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IPB60R080P7ATMA1

Infineon Technologies

IPB60R080P7ATMA1 by Infineon Technologies

IPB60R080P7ATMA1 by Infineon Technologies is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a built-in diode for switching applications, with 110A IDM and 0.08 ohm RDS(on). Ideal for enhancement mode operation in various power electronics systems.

Median Price

$4.364

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1,000 parts In-Stock

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$4.880

100+ parts

$2.430

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-

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1,000

$4.880

$2.430

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Newark

USA . 597 parts In-Stock

1+ parts

$5.040

100+ parts

$2.380

1k+ parts

$2.250

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597

$5.040

$2.380

$2.250

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DigiKey

USA . 1,526 parts In-Stock

1+ parts

$5.380

100+ parts

$2.539

1k+ parts

$1.777

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1,526

$5.380

$2.539

$1.777

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Farnell

UK . 929 parts In-Stock

1+ parts

$5.567

100+ parts

$3.353

1k+ parts

$2.505

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929

$5.567

$3.353

$2.505

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Mouser Electronics

USA . 1,337 parts In-Stock

1+ parts

$6.110

100+ parts

$2.940

1k+ parts

$2.320

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1,337

$6.110

$2.940

$2.320

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Verical

USA . 63,000 parts In-Stock

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$2.913

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$2.913

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Arrow

USA . 3,000 parts In-Stock

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$1.967

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3,000

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$1.967

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Element14

Singapore . 929 parts In-Stock

1+ parts

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$3.542

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$2.752

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929

-

$3.542

$2.752

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RS (Exports)

UK . 650 parts In-Stock

1+ parts

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100+ parts

$3.849

1k+ parts

$3.548

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650

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$3.849

$3.548

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Rochester

USA . 552 parts In-Stock

1+ parts

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$1.840

1k+ parts

$1.650

10k+ parts

$1.550

552

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$1.840

$1.650

$1.550

Distributors (In-Stock)

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Digiode

USA . 972 parts In-Stock

1+ parts

$3.524

100+ parts

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972

$3.524

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Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$4.086

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84

$4.086

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Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Vyrian

USA . 1,639 parts In-Stock

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1,639

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Bristol Electronics

USA . 1,000 parts In-Stock

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IBS Electronics

USA . 1,000 parts In-Stock

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$6.648

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1,000

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$6.648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 21,947 parts In-Stock

1+ parts

$0.652

100+ parts

$0.626

1k+ parts

$0.600

10k+ parts

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21,947

$0.652

$0.626

$0.600

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Aztec Data Supply Inc.

USA . 2,112 parts In-Stock

1+ parts

$0.960

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$0.960

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Corohmni

South Africa . 139 parts In-Stock

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$1.064

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139

$1.064

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Semicontronic

India . 1,284 parts In-Stock

1+ parts

$1.670

100+ parts

$1.628

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$1.620

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1,284

$1.670

$1.628

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Corphita

USA . 753 parts In-Stock

1+ parts

$3.339

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753

$3.339

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Ampacity Inc.

Singapore . 1,496 parts In-Stock

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$3.640

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1,496

$3.640

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Argo Parts USA

USA . 1,793 parts In-Stock

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$4.086

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1,793

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Netroflash

USA . 500 parts In-Stock

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$4.086

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$4.086

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Microchip USA

USA . 9,190 parts In-Stock

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$20.586

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$20.586

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

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Perfect Parts

USA . 2,262 parts In-Stock

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Continental Prestige Electronics

USA . 949 parts In-Stock

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$3.580

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$2.560

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949

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$3.580

$2.560

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Overview

Power up your electronic devices with the high-quality IPB60R080P7ATMA1 Power Field Effect Transistor from Infineon Technologies. Designed for switching applications, this N-CHANNEL transistor offers a minimum DS breakdown voltage of 600V and a maximum pulsed drain current of 110A. With a built-in diode and a low on-resistance of 0.08 ohm, this transistor provides efficient power management and reliable performance. Whether you're working on industrial equipment or consumer electronics, the IPB60R080P7ATMA1 delivers the power and durability you need for your next project. Trust in Infineon Technologies for cutting-edge technology and superior quality components that make a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

This feature allows for easy and secure mounting on circuit boards, saving space and improving efficiency.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltages without damage.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into existing circuit designs.

Terminal Form: GULL WING

The gull wing terminals provide a secure connection and are ideal for surface mounting applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high efficiency and low resistance in on-state, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 110 A

This high current rating allows for handling large spikes of current without damage.

Avalanche Energy Rating (EAS): 118 mJ

The high avalanche energy rating ensures the FET can withstand transient voltage spikes.

No. of Terminals: 2

With only 2 terminals, this FET is easy to integrate into circuit designs and reduces complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is ideal for compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and low power consumption, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and durability, ensuring long-term reliability.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET can function in a wide range of environments.

Terminal Finish: TIN

The tin finish on the terminals provides a reliable connection and is resistant to corrosion.

Maximum Drain-Source On Resistance: 0.08 ohm

The low on-resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and ensures easy integration.

Case Connection: DRAIN

The drain connection allows for easy connection to external components and ensures efficient current flow.

Technical Specifications

Power Field Effect Transistors (FET) IPB60R080P7ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

118 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

110 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB60R080P7ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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