Loading...

IPB65R190CFDATMA2

Infineon Technologies

IPB65R190CFDATMA2 by Infineon Technologies

IPB65R190CFDATMA2 by Infineon is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 57.2A and EAS of 484mJ, operating in ENHANCEMENT MODE. With a 0.19 ohm RDS(on), it can handle up to 17.5A drain current efficiently at temperatures ranging from -55 to 150°C.

Median Price

$3.259

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 603 parts In-Stock

1+ parts

$3.660

100+ parts

$1.672

1k+ parts

$1.266

10k+ parts

$1.199

603

$3.660

$1.672

$1.266

$1.199

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.250

10k+ parts

$3.200

6,000

-

-

$3.250

$3.200

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.429

10k+ parts

$1.344

1,000

-

-

$1.429

$1.344

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.268

10k+ parts

$3.093

1,000

-

-

$3.268

$3.093

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 772 parts In-Stock

1+ parts

$3.182

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$3.182

-

-

-

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.558

10k+ parts

$4.488

6,000

-

-

$4.558

$4.488

Vyrian

USA . 2,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

-

-

-

-

TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.730

10k+ parts

-

1,000

-

-

$1.730

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 25,991 parts In-Stock

1+ parts

$0.612

100+ parts

$0.588

1k+ parts

$0.563

10k+ parts

-

25,991

$0.612

$0.588

$0.563

-

Corphita

USA . 258 parts In-Stock

1+ parts

$3.015

100+ parts

-

1k+ parts

-

10k+ parts

-

258

$3.015

-

-

-

Microchip USA

USA . 4,326 parts In-Stock

1+ parts

$13.239

100+ parts

-

1k+ parts

-

10k+ parts

-

4,326

$13.239

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience the power of Infineon Technologies with the IPB65R190CFDATMA2 Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers a high DS breakdown voltage of 650V and a maximum pulsed drain current of 57.2A. With a built-in diode and low on-resistance, this transistor provides reliable performance in a compact, surface-mount package. Trust in the quality and innovation of Infineon Technologies to enhance your designs and bring efficiency to your projects. Choose the IPB65R190CFDATMA2 for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the components inside, ensuring a reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high-power applications and offer good performance characteristics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse current protection, enhancing the overall efficiency and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and low on-state resistance for efficient operation.

Surface Mount: YES

Surface mount technology enables easier and more compact PCB design, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, ensuring reliable and safe operation.

Maximum Pulsed Drain Current (IDM): 57.2 A

The high pulsed drain current rating allows for handling sudden spikes in current, making this FET suitable for demanding applications.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for reliable operation in a wide range of environments, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) IPB65R190CFDATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

484 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17.5 A

Maximum Drain Current (ID):

17.5 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

57.2 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPB65R190CFDATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20