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IPB65R380C6ATMA1

Infineon Technologies

IPB65R380C6ATMA1 by Infineon Technologies

IPB65R380C6ATMA1 by Infineon Technologies is a N-CHANNEL power FET with a min DS breakdown voltage of 650V. It is designed for switching applications, offering a max pulsed drain current of 29A and a max drain-source on resistance of 0.38 ohm.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,603 parts In-Stock

1+ parts

-

100+ parts

$1.080

1k+ parts

$0.896

10k+ parts

$0.799

15,603

-

$1.080

$0.896

$0.799

Verical

USA . 12,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.121

10k+ parts

$0.999

12,340

-

-

$1.121

$0.999

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.825

-

-

-

Digiode

USA . 190 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$0.845

-

-

-

Vyrian

USA . 8,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,842

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,926 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

15,926

$0.760

-

-

-

Corphita

USA . 651 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$0.800

-

-

-

Continental Prestige Electronics

USA . 6,249 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

$0.809

6,249

$0.825

-

-

$0.809

Argo Parts USA

USA . 3,840 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

-

3,840

$0.825

-

-

-

Component Stockers USA

USA . 9,825 parts In-Stock

1+ parts

$0.900

100+ parts

$0.850

1k+ parts

$0.770

10k+ parts

$0.770

9,825

$0.900

$0.850

$0.770

$0.770

Modulus Dynamics

Lithuania . 10,473 parts In-Stock

1+ parts

$1.926

100+ parts

$1.849

1k+ parts

$1.772

10k+ parts

-

10,473

$1.926

$1.849

$1.772

-

Microchip USA

USA . 282 parts In-Stock

1+ parts

$5.525

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$5.525

-

-

-

AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$12.150

100+ parts

-

1k+ parts

-

10k+ parts

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141

$12.150

-

-

-

Perfect Parts

USA . 23,415 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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23,415

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.809

1k+ parts

$0.784

10k+ parts

$0.767

50

-

$0.809

$0.784

$0.767

Overview

Discover the power and reliability of the IPB65R380C6ATMA1 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers exceptional quality and performance. This Power Field Effect Transistor (FET) is perfect for switching applications, offering seamless operation and enhanced efficiency. With a minimum DS Breakdown Voltage of 650V and a Maximum Pulsed Drain Current of 29A, this transistor can handle even the toughest tasks. Its small outline package and single terminal position make it easy to integrate into any system. Trust Infineon for superior technology that exceeds your expectations. Unlock the potential of your project with the IPB65R380C6ATMA1!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the FET, ensuring reliable performance in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them ideal for applications requiring efficiency and speed.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the FET from voltage spikes and reverse currents, increasing the robustness of the design.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of current in electronic circuits with minimal power loss.

Surface Mount: YES

Being surface mountable, this FET is easy to integrate into PCB designs, saving space and improving assembly efficiency.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows this FET to handle high voltage applications and provides an extra margin of safety in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to mount the FET onto a PCB, ensuring proper alignment and facilitating efficient heat dissipation.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and provides mechanical stability, enhancing overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control over the current flow, making them suitable for a wide range of switching applications.

Maximum Pulsed Drain Current (IDM): 29 A

The high pulsed current rating allows this FET to handle peak loads and transient conditions without compromising performance.

Avalanche Energy Rating (EAS): 215 mJ

The high avalanche energy rating indicates the robustness of the FET against voltage spikes and transient events, ensuring reliable operation in challenging environments.

No. of Terminals: 2

With only 2 terminals, this FET offers a simple and straightforward connection, reducing the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps to save space on the PCB, making it ideal for compact electronic devices with limited board real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, allowing this FET to operate at optimal levels in various electronic circuits.

Transistor Element Material: SILICON

Silicon-based FETs are known for their high performance and reliability, ensuring long-term operation in critical applications.

Terminal Finish: TIN

The tin terminal finish provides excellent solderability and corrosion resistance, maintaining electrical conductivity over the FET's lifespan.

Maximum Drain Current (ID): 10.6 A

The high drain current rating allows this FET to handle significant loads and power levels, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.38 ohm

The low ON-resistance helps to minimize power loss and heat generation in the FET, improving overall efficiency and performance.

Terminal Position: SINGLE

With a single terminal position, this FET simplifies the connection process, making it easy to integrate into electronic circuits.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and provides a common reference point for the FET's operation, enhancing overall system reliability.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R380C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

10.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

29 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R380C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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