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LT5519EUF

Analog Devices

LT5519EUF by Analog Devices

Analog Devices' LT5519EUF is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85 °C, it's ideal for RF and baseband circuits in telecom applications. With a nominal voltage of 5V, this surface-mount IC has a very thin profile and terminal pitch of 0.65mm.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 6,317 parts In-Stock

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Digiode

USA . 3,357 parts In-Stock

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Anansix

USA . 673 parts In-Stock

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Parana Technologies

USA . 4,155 parts In-Stock

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$5.865

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$5.454

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$5.865

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IDEA Electronic Components Group

UK . 251 parts In-Stock

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$6.306

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$5.991

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DigiPath Technology Company

USA . 107 parts In-Stock

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$9.837

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$9.444

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MARBEL Systems

Belgium . 1,405 parts In-Stock

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$12.020

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Texas Native Microelectronics

USA . 120 parts In-Stock

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$13.816

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$13.263

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$12.849

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$12.158

120

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$12.158

AZTECH Wire

Italy . 898 parts In-Stock

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$16.122

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Kenton Components

USA . 1,781 parts In-Stock

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Qasali Group International

UK . 4,838 parts In-Stock

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$34.692

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$32.827

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Semicontronic

India . 1,326 parts In-Stock

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$577.000

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One Stop Electronics

USA . 2,740 parts In-Stock

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RC Electronics

USA . 23,908 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Corohmni

South Africa . 436 parts In-Stock

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Kepictronics

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Overview

Boost your cellphone's performance with the LT5519EUF by Analog Devices. Known for their top-notch quality and innovative designs, Analog Devices delivers cutting-edge Cellphone ICs that are sure to impress. This versatile chip carrier is perfect for a wide range of applications, from RF to baseband circuits. With a very thin profile and high temperature grade, this product offers unbeatable value and performance. Upgrade your device today with the LT5519EUF and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the Cellphone ICs, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and maintenance of the Cellphone ICs, making it user-friendly and convenient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, these Cellphone ICs can withstand harsh environmental conditions, ensuring optimal performance in various scenarios.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage simplifies the integration of these Cellphone ICs with existing systems, providing compatibility and ease of use.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuit capabilities in these Cellphone ICs enables them to efficiently handle telecommunications tasks, enhancing connectivity and communication functions.

Technical Specifications

Cellphone ICs LT5519EUF attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LT5519EUF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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