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IPB60R060P7ATMA1

Infineon Technologies

IPB60R060P7ATMA1 by Infineon Technologies

IPB60R060P7ATMA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 151A pulsed drain current, 0.06 ohm max RDS(on), and 159mJ avalanche energy rating. Suitable for enhancement mode operation in power electronics due to its high performance and reliability.

Median Price

$5.264

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Chip1Stop

Japan . 1,488 parts In-Stock

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$3.440

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1,488

$3.440

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Newark

USA . 419 parts In-Stock

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$5.680

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419

$5.680

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DigiKey

USA . 10,813 parts In-Stock

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$5.770

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$2.775

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$2.220

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10,813

$5.770

$2.775

$2.220

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Verical

USA . 1,488 parts In-Stock

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$5.945

100+ parts

$3.078

1k+ parts

$2.548

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1,488

$5.945

$3.078

$2.548

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Mouser Electronics

USA . 1,446 parts In-Stock

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$7.360

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$3.550

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$2.800

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1,446

$7.360

$3.550

$2.800

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Element14

Singapore . 2,239 parts In-Stock

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$5.360

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$5.020

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2,239

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$5.360

$5.020

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Farnell

UK . 1,369 parts In-Stock

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$2.540

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$2.040

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1,369

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$2.540

$2.040

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Avnet

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$2.078

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$2.002

1,000

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$2.078

$2.002

Arrow

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$2.196

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$2.167

1,000

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$2.196

$2.167

RS (Exports)

UK . 94 parts In-Stock

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$5.168

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$4.761

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94

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$5.168

$4.761

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Digiode

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Nova Conductors

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93

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Chip Stock

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Rutronik

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$2.070

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IBS Electronics

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$7.980

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Vyrian

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Bristol Electronics

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Aztec Data Supply Inc.

USA . 32,489 parts In-Stock

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$0.391

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Corohmni

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$0.786

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123

$0.786

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Modulus Dynamics

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$1.533

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$1.472

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$1.410

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3,912

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$1.410

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Ampacity Inc.

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$2.030

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Corphita

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Component Stockers USA

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$6.360

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$4.360

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$2.970

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686

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Netroflash

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$4.966

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$4.814

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$4.713

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$4.713

Allen Electronics Distributors

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$4.606

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Perfect Parts

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Overview

Enhance your switching applications with the IPB60R060P7ATMA1 by Infineon Technologies. As a leading manufacturer in power field effect transistors, Infineon delivers top-notch quality and reliability. This N-channel transistor offers a maximum DS breakdown voltage of 600V, making it ideal for high-power switching tasks. With a low on-resistance and built-in diode, this transistor provides efficient performance while reducing energy loss. Whether you're designing industrial equipment or automotive systems, the IPB60R060P7ATMA1 offers unmatched value and benefits to meet your needs. Upgrade your designs with this high-performance transistor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the transistor easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have better performance characteristics such as lower ON resistance and higher switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from reverse polarity and enhances overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast turn-on and turn-off times for efficient operation.

Surface Mount: YES

Surface mount design allows for easy and compact integration onto PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage ensures the transistor can handle high voltage levels without breakdown, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to mount onto PCBs for convenient installation.

Terminal Form: GULL WING

Gull wing terminals offer good solder joint reliability and mechanical strength, enhancing the durability of the transistor.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to control and are typically used in applications where low power consumption is important.

Maximum Pulsed Drain Current (IDM): 151 A

High maximum pulsed drain current capability allows the transistor to handle high peak currents without failure, making it reliable in demanding applications.

Avalanche Energy Rating (EAS): 159 mJ

High avalanche energy rating ensures the transistor can withstand high-energy spikes, protecting it from damage in harsh operating conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces the chance of wiring errors.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for higher component density in the circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good efficiency and fast switching speeds, making the transistor suitable for modern electronic applications.

Transistor Element Material: SILICON

Silicon transistors are reliable and widely used in electronic devices due to their stable performance characteristics and high temperature tolerance.

Minimum Operating Temperature: -55 °C

The transistor can operate reliably at low temperatures, making it suitable for use in harsh environments or applications that require low-temperature operation.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability of the transistor.

Maximum Drain-Source On Resistance: 0.06 ohm

Low ON resistance reduces power loss and improves efficiency, making the transistor suitable for high-current switching applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and reduces the chance of wiring errors during installation.

Case Connection: DRAIN

Drain connection provides easy and reliable connection to the circuit, ensuring stable operation and performance.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R060P7ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

159 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

151 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R060P7ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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