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IPB60R099CPATMA1

Infineon Technologies

IPB60R099CPATMA1 by Infineon Technologies

Infineon's IPB60R099CPATMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 93A IDM, 800mJ EAS, and 0.099 ohm RDS(on). With a max operating temp of 150°C, this MOSFET in Gull Wing package is suitable for high-power enhancement mode operations.

Median Price

$5.070

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$4.950

100+ parts

$4.650

1k+ parts

$4.210

10k+ parts

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1

$4.950

$4.650

$4.210

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Farnell

UK . 985 parts In-Stock

1+ parts

$5.070

100+ parts

$2.970

1k+ parts

$2.600

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985

$5.070

$2.970

$2.600

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DigiKey

USA . 3,519 parts In-Stock

1+ parts

$7.350

100+ parts

$3.753

1k+ parts

$3.066

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3,519

$7.350

$3.753

$3.066

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Newark

USA . 1,351 parts In-Stock

1+ parts

$7.860

100+ parts

$4.010

1k+ parts

$3.620

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1,351

$7.860

$4.010

$3.620

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Mouser Electronics

USA . 995 parts In-Stock

1+ parts

$8.020

100+ parts

$4.250

1k+ parts

$3.510

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995

$8.020

$4.250

$3.510

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Element14

Singapore . 729 parts In-Stock

1+ parts

$8.654

100+ parts

$6.179

1k+ parts

$5.816

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729

$8.654

$6.179

$5.816

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Arrow

USA . 45,000 parts In-Stock

1+ parts

-

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$3.838

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45,000

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$3.838

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Verical

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.849

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45,000

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-

$3.849

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Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.560

10k+ parts

$3.510

1,000

-

-

$3.560

$3.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$4.702

100+ parts

-

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-

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52

$4.702

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Bristol Electronics

USA . 19,000 parts In-Stock

1+ parts

$5.358

100+ parts

$2.518

1k+ parts

$2.304

10k+ parts

-

19,000

$5.358

$2.518

$2.304

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Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$6.318

100+ parts

-

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47

$6.318

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Rutronik

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

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$4.810

10k+ parts

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1,000

-

-

$4.810

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IBS Electronics

USA . 909 parts In-Stock

1+ parts

-

100+ parts

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$11.472

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909

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$11.472

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Vyrian

USA . 624 parts In-Stock

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624

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Rotakorn

Sweden . 174 parts In-Stock

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174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 25,708 parts In-Stock

1+ parts

$0.657

100+ parts

$0.631

1k+ parts

$0.604

10k+ parts

-

25,708

$0.657

$0.631

$0.604

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Aztec Data Supply Inc.

USA . 2,229 parts In-Stock

1+ parts

$0.943

100+ parts

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2,229

$0.943

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Corohmni

South Africa . 462 parts In-Stock

1+ parts

$1.257

100+ parts

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462

$1.257

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.308

100+ parts

$2.100

1k+ parts

$1.893

10k+ parts

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1,000

$2.308

$2.100

$1.893

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Semicontronic

India . 772 parts In-Stock

1+ parts

$2.820

100+ parts

$2.750

1k+ parts

$2.735

10k+ parts

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772

$2.820

$2.750

$2.735

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Ampacity Inc.

Singapore . 741 parts In-Stock

1+ parts

$2.820

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741

$2.820

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Corphita

USA . 852 parts In-Stock

1+ parts

$4.455

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852

$4.455

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.318

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$6.318

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Component Stockers USA

USA . 2,054 parts In-Stock

1+ parts

$7.930

100+ parts

$4.670

1k+ parts

$4.510

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2,054

$7.930

$4.670

$4.510

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Microchip USA

USA . 6,368 parts In-Stock

1+ parts

$14.933

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Perfect Parts

USA . 12,078 parts In-Stock

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GreenTree Electronics

Israel . 7,000 parts In-Stock

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Epart123

USA . 5,000 parts In-Stock

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$4.810

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$4.810

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$4.810

$4.810

RC Electronics

USA . 4,258 parts In-Stock

1+ parts

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100+ parts

$6.910

1k+ parts

$6.520

10k+ parts

$6.390

4,258

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$6.910

$6.520

$6.390

Argo Parts USA

USA . 4,059 parts In-Stock

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Benley Electronics

USA . 3,126 parts In-Stock

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Continental Prestige Electronics

USA . 931 parts In-Stock

1+ parts

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$4.960

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$4.320

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931

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$4.960

$4.320

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Overview

Unleash the power of Infineon Technologies with the IPB60R099CPATMA1 Power Field Effect Transistor. This high-quality N-CHANNEL FET is designed for switching applications, offering a single configuration with a built-in diode for added convenience. With a maximum drain current of 31A and a minimum breakdown voltage of 600V, this transistor delivers exceptional performance in a compact, surface-mount package. Whether you're designing industrial equipment or automotive systems, this transistor provides the reliability and efficiency you need to take your projects to the next level. Trust in Infineon Technologies to bring you cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making them ideal for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better control and efficiency in switching applications, reducing the need for additional components.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in power management systems.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltages, making it suitable for power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

Easily fits into standard layouts and designs, simplifying integration into circuits.

Terminal Form: GULL WING

Provides secure connections and ease of soldering during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 93 A

Capable of handling high current spikes, making it suitable for power applications with varying loads.

Avalanche Energy Rating (EAS): 800 mJ

Can withstand high energy spikes, ensuring reliable operation in harsh environments.

No. of Terminals: 2

Simplifies the circuit layout and reduces complexity in the design.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on circuit boards, ideal for applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers efficient and reliable performance, commonly used in power management applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications.

Transistor Element Material: SILICON

Provides high reliability and performance, commonly used in power semiconductor devices.

Terminal Finish: TIN

Ensures good electrical conductivity and corrosion resistance, maintaining stable performance over time.

Maximum Drain Current (ID): 31 A

Can handle high continuous currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.099 ohm

Low on-resistance minimizes power loss and improves efficiency in power management systems.

Terminal Position: SINGLE

Simplifies the installation process and reduces the chance of wiring errors during assembly.

Case Connection: DRAIN

Specific terminal connection for efficient current flow and control in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R099CPATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

93 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R099CPATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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