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FF300R17KE4HOSA1

Infineon Technologies

FF300R17KE4HOSA1 by Infineon Technologies

Infineon's FF300R17KE4HOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, ideal for POWER CONTROL applications. Featuring a Max VCEsat of 2.3V and Max Collector Current of 440A, it offers efficient performance. With a Nominal Turn Off Time of 930ns, this IGBT operates at temperatures up to 175°C.

Median Price

$127.455

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 6 parts In-Stock

1+ parts

$90.170

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-

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6

$90.170

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Avnet

USA . 6 parts In-Stock

1+ parts

$105.154

100+ parts

$99.806

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6

$105.154

$99.806

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Rochester

USA . 2 parts In-Stock

1+ parts

$125.160

100+ parts

$122.670

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$120.160

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2

$125.160

$122.670

$120.160

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Verical

USA . 4 parts In-Stock

1+ parts

$125.500

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4

$125.500

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DigiKey

USA . 40 parts In-Stock

1+ parts

$129.410

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40

$129.410

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Arrow

USA . 4 parts In-Stock

1+ parts

$148.755

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4

$148.755

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Element14

Singapore . 6 parts In-Stock

1+ parts

$176.450

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6

$176.450

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Chip1Stop

Japan . 15 parts In-Stock

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$188.000

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15

$188.000

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Distributors (In-Stock)

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Digiode

USA . 885 parts In-Stock

1+ parts

$71.250

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885

$71.250

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$278.180

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$251.450

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100

$278.180

$251.450

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Vyrian

USA . 7,122 parts In-Stock

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NAC Semi

USA . 150 parts In-Stock

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$296.410

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TME

Poland . 7 parts In-Stock

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Modulus Dynamics

Lithuania . 12,942 parts In-Stock

1+ parts

$1.621

100+ parts

$1.556

1k+ parts

$1.491

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12,942

$1.621

$1.556

$1.491

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Corphita

USA . 880 parts In-Stock

1+ parts

$67.500

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880

$67.500

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Continental Prestige Electronics

USA . 8 parts In-Stock

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$169.220

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$169.220

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Component Stockers USA

USA . 20 parts In-Stock

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$189.310

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20

$189.310

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Microchip USA

USA . 4,722 parts In-Stock

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$383.610

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4,722

$383.610

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Northwest PG Solutions

USA . 943 parts In-Stock

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$3.920

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943

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$3.920

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Native Components

USA . 294 parts In-Stock

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$3.880

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294

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$3.880

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Perfect Parts

USA . 22 parts In-Stock

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iodParts Technologies Inc.

India . 5 parts In-Stock

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Overview

Unleash the power of the FF300R17KE4HOSA1 by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor with N-CHANNEL polarity. Designed for power control applications, this transistor boasts a maximum collector-emitter voltage of 1700V and a maximum collector current of 440A. With a nominal turn-on time of 355 ns and a maximum VCEsat of 2.3V, this product ensures efficient and reliable performance. Trust in Infineon Technologies' expertise and experience in semiconductor manufacturing to deliver superior products that meet your needs. Upgrade your power control systems today with the FF300R17KE4HOSA1 for unmatched performance and reliability.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their fast switching speeds and high efficiency, making them ideal for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for improved performance and efficiency in power control applications.

Maximum VCEsat: 2.3 V

Low VCEsat minimizes power losses and improves overall efficiency of the transistor.

Nominal Turn Off Time (toff): 930 ns

Fast turn off time helps in reducing switching losses and improving overall performance.

Maximum Power Dissipation (Abs): 1800 W

High power dissipation allows for reliable operation in high-power applications.

Maximum Collector-Emitter Voltage: 1700 V

High VCE voltage rating makes this IGBT suitable for high voltage applications.

Maximum Collector Current (IC): 440 A

High collector current rating enables this IGBT to handle large power loads.

Maximum Gate-Emitter Voltage: 20 V

Low gate-emitter voltage ensures safe and efficient operation of the IGBT.

Nominal Turn On Time (ton): 355 ns

Fast turn on time improves the responsiveness and efficiency of the transistor.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF300R17KE4HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

2

No. of Terminals:

5

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

930 ns

Nominal Turn On Time (ton):

355 ns

Maximum VCEsat:

2.3 V

Trade Compliance

FF300R17KE4HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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