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IPB60R120P7ATMA1

Infineon Technologies

IPB60R120P7ATMA1 by Infineon Technologies

IPB60R120P7ATMA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. It features a max pulsed drain current of 78A and an on-resistance of 0.12 ohm, suitable for enhancement mode operation. This MOSFET in gull wing package is designed for high-power applications requiring efficient power management.

Median Price

$3.730

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,888 parts In-Stock

1+ parts

$1.838

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-

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3,888

$1.838

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Farnell

UK . 2,052 parts In-Stock

1+ parts

$2.640

100+ parts

$1.430

1k+ parts

$1.040

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-

2,052

$2.640

$1.430

$1.040

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Chip1Stop

Japan . 3,888 parts In-Stock

1+ parts

$3.730

100+ parts

$1.700

1k+ parts

-

10k+ parts

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3,888

$3.730

$1.700

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Newark

USA . 980 parts In-Stock

1+ parts

$4.260

100+ parts

$1.960

1k+ parts

$1.630

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-

980

$4.260

$1.960

$1.630

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Element14

Singapore . 2,052 parts In-Stock

1+ parts

$4.510

100+ parts

$2.450

1k+ parts

$1.840

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-

2,052

$4.510

$2.450

$1.840

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Mouser Electronics

USA . 5,301 parts In-Stock

1+ parts

$4.580

100+ parts

$2.240

1k+ parts

$1.740

10k+ parts

$1.630

5,301

$4.580

$2.240

$1.740

$1.630

DigiKey

USA . 1,031 parts In-Stock

1+ parts

$5.180

100+ parts

$2.398

1k+ parts

$1.969

10k+ parts

-

1,031

$5.180

$2.398

$1.969

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Arrow

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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$1.324

10k+ parts

$1.317

7,000

-

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$1.324

$1.317

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$1.520

10k+ parts

$1.480

5,000

-

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$1.520

$1.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 710 parts In-Stock

1+ parts

$1.776

100+ parts

-

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710

$1.776

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Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$2.610

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47

$2.610

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Chip Stock

USA . 22,380 parts In-Stock

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Vyrian

USA . 4,033 parts In-Stock

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4,033

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$2.707

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2,000

-

$2.707

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NAC Semi

USA . 1,000 parts In-Stock

1+ parts

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$2.670

10k+ parts

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1,000

-

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$2.670

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Rutronik

Germany . 980 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.030

10k+ parts

$1.560

980

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$2.030

$1.560

Bristol Electronics

USA . 43 parts In-Stock

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43

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Distributors (Availability)

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$0.352

100+ parts

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108

$0.352

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Modulus Dynamics

Lithuania . 12,972 parts In-Stock

1+ parts

$0.821

100+ parts

$0.788

1k+ parts

$0.755

10k+ parts

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12,972

$0.821

$0.788

$0.755

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Aztec Data Supply Inc.

USA . 2,248 parts In-Stock

1+ parts

$0.961

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2,248

$0.961

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Semicontronic

India . 3,792 parts In-Stock

1+ parts

$1.130

100+ parts

$1.102

1k+ parts

$1.096

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3,792

$1.130

$1.102

$1.096

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Corphita

USA . 413 parts In-Stock

1+ parts

$1.683

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413

$1.683

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Ampacity Inc.

Singapore . 4,285 parts In-Stock

1+ parts

$2.450

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4,285

$2.450

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Argo Parts USA

USA . 4,722 parts In-Stock

1+ parts

$2.610

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4,722

$2.610

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.610

100+ parts

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1k+ parts

$2.479

10k+ parts

$2.427

1,000

$2.610

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$2.479

$2.427

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$2.662

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$2.662

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$2.662

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150

$2.662

$2.662

$2.662

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Continental Prestige Electronics

USA . 980 parts In-Stock

1+ parts

$3.000

100+ parts

$1.820

1k+ parts

$1.320

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980

$3.000

$1.820

$1.320

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Microchip USA

USA . 9,019 parts In-Stock

1+ parts

$14.299

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9,019

$14.299

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RC Electronics

USA . 3,375 parts In-Stock

1+ parts

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$2.830

1k+ parts

$2.670

10k+ parts

$2.610

3,375

-

$2.830

$2.670

$2.610

GreenTree Electronics

Israel . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 800 parts In-Stock

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800

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Perfect Parts

USA . 31 parts In-Stock

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31

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Overview

Unleash the power of innovation with the IPB60R120P7ATMA1 from Infineon Technologies. This high-quality N-channel Power Field Effect Transistor boasts a single configuration with a built-in diode, perfect for switching applications. Its impressive 600V breakdown voltage and 78A pulsed drain current make it a reliable choice for a wide range of projects. With its small outline package and efficient performance, this transistor offers unparalleled value and benefits to customers seeking top-notch quality and reliability in their designs. Elevate your projects with the IPB60R120P7ATMA1 and experience the difference that cutting-edge technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

Offers efficient current control and performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for circuit protection and simplification.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such tasks.

Surface Mount: YES

Easy to mount on a circuit board, saving space and facilitating automated manufacturing processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications safely.

Package Shape: RECTANGULAR

Efficient use of space on the circuit board while still providing adequate room for connections.

Terminal Form: GULL WING

Provides secure and reliable connections, reducing the risk of disconnections or shorts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer low on-state resistance and high efficiency in switching operations.

Maximum Pulsed Drain Current (IDM): 78 A

Capable of handling high current spikes without damage, suitable for demanding applications.

Avalanche Energy Rating (EAS): 82 mJ

Can withstand energy spikes and avalanche breakdown events, ensuring reliability in harsh conditions.

No. of Terminals: 2

Simple 2-terminal design makes it easy to incorporate into circuit layouts and connections.

Package Style (Meter): SMALL OUTLINE

Compact form factor suitable for space-constrained applications or densely populated PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable MOSFET technology for efficient switching and low power consumption.

Transistor Element Material: SILICON

Silicon-based construction provides good performance characteristics and durability.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature environments without degradation in performance.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for reliable connections.

Maximum Drain-Source On Resistance: 0.12 ohm

Low on-resistance minimizes power loss and heat generation during operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections, reducing chances of errors.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R120P7ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

82 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

78 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R120P7ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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