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IPB65R099C6ATMA1

Infineon Technologies

IPB65R099C6ATMA1 by Infineon Technologies

IPB65R099C6ATMA1 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, 0.099 ohm RDS(on), and 115A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has an EAS of 845 mJ.

Median Price

$5.534

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$5.534

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150

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Vyrian

USA . 4,898 parts In-Stock

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Chip Stock

USA . 2,900 parts In-Stock

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2,900

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Digiode

USA . 282 parts In-Stock

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282

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.243

100+ parts

$2.041

1k+ parts

$1.839

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-

2,500

$2.243

$2.041

$1.839

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Ampacity Inc.

Singapore . 322 parts In-Stock

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$3.050

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Continental Prestige Electronics

USA . 4,108 parts In-Stock

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$5.534

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$5.423

4,108

$5.534

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$5.423

Netroflash

USA . 100 parts In-Stock

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$5.534

100+ parts

$5.423

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100

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$5.423

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Modulus Dynamics

Lithuania . 25,456 parts In-Stock

1+ parts

$5.534

100+ parts

$5.313

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$5.091

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AZTECH Wire

Italy . 348 parts In-Stock

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$18.650

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Andel Nordic

Denmark . 313 parts In-Stock

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$19.150

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$13.404

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$13.404

313

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$13.404

RC Electronics

USA . 7,337 parts In-Stock

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$5.640

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$5.150

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$5.000

7,337

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$5.000

Argo Parts USA

USA . 941 parts In-Stock

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Corphita

USA . 2 parts In-Stock

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Overview

Power up your applications with the IPB65R099C6ATMA1 by Infineon Technologies! Manufactured with high-quality materials and cutting-edge technology, this N-CHANNEL Power Field Effect Transistor is designed for switching applications. With a maximum breakdown voltage of 650V and a low on-resistance of 0.099 ohm, this transistor offers reliable performance and efficiency. Whether you're working on automotive, industrial, or renewable energy projects, trust Infineon Technologies to deliver the power you need. Elevate your designs and unlock new possibilities with the IPB65R099C6ATMA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have lower ON-resistance and higher efficiency compared to P-Channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity or back EMF, increasing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in turning devices on and off.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying manufacturing processes.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V ensures the transistor can handle high voltage applications, making it versatile in various power electronics designs.

Maximum Pulsed Drain Current (IDM): 115 A

The high pulsed drain current rating of 115A allows the transistor to handle surges in power demand, making it suitable for transient load conditions.

Avalanche Energy Rating (EAS): 845 mJ

With a high avalanche energy rating of 845mJ, the transistor can withstand transient energy spikes, ensuring long-term reliability in harsh operating conditions.

Maximum Drain-Source On Resistance: 0.099 ohm

The low drain-source on resistance of 0.099 ohm results in minimal power loss and heat generation during operation, contributing to high efficiency.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R099C6ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

115 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R099C6ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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