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IPB65R190CFDATMA1

Infineon Technologies

IPB65R190CFDATMA1 by Infineon Technologies

Infineon's IPB65R190CFDATMA1 is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for SWITCHING applications. Features include 57.2A IDM, 484mJ EAS, and 0.19 ohm RDS(on). Operating from -55 to 150 °C, it has GULL WING terminals in a RECTANGULAR package.

Median Price

$2.395

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,775 parts In-Stock

1+ parts

$2.840

100+ parts

$1.450

1k+ parts

$1.100

10k+ parts

-

1,775

$2.840

$1.450

$1.100

-

Element14

Singapore . 1,775 parts In-Stock

1+ parts

$5.100

100+ parts

$2.610

1k+ parts

$2.360

10k+ parts

-

1,775

$5.100

$2.610

$2.360

-

Rochester

USA . 150,793 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.560

10k+ parts

$1.460

150,793

-

$1.740

$1.560

$1.460

Verical

USA . 150,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.950

10k+ parts

$1.825

150,793

-

-

$1.950

$1.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$2.280

100+ parts

-

1k+ parts

-

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15

$2.280

-

-

-

Digiode

USA . 297 parts In-Stock

1+ parts

$298.956

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$298.956

-

-

-

Vyrian

USA . 5,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,339

-

-

-

-

Bristol Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 647 parts In-Stock

1+ parts

$0.421

100+ parts

$0.404

1k+ parts

$0.387

10k+ parts

-

647

$0.421

$0.404

$0.387

-

Corohmni

South Africa . 107 parts In-Stock

1+ parts

$1.437

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$1.437

-

-

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Aztec Data Supply Inc.

USA . 2,565 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,565

$1.440

-

-

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Semicontronic

India . 1,450 parts In-Stock

1+ parts

$2.250

100+ parts

$2.194

1k+ parts

$2.182

10k+ parts

-

1,450

$2.250

$2.194

$2.182

-

Argo Parts USA

USA . 1,752 parts In-Stock

1+ parts

$2.280

100+ parts

-

1k+ parts

-

10k+ parts

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1,752

$2.280

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-

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Ampacity Inc.

Singapore . 1,809 parts In-Stock

1+ parts

$2.480

100+ parts

-

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-

10k+ parts

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1,809

$2.480

-

-

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Microchip USA

USA . 472 parts In-Stock

1+ parts

$13.239

100+ parts

-

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472

$13.239

-

-

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AZTECH Wire

Italy . 177 parts In-Stock

1+ parts

$17.060

100+ parts

-

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-

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177

$17.060

-

-

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Corphita

USA . 281 parts In-Stock

1+ parts

$283.221

100+ parts

-

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281

$283.221

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

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2,240

-

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.090

10k+ parts

-

2,000

-

-

$2.090

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.234

1k+ parts

$2.166

10k+ parts

$2.120

1,000

-

$2.234

$2.166

$2.120

Overview

Unlock the power of cutting-edge technology with the IPB65R190CFDATMA1 by Infineon Technologies. This top-of-the-line Power Field Effect Transistor (FET) offers unparalleled performance and reliability, making it ideal for a wide range of switching applications. With a maximum pulsed drain current of 57.2 A and a minimum DS breakdown voltage of 650 V, this N-channel transistor is designed to exceed your expectations. Trust in the quality and expertise of Infineon Technologies to deliver innovative solutions that provide exceptional value and benefits to customers. Step into the future of technology with the IPB65R190CFDATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in making the product lightweight and durable, making it easier to handle and transport.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, low resistance, and high current capabilities, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast turn-on and turn-off times, making it ideal for efficient power management.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltages, making it suitable for high-power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and placement on circuit boards, maximizing space efficiency in electronic designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, allowing for precise switching and efficient power management.

Maximum Pulsed Drain Current (IDM): 57.2 A

The high pulsed drain current rating ensures the FET can handle short bursts of high current, making it suitable for applications with varying loads.

Avalanche Energy Rating (EAS): 484 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events without damage, improving overall reliability.

Maximum Drain Current (ID): 17.5 A

With a high maximum drain current rating, this FET can handle continuous high current flow, making it suitable for power-hungry applications.

Maximum Drain-Source On Resistance: 0.19 ohm

The low on-resistance of the FET helps minimize power loss and improve efficiency in switching applications, reducing heat generation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate reliably in high-temperature environments, increasing its versatility and application range.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the FET can function effectively in a wide range of temperature conditions, enhancing its reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R190CFDATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

484 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17.5 A

Maximum Drain Current (ID):

17.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

57.2 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R190CFDATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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