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LT5519EUF#TR

Analog Devices

LT5519EUF#TR by Analog Devices

LT5519EUF#TR by Analog Devices is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, nominal voltage of 5V, and terminal pitch of 0.65mm for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,015 parts In-Stock

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Digiode

USA . 3,771 parts In-Stock

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Anansix

USA . 2,168 parts In-Stock

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Distributors (Availability)

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MARBEL Systems

Belgium . 120 parts In-Stock

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$15.150

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$15.150

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Parana Technologies

USA . 632 parts In-Stock

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$16.117

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$14.989

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632

$16.117

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$14.989

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IDEA Electronic Components Group

UK . 1,121 parts In-Stock

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$17.330

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$16.464

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$16.464

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Texas Native Microelectronics

USA . 786 parts In-Stock

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$17.414

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$16.195

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$15.324

786

$17.414

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$15.324

AZTECH Wire

Italy . 253 parts In-Stock

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$19.233

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$19.233

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Kenton Components

USA . 3,764 parts In-Stock

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$20.897

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$18.389

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$18.389

DigiPath Technology Company

USA . 51 parts In-Stock

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$27.035

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$25.953

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$25.953

51

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$25.953

Qasali Group International

UK . 2,597 parts In-Stock

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$47.018

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One Stop Electronics

USA . 1,498 parts In-Stock

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$426.000

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Semicontronic

India . 1,617 parts In-Stock

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$992.000

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$967.200

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$962.240

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1,617

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Corphita

USA . 3,078 parts In-Stock

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Corohmni

South Africa . 433 parts In-Stock

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433

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Overview

Experience the cutting-edge technology of Analog Devices with the LT5519EUF#TR, a high-quality Cellphone IC that offers unparalleled performance and reliability. Designed with precision and expertise, this chip carrier boasts a very thin profile and a temperature grade suitable for industrial applications. With a nominal supply voltage of 5V, the LT5519EUF#TR is perfect for RF and baseband circuits in telecommunications. Trust Analog Devices to deliver excellence in every aspect, from package body material to terminal finish. Upgrade your devices with the LT5519EUF#TR and enjoy the benefits of superior quality and advanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for electronic components.

Surface Mount: YES

Easy to integrate into circuit boards and saves space.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Suitable for industrial use with reliable performance under higher temperatures.

Minimum Operating Temperature: -40 °C

Can withstand colder temperature environments without impacting functionality.

Nominal Supply Voltage: 5 V

Standard voltage requirement for many electronic devices.

Technical Specifications

Cellphone ICs LT5519EUF#TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LT5519EUF#TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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