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IPB60R160C6ATMA1

Infineon Technologies

IPB60R160C6ATMA1 by Infineon Technologies

Infineon's IPB60R160C6ATMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 70A IDM, 0.16 ohm RDS(on), and 497mJ EAS rating. Its small outline package and GULL WING terminals make it suitable for surface mount designs in high-power systems.

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,595 parts In-Stock

1+ parts

$4.240

100+ parts

$1.968

1k+ parts

$1.504

10k+ parts

$1.464

1,595

$4.240

$1.968

$1.504

$1.464

Chip1Stop

Japan . 445 parts In-Stock

1+ parts

$6.640

100+ parts

$3.460

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445

$6.640

$3.460

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Verical

USA . 13,000 parts In-Stock

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$1.693

10k+ parts

$1.607

13,000

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-

$1.693

$1.607

Distributors (In-Stock)

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Nova Conductors

Japan . 87 parts In-Stock

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$3.140

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87

$3.140

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Digiode

USA . 179 parts In-Stock

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$4.275

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179

$4.275

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Chip Stock

USA . 21,000 parts In-Stock

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Vyrian

USA . 799 parts In-Stock

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799

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Bristol Electronics

USA . 53 parts In-Stock

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53

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Distributors (Availability)

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Ampacity Inc.

Singapore . 831 parts In-Stock

1+ parts

$1.520

100+ parts

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831

$1.520

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Argo Parts USA

USA . 2,474 parts In-Stock

1+ parts

$3.140

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2,474

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Netroflash

USA . 100 parts In-Stock

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$3.140

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100

$3.140

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Continental Prestige Electronics

USA . 22 parts In-Stock

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$3.140

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$3.077

22

$3.140

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$3.077

Modulus Dynamics

Lithuania . 10,415 parts In-Stock

1+ parts

$3.231

100+ parts

$3.102

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$2.973

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10,415

$3.231

$3.102

$2.973

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Component Stockers USA

USA . 3,070 parts In-Stock

1+ parts

$3.850

100+ parts

$2.620

1k+ parts

$1.990

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3,070

$3.850

$2.620

$1.990

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Corphita

USA . 72 parts In-Stock

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$4.050

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$4.050

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Benley Electronics

USA . 8 parts In-Stock

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$5.000

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Microchip USA

USA . 8,608 parts In-Stock

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RC Electronics

USA . 8,126 parts In-Stock

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$3.170

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$2.900

10k+ parts

$2.810

8,126

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$3.170

$2.900

$2.810

QUARKTWIN TECHNOLOGY LTD

USA . 4,662 parts In-Stock

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4,662

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Perfect Parts

USA . 1,120 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

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Formix International (Excess)

India . 650 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 445 parts In-Stock

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445

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Overview

Unlock the power of cutting-edge technology with the IPB60R160C6ATMA1 by Infineon Technologies. As a leading manufacturer in the field of Power Field Effect Transistors, Infineon delivers top-quality products that are designed for maximum performance and efficiency. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Experience the benefits of enhanced mode operation, high breakdown voltage, and low on-resistance, all packaged in a convenient small outline style. Trust Infineon to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight housing for the FET, making it ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, making them suitable for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and reduces reverse recovery time, improving overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in controlling power flow.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage loads without risk of damage or breakdown.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, perfect for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminals offer secure soldering connections for reliable electrical contact.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and have lower ON resistance, improving overall performance and efficiency.

Maximum Pulsed Drain Current (IDM): 70 A

With a high pulsed drain current rating, this FET can handle short-term surges in power without overheating.

Avalanche Energy Rating (EAS): 497 mJ

This FET can withstand high-energy spikes, making it suitable for protection circuits in high-power applications.

No. of Terminals: 2

The two-terminal design simplifies installation and ensures proper connection for efficient power transmission.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for high component density in systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency and low power consumption, making this FET energy-efficient.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand extreme conditions without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, reliability, and durability for long-term use.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures long-term reliability in various environments.

Maximum Drain Current (ID): 23.8 A

With a high drain current rating, this FET can handle heavy loads with ease, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.16 ohm

The low ON resistance minimizes power loss and heat generation, ensuring efficient power flow in the circuit.

Terminal Position: SINGLE

The single terminal position simplifies installation and ensures proper orientation for optimal performance.

Case Connection: DRAIN

The drain connection offers a secure grounding point for the FET, ensuring stable operation and efficient power flow.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R160C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

497 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

23.8 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

70 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R160C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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