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NTMFS4823NT1G

Onsemi

NTMFS4823NT1G by Onsemi

NTMFS4823NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 85A IDM and 0.018 ohm RDS(ON), suitable for high-power operations. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power management in various electronic devices.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 132,000 parts In-Stock

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-

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$0.516

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$0.325

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$0.516

$0.325

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Rochester

USA . 131,000 parts In-Stock

1+ parts

-

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$0.320

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$0.266

10k+ parts

$0.237

131,000

-

$0.320

$0.266

$0.237

Verical

USA . 131,000 parts In-Stock

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$0.296

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$0.296

Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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1,500

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Digiode

USA . 1,268 parts In-Stock

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$0.250

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$0.250

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Vyrian

USA . 6,096 parts In-Stock

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Flip Electronics

USA . 1,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 806 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,079 parts In-Stock

1+ parts

$0.237

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2,079

$0.237

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Corohmni

South Africa . 183 parts In-Stock

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$0.263

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183

$0.263

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Component Stockers USA

USA . 80,052 parts In-Stock

1+ parts

$0.270

100+ parts

$0.250

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$0.230

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$0.230

80,052

$0.270

$0.250

$0.230

$0.230

Continental Prestige Electronics

USA . 132,000 parts In-Stock

1+ parts

$0.871

100+ parts

$0.516

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132,000

$0.871

$0.516

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Benley Electronics

USA . 7 parts In-Stock

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$1.000

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7

$1.000

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AZTECH Wire

Italy . 288 parts In-Stock

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$21.130

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288

$21.130

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QUARKTWIN TECHNOLOGY LTD

USA . 21,955 parts In-Stock

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TANS Electronics

Latvia . 8,208 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 2,130 parts In-Stock

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Assy Fe

Spain . 1,718 parts In-Stock

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Metaverse IC Inc.

Canada . 1,470 parts In-Stock

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Authorized Procurement Solutions

USA . 1,300 parts In-Stock

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GreenTree Electronics

Israel . 1,300 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 642 parts In-Stock

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UHIMA Technologies

Türkiye . 641 parts In-Stock

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Problanco Electronics

Mexico . 527 parts In-Stock

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Futuretech Components

Singapore . 506 parts In-Stock

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Kulean Microsystems

USA . 53 parts In-Stock

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Overview

Experience superior performance and reliability with the NTMFS4823NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Field Effect Transistors (FET) like no other. Ideal for switching applications, this N-CHANNEL transistor offers enhanced efficiency and power management capabilities. With a maximum drain current of 30A and an on-resistance of only 0.018 ohm, this FET ensures optimal functionality and durability. Trust Onsemi to provide you with innovative solutions that meet your power management needs and elevate your applications to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and good thermal conductivity, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher mobility, which results in better efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against voltage spikes and reverse polarity, enhancing the overall robustness of the product.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low power dissipation, ideal for efficient power management.

Surface Mount: YES

Being surface mountable makes installation easier and allows for higher packing densities on PCBs, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown, ensuring reliability in various operating conditions.

Maximum Pulsed Drain Current (IDM): 85 A

Capable of handling high pulsed currents, this FET is suitable for applications requiring brief periods of high power dissipation.

Avalanche Energy Rating (EAS): 28.8 mJ

The high avalanche energy rating means the FET can withstand energy spikes, ensuring protection against voltage transients and enhancing overall reliability.

Maximum Drain-Source On Resistance: 0.018 ohm

With low ON resistance, this FET minimizes power losses and heat dissipation, enhancing efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4823NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

28.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

6.9 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

85 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

85 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4823NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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