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XE164G96F66LACFXQMA1

Infineon Technologies

XE164G96F66LACFXQMA1 by Infineon Technologies

Infineon XE164G96F66LACFXQMA1 is a 16-bit microcontroller with 24-bit address bus, operating at up to 40 MHz. Ideal for industrial applications, it features 73 I/O lines, Flash ROM programmability, and PWM channels for precise control in compact designs.

Median Price

$13.466

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

$11.970

1k+ parts

$10.710

10k+ parts

$10.080

1,447

-

$11.970

$10.710

$10.080

Verical

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

$14.963

1k+ parts

$13.387

10k+ parts

$12.600

1,447

-

$14.963

$13.387

$12.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 920 parts In-Stock

1+ parts

$12.664

100+ parts

-

1k+ parts

-

10k+ parts

-

920

$12.664

-

-

-

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$16.663

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$16.663

-

-

-

Vyrian

USA . 7,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,599

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,316 parts In-Stock

1+ parts

$11.330

100+ parts

$11.047

1k+ parts

$10.990

10k+ parts

-

1,316

$11.330

$11.047

$10.990

-

Ampacity Inc.

Singapore . 1,201 parts In-Stock

1+ parts

$11.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$11.330

-

-

-

Corphita

USA . 894 parts In-Stock

1+ parts

$11.997

100+ parts

-

1k+ parts

-

10k+ parts

-

894

$11.997

-

-

-

Continental Prestige Electronics

USA . 4,702 parts In-Stock

1+ parts

$16.663

100+ parts

-

1k+ parts

-

10k+ parts

$16.330

4,702

$16.663

-

-

$16.330

Netroflash

USA . 500 parts In-Stock

1+ parts

$16.663

100+ parts

$16.330

1k+ parts

-

10k+ parts

-

500

$16.663

$16.330

-

-

AZTECH Wire

Italy . 965 parts In-Stock

1+ parts

$20.550

100+ parts

-

1k+ parts

-

10k+ parts

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965

$20.550

-

-

-

Microchip USA

USA . 935 parts In-Stock

1+ parts

$40.913

100+ parts

-

1k+ parts

-

10k+ parts

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935

$40.913

-

-

-

Modulus Dynamics

Lithuania . 334 parts In-Stock

1+ parts

$42.156

100+ parts

$40.470

1k+ parts

$38.784

10k+ parts

-

334

$42.156

$40.470

$38.784

-

Component Stockers USA

USA . 435 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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435

$99.990

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Argo Parts USA

USA . 4,104 parts In-Stock

1+ parts

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4,104

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Overview

Elevate your projects with the XE164G96F66LACFXQMA1 microcontroller by Infineon Technologies, setting a new standard in quality and reliability. Designed to deliver outstanding performance, this device offers a wide range of applications for various industries, from automotive to industrial automation. With Infineon's trusted reputation as a leading manufacturer, you can trust that you are getting a product that is built to last. Experience the value and benefits of seamless integration, advanced features, and unparalleled performance with the XE164G96F66LACFXQMA1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the microcontroller, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and enabling mass production.

Maximum Supply Voltage: 1.6 V

Operates within a safe voltage range, reducing the risk of damage to the microcontroller.

Address Bus Width: 24

Enables the microcontroller to access a large memory space, improving performance in data-intensive applications.

Bit Size: 16

Provides a good balance between processing power and energy efficiency for various applications.

Power Supplies (V): 1.5,3.3/5

Offers flexibility in power options, allowing for compatibility with different voltage requirements in electronic systems.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers a variety of package styles to suit different design and mounting requirements.

Minimum Supply Voltage: 1.4 V

Ensures stable operation even at lower voltage levels, enhancing energy efficiency in battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for industrial applications.

CPU Family: C166SV2

Belongs to a reliable and established CPU family, ensuring compatibility and support for software development.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding the range of operating environments.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad-terminal arrangement allows for efficient routing and organization of connections on the microcontroller.

ROM Words: 786432

Large ROM size accommodates extensive program storage, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design facilitates compact PCB layout and integration into space-constrained devices.

Width: 14 mm

Compact width size enables a smaller footprint on the PCB, optimizing board space usage.

External Data Bus Width: 16

Wider data bus allows for faster data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 40 MHz

High clock frequency enhances processing speed, suitable for real-time applications and rapid data processing.

Length: 14 mm

Compact length size ensures efficient use of board space while still accommodating necessary features.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

Dedicated as a microcontroller, offering specialized features and functionality tailored for embedded systems.

RAM Bytes: 65536

Generous RAM capacity allows for efficient data storage and processing, supporting multitasking and complex computations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, ensuring secure and robust connections.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliability in various operating conditions.

PWM Channels: YES

Integrated Pulse Width Modulation channels enable precise control of analog outputs, suitable for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM allows for convenient and programmable storage of firmware and data, facilitating updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting, reducing PCB size and component spacing for compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level indicates the withstand ability to moisture during storage and reflow soldering processes.

Speed: 66 rpm

66 rotations per minute speed ensures efficient processing and execution of instructions, suitable for real-time applications.

No. of I/O Lines: 73

Abundance of I/O lines allows for versatile input/output configurations, supporting a wide range of external connections and peripherals.

Technical Specifications

Microcontrollers XE164G96F66LACFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

C166SV2

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

73

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.5,3.3/5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XE164G96F66LACFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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