Loading...

XE167F72F66LACFXQMA1

Infineon Technologies

XE167F72F66LACFXQMA1 by Infineon Technologies

Infineon XE167F72F66LACFXQMA1 is a 16-bit microcontroller with 24-bit address bus width, operating at max 40 MHz. Ideal for industrial applications, it features 24 ADC channels, 32768 bytes of RAM, and connectivity options like CAN, I2C, SPI. With flash ROM programmability and PWM channels, it offers versatile performance in compact form factor.

Median Price

$8.599

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.599

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$8.599

-

-

-

Vyrian

USA . 6,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,452

-

-

-

-

Digiode

USA . 417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

417

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,559 parts In-Stock

1+ parts

$8.599

100+ parts

-

1k+ parts

-

10k+ parts

$8.427

5,559

$8.599

-

-

$8.427

Netroflash

USA . 500 parts In-Stock

1+ parts

$8.599

100+ parts

-

1k+ parts

$8.169

10k+ parts

$7.997

500

$8.599

-

$8.169

$7.997

Aztec Data Supply Inc.

USA . 6,413 parts In-Stock

1+ parts

$17.750

100+ parts

-

1k+ parts

-

10k+ parts

-

6,413

$17.750

-

-

-

AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$17.767

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$17.767

-

-

-

Ampacity Inc.

Singapore . 476 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$22.000

-

-

-

Semicontronic

India . 784 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

784

$34.000

$33.150

$32.980

-

Corohmni

South Africa . 264 parts In-Stock

1+ parts

$40.596

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$40.596

-

-

-

Microchip USA

USA . 2,898 parts In-Stock

1+ parts

$45.353

100+ parts

-

1k+ parts

-

10k+ parts

-

2,898

$45.353

-

-

-

Modulus Dynamics

Lithuania . 4,129 parts In-Stock

1+ parts

$57.300

100+ parts

$55.008

1k+ parts

$52.716

10k+ parts

-

4,129

$57.300

$55.008

$52.716

-

Argo Parts USA

USA . 2,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,792

-

-

-

-

Corphita

USA . 311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

311

-

-

-

-

Overview

Unlock the power of innovation with the XE167F72F66LACFXQMA1 microcontroller by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability. This versatile microcontroller offers a wide range of applications, from automotive to industrial sectors. With advanced features like PWM channels, ADC channels, and connectivity options like CAN, LIN, and SPI, this product provides unparalleled value and performance. Experience seamless integration and efficiency with the XE167F72F66LACFXQMA1, designed to meet all your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.6 V

With a high maximum supply voltage, this microcontroller can handle power fluctuations without risking damage, ensuring stable operation.

Address Bus Width: 24

The wide address bus width allows for efficient memory addressing, enhancing the performance and speed of the microcontroller.

Package Shape: SQUARE

The square package shape helps with space-saving integration into electronic designs, making it an ideal choice for compact devices.

Bit Size: 16

The 16-bit size enhances the processing capabilities of the microcontroller, enabling it to handle complex tasks quickly and efficiently.

No. of Terminals: 144

The large number of terminals provides ample connectivity options for external devices, expanding the functionality of the microcontroller.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles offer flexibility in design and installation, catering to different project requirements.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage ensures energy efficiency and reliable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the microcontroller to withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers XE167F72F66LACFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

115

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

32768

ROM Words:

589824

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(5), I2C, I2S, LIN, RS-232, SPI, USIC(6)

Peripherals:

POR, RTC, TIMER(11), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

XE167F72F66LACFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19