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XE167F96F66LACFXQMA1

Infineon Technologies

XE167F96F66LACFXQMA1 by Infineon Technologies

Infineon XE167F96F66LACFXQMA1 is a 16-bit microcontroller with 40 MHz clock frequency, 24-bit address bus width, and 5.5V max supply voltage. Ideal for applications requiring high-speed processing and precision control in automotive electronics, industrial automation, and power management systems.

Median Price

$14.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$14.900

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150

$14.900

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Vyrian

USA . 8,987 parts In-Stock

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8,987

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Digiode

USA . 255 parts In-Stock

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255

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Distributors (Availability)

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AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$7.763

100+ parts

-

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812

$7.763

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Continental Prestige Electronics

USA . 3,123 parts In-Stock

1+ parts

$14.233

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10k+ parts

$13.948

3,123

$14.233

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-

$13.948

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.900

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2,000

$14.900

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Ampacity Inc.

Singapore . 1,318 parts In-Stock

1+ parts

$20.000

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1,318

$20.000

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Semicontronic

India . 1,057 parts In-Stock

1+ parts

$30.000

100+ parts

$29.250

1k+ parts

$29.100

10k+ parts

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1,057

$30.000

$29.250

$29.100

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$31.932

100+ parts

$30.335

1k+ parts

$30.335

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3,000

$31.932

$30.335

$30.335

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Corohmni

South Africa . 182 parts In-Stock

1+ parts

$38.910

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182

$38.910

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Aztec Data Supply Inc.

USA . 786 parts In-Stock

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$57.990

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786

$57.990

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Modulus Dynamics

Lithuania . 1,219 parts In-Stock

1+ parts

$83.197

100+ parts

$79.869

1k+ parts

$76.541

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1,219

$83.197

$79.869

$76.541

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Argo Parts USA

USA . 2,927 parts In-Stock

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2,927

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Robosynatics

Brazil . 2,130 parts In-Stock

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$61.081

1k+ parts

$59.835

10k+ parts

$59.835

2,130

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$61.081

$59.835

$59.835

Lucentia Tech

USA . 2,130 parts In-Stock

1+ parts

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100+ parts

$61.081

1k+ parts

$59.835

10k+ parts

$59.835

2,130

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$61.081

$59.835

$59.835

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 538 parts In-Stock

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538

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Perfect Parts

USA . 510 parts In-Stock

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510

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Overview

Unlock the potential of your electronic projects with the XE167F96F66LACFXQMA1 microcontroller from Infineon Technologies. Known for their top-quality products, Infineon brings you a powerful device that offers seamless integration, high performance, and reliable operation. Ideal for a wide range of applications, this microcontroller boasts advanced features and capabilities that will take your projects to the next level. Say goodbye to limitations and hello to endless possibilities with the XE167F96F66LACFXQMA1 - the perfect choice for those who demand excellence in their designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mounting allows for easy PCB assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

Capable of operating at a higher voltage range, providing flexibility in power supply options.

Address Bus Width: 24

Wide address bus width allows for access to a large memory space, essential for complex applications.

Package Shape: SQUARE

Square package shape ensures uniformity in design and compatibility with standard PCB layouts.

Bit Size: 16

16-bit architecture allows for efficient processing of data and instructions.

No. of Terminals: 144

Abundance of terminals provide ample I/O options for connecting peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles offer versatility in integration and compatibility with various assemblies.

Minimum Supply Voltage: 3 V

Ability to operate at low supply voltages results in energy efficiency and extended battery life.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, suitable for a wide range of sensor inputs.

Terminal Position: QUAD

Quad terminal position allows for stable connectivity and efficient heat dissipation.

Width: 20 mm

Compact width facilitates space-saving designs and flexibility in layout arrangements.

External Data Bus Width: 16

16-bit external data bus ensures rapid data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast and efficient processing of instructions, improving overall performance.

Length: 20 mm

Symmetrical length complements the square package shape for uniformity in the overall design.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers enhanced performance and power efficiency for embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and compatibility with various voltage levels.

Terminal Form: GULL WING

Gull wing terminal form ensures reliable solder connections and easy PCB mounting.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

PWM channels allow for precise control of pulse-width modulation signals, essential for motor and power control applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch provides increased connectivity density and compatibility with advanced PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates resistance to moisture-related damage, ensuring reliability in various operating conditions.

Speed: 100 rpm

High rotational speed capabilities make this microcontroller suitable for applications requiring fast data processing.

No. of I/O Lines: 115

Abundance of I/O lines provides ample interface options for connecting peripherals and external devices.

Technical Specifications

Microcontrollers XE167F96F66LACFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

115

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

100 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XE167F96F66LACFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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