts In-Stock

1+ parts

$99.990

100+ parts

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736

$99.990

-

-

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Argo Parts USA

USA . 3,694 parts In-Stock

1+ parts

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100+ parts

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3,694

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Continental Prestige Electronics

USA . 2,829 parts In-Stock

1+ parts

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100+ parts

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2,829

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Corphita

USA . 600 parts In-Stock

1+ parts

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600

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

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10

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-

Overview

Discover the cutting-edge XE164K96F66LACFXUMA1 microcontroller by Infineon Technologies, a leader in innovative technology solutions. This high-quality product offers unmatched performance and reliability, making it perfect for a wide range of applications. With its advanced features and versatile design, this microcontroller provides exceptional value and benefits to customers looking for top-notch functionality and efficiency. Upgrade your projects with the XE164K96F66LACFXUMA1 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 1.6 V

Suitable for low power applications, making it energy-efficient.

Address Bus Width: 24

Allows for larger memory addressability, enabling more complex applications.

Bit Size: 16

Offers a good balance between performance and complexity for various tasks.

Power Supplies (V): 1.5,3.3/5

Versatile in power requirements, compatible with different power sources.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers flexibility in packaging options for different design requirements.

Minimum Supply Voltage: 1.4 V

Can operate effectively even with low power input, extending usage possibilities.

Maximum Operating Temperature: 85 °C

Suitable for industrial use where higher temperatures may be encountered.

CPU Family: C166SV2

Part of a reliable and established CPU family known for performance and stability.

Minimum Operating Temperature: -40 °C

Designed to operate efficiently in cold environments, ensuring reliability in various conditions.

Terminal Finish: MATTE TIN

Provides corrosion resistance and good conductivity for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling interfacing with a wide range of sensors and inputs.

Terminal Position: QUAD

Facilitates easy connection and integration into circuit layouts.

ROM Words: 786432

Offers ample memory for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Compact design suitable for space-constrained applications.

Width: 14 mm

Compact size for easy integration into various electronic devices.

External Data Bus Width: 16

Allows for efficient data transfer and processing capabilities.

Maximum Clock Frequency: 40 MHz

Offers high-speed processing capabilities for demanding applications.

Length: 14 mm

Compact form factor for versatile placement within electronic designs.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimized performance.

RAM Bytes: 65536

Sufficient RAM capacity for storing and processing data in various applications.

Technology: CMOS

Utilizes energy-efficient CMOS technology for low power consumption.

Terminal Form: GULL WING

Facilitates easy soldering and installation on circuit boards.

Nominal Supply Voltage: 1.5 V

Stable supply voltage for consistent performance in different operating conditions.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of outputs and motor control applications.

ROM Programmability: FLASH

Allows for reprogrammability of ROM memory, enabling flexibility in software updates.

Terminal Pitch: 0.5 mm

Fine pitch for compact design and efficient use of circuit board space.

Moisture Sensitivity Level (MSL): 3

Ensures proper handling and storage to prevent moisture-related damage during assembly and operation.

Speed: 66 rpm

Capable of processing data at high speeds for real-time applications and responsive performance.

No. of I/O Lines: 73

Offers a good balance between input/output capabilities for interfacing with external devices.

Technical Specifications

Microcontrollers XE164K96F66LACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XE164K96F66LACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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