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XE164F24F66LACFXUMA1

Infineon Technologies

XE164F24F66LACFXUMA1 by Infineon Technologies

Infineon XE164F24F66LACFXUMA1 is a 16-bit microcontroller with 24-bit address bus, operating at max 40MHz. Ideal for industrial applications, it features 73 I/O lines, Flash ROM programmability, and ADC channels for precise data acquisition.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 10,809 parts In-Stock

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Digiode

USA . 942 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 735 parts In-Stock

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$5.034

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735

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Modulus Dynamics

Lithuania . 3,779 parts In-Stock

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$19.837

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$19.044

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$18.250

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Ampacity Inc.

Singapore . 264 parts In-Stock

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$23.000

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Microchip USA

USA . 3,744 parts In-Stock

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Continental Prestige Electronics

USA . 1,239 parts In-Stock

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Perfect Parts

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Corphita

USA . 965 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Argo Parts USA

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Overview

Unleash the power of technology with the XE164F24F66LACFXUMA1 from Infineon Technologies. This top-of-the-line microcontroller boasts unparalleled quality and reliability, making it a standout choice for a wide range of applications. With its advanced features and cutting-edge design, this product offers customers unmatched value, efficiency, and performance. Elevate your projects to the next level with the XE164F24F66LACFXUMA1 and experience the benefits of superior engineering and innovation firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 24

A wider address bus allows for larger memory addressing capabilities, enabling complex applications and computations.

Package Shape: SQUARE

The square package shape provides efficient use of space on the PCB, making it easier to design compact and tidy electronic systems.

Bit Size: 16

A 16-bit architecture offers a good balance between performance and cost, suitable for a wide range of applications.

Power Supplies (V): 1.5,3.3/5

Support for multiple power supply voltages allows flexibility in design and integration with other components operating at different voltage levels.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for peripherals and external devices, making the microcontroller versatile and adaptable.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The variety of package styles offer different mounting options and thermal management solutions, catering to diverse design requirements.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller is suitable for industrial environments where heat can be a concern.

CPU Family: C166SV2

Being part of the C166SV2 family, this microcontroller benefits from a proven and reliable processor architecture with good performance capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in harsh environments with extreme temperatures, enhancing its durability and reliability.

ADC Channels: YES

Built-in ADC channels enable analog sensor interfacing, making the microcontroller suitable for applications requiring analog inputs.

Terminal Position: QUAD

The quad terminal position offers easy and organized connectivity, simplifying the PCB layout and assembly process.

ROM Words: 196608

A large ROM capacity allows for extensive program storage, accommodating complex algorithms and applications without running out of memory space.

Width: 14 mm

The compact width dimension enables space-efficient PCB design, ideal for applications with size constraints.

External Data Bus Width: 16

A wide external data bus width facilitates fast data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for speedy real-time processing and execution of instructions, enhancing the microcontroller's performance capabilities.

Length: 14 mm

With a small length dimension, this microcontroller can fit in compact electronic devices without compromising on functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operations, this microcontroller can withstand harsh conditions and demanding work environments.

RAM Bytes: 10240

A generous amount of RAM provides sufficient memory space for data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process during assembly, ensuring secure and reliable connections for enhanced durability.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage provides stable and consistent power delivery, ensuring reliable operation of the microcontroller under various operating conditions.

PWM Channels: YES

Support for PWM channels allows precise control of motor speed, LED brightness, and other analog outputs, enabling efficient energy management and control in applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast reprogramming of the microcontroller's memory, facilitating firmware updates and modifications during product development.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting, optimizing PCB space usage and enabling compact design solutions for electronic systems.

Speed: 66 rpm

With a high speed rating, this microcontroller can process instructions and data quickly, ensuring efficient operation and responsiveness in real-time applications.

No. of I/O Lines: 73

Having a large number of I/O lines provides ample connectivity options for interfacing with peripherals and external devices, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers XE164F24F66LACFXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

196608

ROM Programmability:

FLASH

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

XE164F24F66LACFXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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