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Power Field Effect Transistors (FET)

Power Field Effect Transistors (FET) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as motor drives, power supplies, and switching regulators.

The Power FET is a three-terminal device that works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through a gate electrode. The gate electrode is insulated from the channel region by a thin oxide layer, which can be controlled by applying a voltage to the gate terminal. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.

Power FETs are designed to handle high current and voltage levels, and have a low on-resistance and high switching speed. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.

Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.

Power Field Effect Transistors (FET)

Available Parts 2,400+

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Avalanche Energy Rating (EAS) Case Connection Maximum Collector Current (IC) Configuration Minimum DC Current Gain (hFE) Minimum DS Breakdown Voltage Maximum Drain Current (Abs) (ID) Maximum Drain Current (ID) Maximum Drain-Source On Resistance Field Effect Transistor Technology Maximum Fall Time (tf) Maximum Feedback Capacitance (Crss) Maximum Gate-Emitter Threshold Voltage Highest Frequency Band JEDEC-95 Code JESD-30 Code JESD-609 Code Moisture Sensitivity Level (MSL) No. of Elements No. of Terminals Operating Mode Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Shape Package Style (Meter) Peak Reflow Temperature (C) Polarity or Channel Type Maximum Power Dissipation Ambient Maximum Power Dissipation (Abs) Maximum Pulsed Drain Current (IDM) Qualification Reference Standard Maximum Rise Time (tr) Sub-Category Surface Mount Terminal Finish Terminal Form Terminal Position Maximum Time At Peak Reflow Temperature (s) Transistor Application Transistor Element Material Maximum Turn Off Time (toff) Nominal Turn Off Time (toff) Maximum Turn On Time (ton) Nominal Turn On Time (ton) Maximum VCEsat
STP80N10F7 by STMicroelectronics

STP80N10F7

STMicroelectronics

STP80N10F7 by STMicroelectronics is a N-CHANNEL FET with 100V DS Breakdown Voltage, 80A ID, and 0.01 ohm RDS. It is used for SWITCHING applications in ENHANCEMENT MODE with 320A IDM. Operating temp range: -55 to 175 °C.

ULTRA LOW-ON RESISTANCE

DRAIN

SINGLE WITH BUILT-IN DIODE

100 V

80 A

80 A

.01 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

1

3

ENHANCEMENT MODE

175 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

110 W

320 A

NO

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

FDB7030BLS by Fairchild Semiconductor

FDB7030BLS

Fairchild Semiconductor

Fairchild Semiconductor's FDB7030BLS is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 160A IDM and 0.0105 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 100°C. Suitable for surface mount with GULL WING terminals, this transistor offers a max power dissipation of 65W in a RECTANGULAR package.

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

56 A

56 A

.0105 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e0

1

1

2

ENHANCEMENT MODE

100 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

65 W

160 A

Not Qualified

FET General Purpose Power

YES

Tin/Lead (Sn85Pb15)

GULL WING

SINGLE

SWITCHING

SILICON

IRFP450B by Fairchild Semiconductor

IRFP450B

Fairchild Semiconductor

Fairchild Semiconductor's IRFP450B is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 56A IDM, 990mJ EAS, and 0.39 ohm RDS(on), operating in ENHANCEMENT MODE at up to 150°C.

990 mJ

SINGLE WITH BUILT-IN DIODE

500 V

14 A

14 A

.39 ohm

METAL-OXIDE SEMICONDUCTOR

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

205 W

56 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

FQA24N50F by Fairchild Semiconductor

FQA24N50F

Fairchild Semiconductor

FQA24N50F by Fairchild Semiconductor is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 24A, Pulsed Drain Current of 96A, and an On Resistance of 0.2 ohm. The transistor operates in ENHANCEMENT MODE and has a Max Power Dissipation of 290W.

1100 mJ

SINGLE WITH BUILT-IN DIODE

500 V

24 A

24 A

.2 ohm

METAL-OXIDE SEMICONDUCTOR

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

290 W

96 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IXFH12N50F by IXYS Corporation

IXFH12N50F

IXYS Corporation

IXYS Corporation's IXFH12N50F is a N-CHANNEL FET with 500V DS breakdown voltage and 48A IDM. Ideal for switching applications, it operates in enhancement mode with 0.4 ohm RDS(on) and 150°C max temp.

AVALANCHE RATED

300 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

500 V

12 A

.4 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

48 A

Not Qualified

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

DMN2104L-7 by Diodes Incorporated

DMN2104L-7

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.4 W; Minimum DS Breakdown Voltage: 20 V; Peak Reflow Temperature (C): 260;

HIGH RELIABILITY

SINGLE WITH BUILT-IN DIODE

20 V

4.3 A

4.3 A

.053 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G3

e3

1

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

1.4 W

15 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

DMN3052LSS-13 by Diodes Incorporated

DMN3052LSS-13

Diodes Incorporated

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.5 W; Terminal Position: DUAL; No. of Elements: 1;

HIGH RELIABILITY

SINGLE WITH BUILT-IN DIODE

30 V

7.1 A

7.1 A

.03 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

2.5 W

28 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

DUAL

SWITCHING

SILICON

DMS2220LFW-7 by Diodes Incorporated

DMS2220LFW-7

Diodes Incorporated

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.5 W; JESD-609 Code: e4; Additional Features: HIGH RELIABILITY;

HIGH RELIABILITY

DRAIN

SINGLE WITH BUILT-IN DIODE

20 V

2.9 A

2.9 A

.095 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-N8

e4

1

1

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

1.5 W

10 A

Not Qualified

Other Transistors

YES

NICKEL PALLADIUM GOLD

NO LEAD

DUAL

SWITCHING

SILICON

STB12NM50ND by STMicroelectronics

STB12NM50ND

STMicroelectronics

STB12NM50ND by STMicroelectronics is a N-CHANNEL FET for SWITCHING applications. Features include 500V DS Breakdown Voltage, 44A Pulsed Drain Current, and 0.38 ohm On Resistance. Suitable for high-power switching circuits in various electronic devices.

350 mJ

DRAIN

SINGLE

500 V

11 A

11 A

.38 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

100 W

44 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

STD12NM50ND by STMicroelectronics

STD12NM50ND

STMicroelectronics

STD12NM50ND by STMicroelectronics is a N-CHANNEL FET for SWITCHING applications. It features a 500V DS Breakdown Voltage, 44A Pulsed Drain Current, and 0.38 ohm On Resistance. With a max power dissipation of 100W and operating temperature of 150 °C, it is ideal for high-power switching circuits.

350 mJ

DRAIN

SINGLE

500 V

11 A

11 A

.38 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

100 W

44 A

Not Qualified

FET General Purpose Power

YES

Matte Tin (Sn) - annealed

GULL WING

SINGLE

30

SWITCHING

SILICON

STD3NK60ZD by STMicroelectronics

STD3NK60ZD

STMicroelectronics

STD3NK60ZD by STMicroelectronics is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 9.6A Pulsed Drain Current, ideal for SWITCHING applications. It features a SINGLE configuration with BUILT-IN DIODE, operating in ENHANCEMENT MODE at up to 150 °C, making it suitable for high-power tasks.

150 mJ

SINGLE WITH BUILT-IN DIODE

600 V

2.4 A

2.4 A

3.6 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

45 W

9.6 A

Not Qualified

FET General Purpose Power

YES

Matte Tin (Sn) - annealed

GULL WING

SINGLE

30

SWITCHING

SILICON

STD40N2LH5 by STMicroelectronics

STD40N2LH5

STMicroelectronics

STD40N2LH5 by STMicroelectronics is a N-CHANNEL Power FET with 25V DS Breakdown Voltage and 160A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0155 ohm RDS(on), and 35W Pdiss in a PLASTIC/EPOXY package.

110 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

25 V

40 A

40 A

.0155 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

35 W

160 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

STF6N52K3 by STMicroelectronics

STF6N52K3

STMicroelectronics

STF6N52K3 by STMicroelectronics is a N-CHANNEL FET with 525V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max Pulsed Drain Current, 110mJ Avalanche Energy Rating, and 1.2ohm Max Drain-Source On Resistance. This METAL-OXIDE SEMICONDUCTOR transistor operates at up to 150 °C and has a power dissipation of 25W in a FLANGE MOUNT package.

ULTRA-LOW RESISTANCE

110 mJ

ISOLATED

SINGLE WITH BUILT-IN DIODE

525 V

5 A

5 A

1.2 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

25 W

20 A

Not Qualified

FET General Purpose Power

NO

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

STP180N10F3 by STMicroelectronics

STP180N10F3

STMicroelectronics

STP180N10F3 by STMicroelectronics is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has 120A Drain Current, 0.0048 ohm On Resistance, and 315W Power Dissipation. Ideal for SWITCHING applications in ENHANCEMENT MODE, it features a SINGLE configuration with BUILT-IN DIODE and operates at up to 175 °C.

SINGLE WITH BUILT-IN DIODE

100 V

120 A

120 A

.0048 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

NOT SPECIFIED

N-CHANNEL

315 W

480 A

Not Qualified

FET General Purpose Power

NO

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SWITCHING

SILICON

IPI057N08N3G by Infineon Technologies

IPI057N08N3G

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 150 W; Maximum Operating Temperature: 175 Cel; Operating Mode: ENHANCEMENT MODE;

210 mJ

SINGLE WITH BUILT-IN DIODE

80 V

80 A

80 A

.0057 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

150 W

320 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

DMC3018LSD-13 by Diodes Incorporated

DMC3018LSD-13

Diodes Incorporated

N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.5 W; Package Body Material: PLASTIC/EPOXY; Maximum Drain-Source On Resistance: .02 ohm;

HIGH RELIABILITY

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

30 V

9.1 A

9.1 A

.02 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-G8

e3

1

2

8

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL AND P-CHANNEL

2.5 W

32 A

Not Qualified

Other Transistors

YES

MATTE TIN

GULL WING

DUAL

30

SWITCHING

SILICON

NTMFS4823NT1G by Onsemi

NTMFS4823NT1G

Onsemi

NTMFS4823NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 85A IDM and 0.018 ohm RDS(ON), suitable for high-power operations. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power management in various electronic devices.

28.8 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

30 A

6.9 A

.018 ohm

METAL-OXIDE SEMICONDUCTOR

85 pF

R-PDSO-F6

e3

1

1

6

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

32.5 W

85 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

FLAT

DUAL

30

SWITCHING

SILICON

NTMFS4823NT3G by Onsemi

NTMFS4823NT3G

Onsemi

NTMFS4823NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 85A IDM, 28.8mJ EAS, and 0.018 ohm RDS(on). Operating from -55 to 150 °C, it has a max power dissipation of 32.5W in a SMALL OUTLINE package.

28.8 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

30 A

6.9 A

.018 ohm

METAL-OXIDE SEMICONDUCTOR

85 pF

R-PDSO-F6

e3

1

1

6

ENHANCEMENT MODE

150 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

32.5 W

85 A

Not Qualified

FET General Purpose Power

YES

TIN

FLAT

DUAL

30

SWITCHING

SILICON

IPB100N06S3-04 by Infineon Technologies

IPB100N06S3-04

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 214 W; Maximum Drain Current (Abs) (ID): 100 A; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

450 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

100 A

100 A

.0041 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

214 W

400 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SILICON

IPB100N06S3L-04 by Infineon Technologies

IPB100N06S3L-04

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 214 W; Maximum Operating Temperature: 175 Cel; Avalanche Energy Rating (EAS): 450 mJ;

LOGIC LEVEL COMPATIBLE

450 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

100 A

100 A

.0059 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

214 W

400 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SILICON

IPB45N06S3-16 by Infineon Technologies

IPB45N06S3-16

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 65 W; Operating Mode: ENHANCEMENT MODE; No. of Elements: 1;

95 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

45 A

45 A

.0154 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

65 W

180 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SILICON

IPB45N06S3L-13 by Infineon Technologies

IPB45N06S3L-13

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 65 W; JESD-609 Code: e3; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;

LOGIC LEVEL COMPATIBLE

95 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

45 A

45 A

.0131 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

65 W

180 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SILICON

IPB80N06S2L-H5 by Infineon Technologies

IPB80N06S2L-H5

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 300 W; Transistor Element Material: SILICON; Maximum Operating Temperature: 175 Cel;

LOGIC LEVEL COMPATIBLE

700 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.0062 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

300 W

320 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SILICON

IPB80N06S3L-05 by Infineon Technologies

IPB80N06S3L-05

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 165 W; JEDEC-95 Code: TO-263AB; Peak Reflow Temperature (C): 245;

LOGIC LEVEL COMPATIBLE

345 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.0077 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

245

N-CHANNEL

165 W

320 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPD30N06S2-15 by Infineon Technologies

IPD30N06S2-15

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 136 W; Maximum Operating Temperature: 175 Cel; Maximum Drain-Source On Resistance: .0147 ohm;

240 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

30 A

30 A

.0147 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

136 W

120 A

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

SINGLE

40

SILICON

IPD30N06S2L-13 by Infineon Technologies

IPD30N06S2L-13

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 136 W; Case Connection: DRAIN; No. of Terminals: 2;

LOGIC LEVEL COMPATIBLE

240 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

55 V

30 A

30 A

.017 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

136 W

200 A

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPI80N06S3-05 by Infineon Technologies

IPI80N06S3-05

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 165 W; Minimum DS Breakdown Voltage: 55 V; No. of Elements: 1;

345 mJ

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.0054 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

165 W

320 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SILICON

IPP100N06S3-04 by Infineon Technologies

IPP100N06S3-04

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 214 W; Maximum Drain-Source On Resistance: .0044 ohm; JESD-30 Code: R-PSFM-T3;

450 mJ

SINGLE WITH BUILT-IN DIODE

55 V

100 A

100 A

.0044 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

214 W

400 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SILICON

IPP100N06S3L-04 by Infineon Technologies

IPP100N06S3L-04

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 214 W; Maximum Drain-Source On Resistance: .0062 ohm; Avalanche Energy Rating (EAS): 450 mJ;

LOGIC LEVEL COMPATIBLE

450 mJ

SINGLE WITH BUILT-IN DIODE

55 V

100 A

100 A

.0062 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

214 W

400 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SILICON

IPP45N06S3L-13 by Infineon Technologies

IPP45N06S3L-13

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 65 W; No. of Elements: 1; Avalanche Energy Rating (EAS): 95 mJ;

LOGIC LEVEL COMPATIBLE

95 mJ

SINGLE WITH BUILT-IN DIODE

55 V

45 A

45 A

.0134 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

260

N-CHANNEL

65 W

180 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SILICON

IPP80N06S2L-07 by Infineon Technologies

IPP80N06S2L-07

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 210 W; Maximum Drain Current (ID): 80 A; Operating Mode: ENHANCEMENT MODE;

LOGIC LEVEL COMPATIBLE

450 mJ

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.01 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

210 W

320 A

Not Qualified

FET General Purpose Power

NO

TIN

THROUGH-HOLE

SINGLE

SILICON

IPP80N06S3-05 by Infineon Technologies

IPP80N06S3-05

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 165 W; Minimum DS Breakdown Voltage: 55 V; Terminal Position: SINGLE;

345 mJ

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.0054 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

165 W

320 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SILICON

IPP80N06S3L-05 by Infineon Technologies

IPP80N06S3L-05

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 165 W; Terminal Form: THROUGH-HOLE; Avalanche Energy Rating (EAS): 345 mJ;

LOGIC LEVEL COMPATIBLE

345 mJ

SINGLE WITH BUILT-IN DIODE

55 V

80 A

80 A

.008 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

165 W

320 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

FDB2532_F085 by Fairchild Semiconductor

FDB2532_F085

Fairchild Semiconductor

FDB2532_F085 by Fairchild Semiconductor is a N-CHANNEL Power FET with 150V DS Breakdown Voltage, 79A Drain Current, and 0.016 ohm On Resistance. It is used for SWITCHING applications in ENHANCEMENT MODE with a built-in DIODE. This transistor operates at up to 175°C and has a power dissipation of 310W in a small outline package.

400 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

150 V

79 A

8 A

.016 ohm

METAL-OXIDE SEMICONDUCTOR

TO-263AB

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

310 W

Not Qualified

FET General Purpose Power

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

FDD4243_F085 by Fairchild Semiconductor

FDD4243_F085

Fairchild Semiconductor

Fairchild Semiconductor's FDD4243_F085 is a P-CHANNEL Power FET with 40V DS Breakdown Voltage, 24A Drain Current, and 0.044 ohm On Resistance. Ideal for SWITCHING applications in automotive (AEC-Q101) and industrial sectors due to its high power dissipation of 42W and wide operating temperature range (-55 to 175 °C).

ULTRA-LOW RESISTANCE

84 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

40 V

24 A

14 A

.044 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

42 W

Not Qualified

AEC-Q101

Other Transistors

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

FDD6637_F085 by Fairchild Semiconductor

FDD6637_F085

Fairchild Semiconductor

FDD6637_F085 by Fairchild Semiconductor is a P-CHANNEL Power FET with 35V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Drain Current of 55A, 0.0116 ohm On Resistance, and operates in ENHANCEMENT MODE. This METAL-OXIDE SEMICONDUCTOR transistor has a max power dissipation of 57W and can withstand temperatures up to 175°C.

ULTRA-LOW RESISTANCE

61 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

35 V

55 A

21 A

.0116 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

-55 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

57 W

Not Qualified

AEC-Q101

Other Transistors

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

STP130NH02L by STMicroelectronics

STP130NH02L

STMicroelectronics

STP130NH02L by STMicroelectronics is a N-CHANNEL FET with 24V DS Breakdown Voltage, 360A IDM, and 0.0044 ohm RDS(on). Ideal for SWITCHING applications due to its 175°C Max Operating Temp and 150W Power Dissipation. It features SINGLE configuration with BUILT-IN DIODE in a RECTANGULAR package.

LOW THRESHOLD

900 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

24 V

90 A

90 A

.0044 ohm

METAL-OXIDE SEMICONDUCTOR

TO-220AB

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

150 W

360 A

Not Qualified

FET General Purpose Power

NO

MATTE TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

SPI47N10 by Infineon Technologies

SPI47N10

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 175 W; Additional Features: AVALANCHE RATED; Maximum Pulsed Drain Current (IDM): 188 A;

AVALANCHE RATED

400 mJ

SINGLE WITH BUILT-IN DIODE

100 V

47 A

47 A

.033 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

1

3

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

175 W

188 A

Not Qualified

FET General Purpose Power

NO

THROUGH-HOLE

SINGLE

SILICON

DMP3025LK3-13 by Diodes Incorporated

DMP3025LK3-13

Diodes Incorporated

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 10 W; Package Shape: RECTANGULAR; Qualification: Not Qualified;

DRAIN

SINGLE WITH BUILT-IN DIODE

30 V

16.1 A

10.6 A

.025 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

P-CHANNEL

10 W

41.9 A

Not Qualified

Other Transistors

YES

MATTE TIN

GULL WING

SINGLE

30

SWITCHING

SILICON

STW22NM60N by STMicroelectronics

STW22NM60N

STMicroelectronics

STW22NM60N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 16A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

AVALANCHE RATED

300 mJ

SINGLE WITH BUILT-IN DIODE

600 V

16 A

16 A

.22 ohm

METAL-OXIDE SEMICONDUCTOR

TO-247

R-PSFM-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

125 W

64 A

Not Qualified

FET General Purpose Power

NO

Matte Tin (Sn)

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

IPD50R520CP by Infineon Technologies

IPD50R520CP

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 66 W; Maximum Drain Current (Abs) (ID): 7.1 A; JESD-609 Code: e3;

166 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

500 V

7.1 A

7.1 A

.52 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

175 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

66 W

15 A

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPI50R350CP by Infineon Technologies

IPI50R350CP

Infineon Technologies

IPI50R350CP by Infineon is a N-CHANNEL Power FET with 500V DS Breakdown Voltage. It has a max IDM of 22A and EAS of 246mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers 0.35 ohm RDS(on) and can handle up to 89W power dissipation at 150°C.

246 mJ

SINGLE WITH BUILT-IN DIODE

500 V

10 A

10 A

.35 ohm

METAL-OXIDE SEMICONDUCTOR

TO-262AA

R-PSIP-T3

e3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

N-CHANNEL

89 W

22 A

Not Qualified

FET General Purpose Power

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

NTMFS5844NLT1G by Onsemi

NTMFS5844NLT1G

Onsemi

NTMFS5844NLT1G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, 243A IDM, and 0.016 ohm RDS(on). Ideal for power management applications due to its 107W Pdiss, EAS of 48mJ, and operating temp up to 150°C. Suitable for surface mount designs with small outline package style.

48 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

60 V

61 A

11 A

.016 ohm

METAL-OXIDE SEMICONDUCTOR

R-PDSO-F5

e3

1

1

5

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

260

N-CHANNEL

107 W

243 A

Not Qualified

FET General Purpose Power

YES

MATTE TIN

FLAT

DUAL

30

SILICON

NTMFS4834NT3G by Onsemi

NTMFS4834NT3G

Onsemi

Power Field-Effect Transistors; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

130 A

e3

1

260

Not Qualified

FET General Purpose Power

TIN

30

IRF6648TR1PBF by International Rectifier

IRF6648TR1PBF

International Rectifier

IRF6648TR1PBF by International Rectifier is an N-CHANNEL power FET with a min DS breakdown voltage of 60V. It is used for switching applications and has a max pulsed drain current of 260A.

LOW CONDUCTION LOSS

47 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

60 V

86 A

86 A

.007 ohm

METAL-OXIDE SEMICONDUCTOR

R-XBCC-N3

e1

1

1

3

ENHANCEMENT MODE

150 Cel

UNSPECIFIED

RECTANGULAR

CHIP CARRIER

260

N-CHANNEL

2.8 W

260 A

Not Qualified

FET General Purpose Power

YES

TIN SILVER COPPER

NO LEAD

BOTTOM

30

SWITCHING

SILICON

IPD50R399CP by Infineon Technologies

IPD50R399CP

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 83 W; JESD-30 Code: R-PSSO-G2; Avalanche Energy Rating (EAS): 215 mJ;

215 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE

500 V

9 A

9 A

.399 ohm

METAL-OXIDE SEMICONDUCTOR

TO-252AA

R-PSSO-G2

e3

1

1

2

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

SMALL OUTLINE

N-CHANNEL

83 W

20 A

Not Qualified

FET General Purpose Power

YES

TIN

GULL WING

SINGLE

SWITCHING

SILICON

IPS50R520CP by Infineon Technologies

IPS50R520CP

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 66 W; JESD-30 Code: R-PSIP-T3; Maximum Operating Temperature: 150 Cel;

166 mJ

SINGLE WITH BUILT-IN DIODE

500 V

7.1 A

7.1 A

.52 ohm

METAL-OXIDE SEMICONDUCTOR

TO-251

R-PSIP-T3

1

3

ENHANCEMENT MODE

150 Cel

PLASTIC/EPOXY

RECTANGULAR

IN-LINE

NOT SPECIFIED

N-CHANNEL

66 W

15 A

Not Qualified

FET General Purpose Power

NO

THROUGH-HOLE

SINGLE

NOT SPECIFIED

SILICON

BTS244ZE-3043 by Infineon Technologies

BTS244ZE-3043

Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR; Surface Mount: NO; Maximum Power Dissipation (Abs): 170 W; Transistor Application: SWITCHING; JEDEC-95 Code: TO-220;

AVALANCHE RATED

1650 mJ

DRAIN

SINGLE WITH BUILT-IN DIODE AND TEMPERATURE SENSOR

55 V

35 A

.018 ohm

METAL-OXIDE SEMICONDUCTOR

400 pF

TO-220

R-PSFM-T5

e3

1

5

ENHANCEMENT MODE

175 Cel

-40 Cel

PLASTIC/EPOXY

RECTANGULAR

FLANGE MOUNT

N-CHANNEL

170 W

188 A

Not Qualified

AEC-Q101

NO

TIN

THROUGH-HOLE

SINGLE

SWITCHING

SILICON

100 ns

130 ns