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IPB60R099C6ATMA1

Infineon Technologies

IPB60R099C6ATMA1 by Infineon Technologies

Infineon's IPB60R099C6ATMA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 112A IDM, 796mJ EAS, and 0.099 ohm RDS(on). With GULL WING terminals and ENHANCEMENT MODE operation, it offers high performance in a small outline package.

Median Price

$2.768

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,340 parts In-Stock

1+ parts

$6.400

100+ parts

$3.116

1k+ parts

$2.546

10k+ parts

-

3,340

$6.400

$3.116

$2.546

-

Chip1Stop

Japan . 486 parts In-Stock

1+ parts

$7.269

100+ parts

$3.541

1k+ parts

$3.265

10k+ parts

-

486

$7.269

$3.541

$3.265

-

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.780

10k+ parts

-

3,000

-

-

$2.780

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.757

10k+ parts

-

3,000

-

-

$2.757

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Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.470

10k+ parts

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1,000

-

-

$2.470

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Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2.560

1k+ parts

$2.290

10k+ parts

$2.150

10

-

$2.560

$2.290

$2.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 275 parts In-Stock

1+ parts

$2.878

100+ parts

-

1k+ parts

-

10k+ parts

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275

$2.878

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.646

100+ parts

-

1k+ parts

-

10k+ parts

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300

$5.646

-

-

-

Chip Stock

USA . 22,300 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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22,300

-

-

-

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Vyrian

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

-

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3,914

-

-

-

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.039

10k+ parts

-

2,000

-

-

$4.039

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QIE Inc.

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

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80

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,630 parts In-Stock

1+ parts

$0.516

100+ parts

$0.495

1k+ parts

$0.475

10k+ parts

-

2,630

$0.516

$0.495

$0.475

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.800

100+ parts

$0.728

1k+ parts

$0.656

10k+ parts

-

20

$0.800

$0.728

$0.656

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Corohmni

South Africa . 179 parts In-Stock

1+ parts

$0.825

100+ parts

-

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-

10k+ parts

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179

$0.825

-

-

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Aztec Data Supply Inc.

USA . 3,934 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

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3,934

$1.720

-

-

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Decca Corp

Germany . 328 parts In-Stock

1+ parts

$2.380

100+ parts

$2.332

1k+ parts

$2.309

10k+ parts

-

328

$2.380

$2.332

$2.309

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Ampacity Inc.

Singapore . 674 parts In-Stock

1+ parts

$2.580

100+ parts

-

1k+ parts

-

10k+ parts

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674

$2.580

-

-

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Corphita

USA . 459 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

-

10k+ parts

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459

$2.727

-

-

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Component Stockers USA

USA . 1,880 parts In-Stock

1+ parts

$3.770

100+ parts

$3.490

1k+ parts

$3.350

10k+ parts

-

1,880

$3.770

$3.490

$3.350

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Continental Prestige Electronics

USA . 4,173 parts In-Stock

1+ parts

$5.110

100+ parts

$3.140

1k+ parts

$2.280

10k+ parts

-

4,173

$5.110

$3.140

$2.280

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Microchip USA

USA . 4,153 parts In-Stock

1+ parts

$26.265

100+ parts

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4,153

$26.265

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Argo Parts USA

USA . 3,288 parts In-Stock

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3,288

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Perfect Parts

USA . 2,268 parts In-Stock

1+ parts

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2,268

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.533

1k+ parts

$5.363

10k+ parts

$5.250

500

-

$5.533

$5.363

$5.250

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

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Overview

Unlock the power of innovation with the IPB60R099C6ATMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor is designed for high-performance switching applications. With a minimum DS Breakdown Voltage of 600V and a maximum Drain Current of 37.9A, this transistor delivers unrivaled efficiency and reliability. Whether you're in the automotive, industrial, or consumer electronics industry, this product offers superior quality and value that will elevate your projects to new heights. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the transistor, ensuring its durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching operations, providing a convenient solution for applications that require diode functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast response times, making it suitable for a wide range of electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the transistor onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage operation, making it suitable for power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design, making it easy to integrate the transistor into various electronic devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connection to the circuit board, ensuring reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers better control and efficiency in switching applications, providing improved performance over depletion mode transistors.

Maximum Pulsed Drain Current (IDM): 112 A

The high maximum pulsed drain current rating allows this FET to handle large current spikes, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 796 mJ

The high avalanche energy rating indicates the ability of this FET to withstand voltage spikes without damage, ensuring long-term reliability in harsh operating conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the installation and connection of the FET in electronic circuits, reducing the chances of wiring errors.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, making it suitable for applications where space is limited without compromising on performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET provides high performance, low power consumption, and high reliability, essential for modern electronic devices.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring stable performance in demanding environmental conditions.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its high performance and reliability, making it ideal for power FETs like this product.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Maximum Drain Current (ID): 37.9 A

The high maximum drain current rating allows this FET to handle high continuous currents, making it suitable for power applications that require continuous operation at high currents.

Maximum Drain-Source On Resistance: 0.099 ohm

Having a low drain-source on resistance ensures minimal power loss and heat generation in the FET, making it efficient for power applications where low resistance is crucial.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection of the FET in circuits, making it easier to integrate into electronic devices.

Case Connection: DRAIN

The drain case connection allows for efficient dissipation of heat, improving the overall thermal management of the FET and ensuring stable operation at high power levels.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R099C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

796 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

37.9 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R099C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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