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XE167F96F80LACFXUMA1

Infineon Technologies

XE167F96F80LACFXUMA1 by Infineon Technologies

Infineon XE167F96F80LACFXUMA1 is a 16-bit microcontroller with 40 MHz clock frequency, 24-bit address bus width, and 115 I/O lines. It is used in industrial applications due to its CMOS technology, FLASH ROM programmability, and PWM channels for precise control.

Median Price

$13.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,279 parts In-Stock

1+ parts

$9.580

100+ parts

$7.010

1k+ parts

$5.570

10k+ parts

-

1,279

$9.580

$7.010

$5.570

-

Element14

Singapore . 1,279 parts In-Stock

1+ parts

$17.620

100+ parts

$13.680

1k+ parts

$11.160

10k+ parts

-

1,279

$17.620

$13.680

$11.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$15.430

100+ parts

-

1k+ parts

-

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60

$15.430

-

-

-

Vyrian

USA . 8,881 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,881

-

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-

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Digiode

USA . 782 parts In-Stock

1+ parts

-

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782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 944 parts In-Stock

1+ parts

$8.140

100+ parts

-

1k+ parts

-

10k+ parts

-

944

$8.140

-

-

-

Semicontronic

India . 899 parts In-Stock

1+ parts

$8.140

100+ parts

$7.936

1k+ parts

$7.896

10k+ parts

-

899

$8.140

$7.936

$7.896

-

Continental Prestige Electronics

USA . 3,577 parts In-Stock

1+ parts

$14.831

100+ parts

-

1k+ parts

-

10k+ parts

$14.534

3,577

$14.831

-

-

$14.534

Modulus Dynamics

Lithuania . 4,220 parts In-Stock

1+ parts

$16.842

100+ parts

$16.168

1k+ parts

$15.495

10k+ parts

-

4,220

$16.842

$16.168

$15.495

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$19.289

100+ parts

$17.553

1k+ parts

$15.817

10k+ parts

-

5,000

$19.289

$17.553

$15.817

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Microchip USA

USA . 190 parts In-Stock

1+ parts

$34.209

100+ parts

-

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-

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190

$34.209

-

-

-

Corohmni

South Africa . 259 parts In-Stock

1+ parts

$73.444

100+ parts

-

1k+ parts

-

10k+ parts

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259

$73.444

-

-

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Aztec Data Supply Inc.

USA . 4,303 parts In-Stock

1+ parts

$73.820

100+ parts

-

1k+ parts

-

10k+ parts

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4,303

$73.820

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

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-

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Lixinc

USA . 2,931 parts In-Stock

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2,931

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Argo Parts USA

USA . 2,075 parts In-Stock

1+ parts

-

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2,075

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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RC Electronics

USA . 1,024 parts In-Stock

1+ parts

-

100+ parts

$13.550

1k+ parts

$12.360

10k+ parts

$11.990

1,024

-

$13.550

$12.360

$11.990

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$15.121

1k+ parts

$14.659

10k+ parts

$14.350

1,000

-

$15.121

$14.659

$14.350

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

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900

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-

-

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Corphita

USA . 570 parts In-Stock

1+ parts

-

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570

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-

-

Overview

Unlock the power of cutting-edge technology with the XE167F96F80LACFXUMA1 microcontroller by Infineon Technologies. Trusted for their superior quality and reliability, Infineon delivers a product that exceeds expectations in various applications. Experience seamless performance and efficiency with this versatile microcontroller, offering customers unparalleled value and benefits. Stay ahead of the curve and elevate your projects with the XE167F96F80LACFXUMA1.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring the product is rugged and long-lasting.

Surface Mount : YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage : 1.6 V

With a maximum supply voltage of 1.6 V, this microcontroller is energy-efficient and helps in reducing power consumption.

Address Bus Width : 24

A wider address bus width of 24 allows for efficient memory addressing and data retrieval, improving overall performance.

Package Shape : SQUARE

The square package shape makes it easier to mount and secure the microcontroller on a circuit board, ensuring stability and reliability in operation.

Bit Size : 16

A bit size of 16 offers a good balance between complexity and efficiency, allowing for versatile applications and high-speed processing.

No. of Terminals : 144

Having 144 terminals provides ample connectivity options for various input and output devices, enabling versatile and flexible usage.

Package Style : FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The multiple package styles offer flexibility in design and integration, allowing for efficient heat dissipation and compact space utilization.

Minimum Supply Voltage : 1.4 V

A low minimum supply voltage of 1.4 V ensures compatibility with low-power applications while maintaining stable operation.

Maximum Operating Temperature : 85 °C

The high maximum operating temperature of 85°C allows the microcontroller to withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature : -40 °C

The low minimum operating temperature of -40°C enables the microcontroller to function effectively in extreme cold environments without compromising performance.

Terminal Finish : TIN

The TIN terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels : YES

Having ADC channels allows the microcontroller to accurately convert analog signals to digital data, making it suitable for applications requiring sensor interfacing.

Terminal Position : QUAD

The quad terminal position enhances stability and connectivity, ensuring secure mounting and efficient signal transmission within the circuit.

Maximum Seated Height : 1.6 mm

The low maximum seated height of 1.6 mm enables compact and slim device designs, facilitating space-saving and sleek product aesthetics.

Width : 20 mm

With a width of 20 mm, the microcontroller can be easily integrated into various electronic devices while ensuring efficient utilization of available space.

External Data Bus Width : 16

An external data bus width of 16 allows for fast data transfer between the microcontroller and external memory, enhancing overall speed and performance.

Maximum Clock Frequency : 40 MHz

Operating at a maximum clock frequency of 40 MHz, the microcontroller can execute instructions quickly and efficiently, suitable for high-speed applications.

Length : 20 mm

With a length of 20 mm, the microcontroller can fit well within compact devices, ensuring seamless integration and optimal space management.

Temperature Grade : INDUSTRIAL

Being industrial-grade means the microcontroller is designed to withstand rugged conditions and operate reliably in harsh industrial environments, making it a robust choice for industrial applications.

Peripheral IC Type : MICROCONTROLLER, RISC

Having a RISC-based microcontroller offers high performance and efficiency in processing instructions, making it ideal for real-time control applications.

Technology : CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in data processing.

Terminal Form : GULL WING

Gull wing terminal form facilitates easy soldering and secure mounting, ensuring robust electrical connections and stable performance.

Nominal Supply Voltage : 1.5 V

With a nominal supply voltage of 1.5 V, the microcontroller operates efficiently while maintaining stability, suitable for a wide range of low-power applications.

PWM Channels : YES

Having PWM channels allows for precise control of analog devices, enabling the microcontroller to generate accurate pulse-width modulation signals for various applications.

ROM Programmability : FLASH

The flash ROM programmability allows for easy and quick firmware updates, enhancing flexibility and adaptability to changing requirements in the field.

Terminal Pitch : 0.5 mm

A terminal pitch of 0.5 mm provides high-density connections and precise alignment, enabling efficient soldering and secure mounting on the PCB.

Moisture Sensitivity Level (MSL) : 3

Having a moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and operation, ensuring reliability in various environments.

Speed : 80 rpm

With a speed of 80 rpm, the microcontroller can process instructions and data quickly, making it suitable for applications requiring fast response times and high throughput.

No. of I/O Lines : 115

Having 115 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers XE167F96F80LACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XE167F96F80LACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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