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IPB65R110CFDAATMA1

Infineon Technologies

IPB65R110CFDAATMA1 by Infineon Technologies

Infineon's IPB65R110CFDAATMA1 is a N-CHANNEL FET with 650V DS breakdown voltage, 99.6A IDM, and 0.11 ohm RDS(on). Ideal for switching applications in automotive (AEC-Q101) due to its high current handling and low on-resistance.

Median Price

$6.440

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 959 parts In-Stock

1+ parts

$6.430

100+ parts

$3.990

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-

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959

$6.430

$3.990

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DigiKey

USA . 1,692 parts In-Stock

1+ parts

$6.450

100+ parts

$3.152

1k+ parts

$2.575

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1,692

$6.450

$3.152

$2.575

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Newark

USA . 944 parts In-Stock

1+ parts

$7.030

100+ parts

$3.460

1k+ parts

$3.040

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944

$7.030

$3.460

$3.040

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Mouser Electronics

USA . 514 parts In-Stock

1+ parts

$7.220

100+ parts

$3.640

1k+ parts

$2.980

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514

$7.220

$3.640

$2.980

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Element14

Singapore . 1,331 parts In-Stock

1+ parts

$9.150

100+ parts

$4.580

1k+ parts

$4.420

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1,331

$9.150

$4.580

$4.420

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Verical

USA . 490,000 parts In-Stock

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$3.618

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$3.618

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Arrow

USA . 1,000 parts In-Stock

1+ parts

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$2.766

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1,000

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$2.766

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Farnell

UK . 921 parts In-Stock

1+ parts

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100+ parts

$4.070

1k+ parts

$3.830

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921

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$4.070

$3.830

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 684 parts In-Stock

1+ parts

$4.570

100+ parts

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684

$4.570

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Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$5.470

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83

$5.470

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Chip Stock

USA . 21,511 parts In-Stock

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21,511

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Vyrian

USA . 726 parts In-Stock

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726

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 261 parts In-Stock

1+ parts

$1.280

100+ parts

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261

$1.280

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.632

100+ parts

$1.485

1k+ parts

$1.338

10k+ parts

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50

$1.632

$1.485

$1.338

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Semicontronic

India . 944 parts In-Stock

1+ parts

$2.710

100+ parts

$2.642

1k+ parts

$2.629

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944

$2.710

$2.642

$2.629

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Corphita

USA . 569 parts In-Stock

1+ parts

$4.329

100+ parts

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569

$4.329

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Bastille Electronics

Australia . 870 parts In-Stock

1+ parts

$5.470

100+ parts

$5.196

1k+ parts

$4.937

10k+ parts

$4.868

870

$5.470

$5.196

$4.937

$4.868

Ampacity Inc.

Singapore . 1,040 parts In-Stock

1+ parts

$5.900

100+ parts

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1,040

$5.900

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Modulus Dynamics

Lithuania . 8,322 parts In-Stock

1+ parts

$6.251

100+ parts

$6.001

1k+ parts

$5.751

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8,322

$6.251

$6.001

$5.751

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Corohmni

South Africa . 749 parts In-Stock

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$6.251

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749

$6.251

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Microchip USA

USA . 8,314 parts In-Stock

1+ parts

$28.804

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8,314

$28.804

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RC Electronics

USA . 9,003 parts In-Stock

1+ parts

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$6.380

1k+ parts

$5.820

10k+ parts

$5.650

9,003

-

$6.380

$5.820

$5.650

Robosynatics

Brazil . 7,447 parts In-Stock

1+ parts

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100+ parts

$6.126

1k+ parts

$6.001

10k+ parts

$6.001

7,447

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$6.126

$6.001

$6.001

Lucentia Tech

USA . 7,447 parts In-Stock

1+ parts

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$6.126

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$6.001

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$6.001

7,447

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$6.001

iodParts Technologies Inc.

India . 4,940 parts In-Stock

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Perfect Parts

USA . 1,154 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Argo Parts USA

USA . 427 parts In-Stock

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427

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Continental Prestige Electronics

USA . 385 parts In-Stock

1+ parts

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$4.220

1k+ parts

$3.770

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385

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$4.220

$3.770

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Overview

Experience the cutting-edge performance of the IPB65R110CFDAATMA1 from Infineon Technologies, a top-tier manufacturer known for delivering high-quality Power FETs. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a maximum pulsed drain current of 99.6 A and a minimum DS breakdown voltage of 650 V. With its small outline package style and enhanced mode operation, this FET provides exceptional reliability and efficiency. Trust in the innovative technology and superior design of Infineon to elevate your projects to new heights with the IPB65R110CFDAATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher electron mobility, making them ideal for high efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode offers reverse current protection, preventing damage to the transistor and other components in the circuit.

Transistor Application: SWITCHING

Suitable for high-frequency switching applications, offering fast turn-on and turn-off times.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the transistor to handle high voltage applications with reliability.

Configuration: RECTANGULAR

Rectangular shape makes it easy to mount and solder the transistor onto the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and can be turned on when a specific voltage is applied, offering more control over the switching operation.

Maximum Pulsed Drain Current (IDM): 99.6 A

Capable of handling high current pulses, making it suitable for power applications that require short bursts of high current.

Avalanche Energy Rating (EAS): 845 mJ

High avalanche energy rating ensures the transistor can withstand voltage spikes and transient events without failing.

No. of Terminals: 2

Simple two-terminal connection makes it easy to integrate into a circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high conductivity and switching speed, ideal for efficient power control.

Transistor Element Material: SILICON

Silicon-based construction provides good thermal conductivity and high temperature tolerance.

Terminal Finish: TIN

Tin finish provides a reliable electrical connection and corrosion resistance.

Maximum Drain Current (ID): 31.2 A

Can handle high continuous current, suitable for power applications.

Maximum Drain-Source On Resistance: 0.11 ohm

Low ON resistance leads to high efficiency and minimal power loss in the transistor.

Terminal Position: SINGLE

Single terminal position simplifies the circuit design and connection setup.

Case Connection: DRAIN

Drain connection offers low impedance path for the current flow, reducing heat generation and power loss.

Reference Standard: AEC-Q101

Complies with automotive quality standards, ensuring reliability and durability in harsh operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R110CFDAATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

845 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

31.2 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

99.6 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R110CFDAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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