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NTMFS5C404NLT1G

Onsemi

NTMFS5C404NLT1G by Onsemi

NTMFS5C404NLT1G by Onsemi is a N-CHANNEL FET with 339A max drain current and 167W power dissipation. Ideal for high-power applications, it operates at up to 150°C, making it suitable for industrial use in surface-mount configurations.

Median Price

$3.325

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$1.872

100+ parts

-

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5

$1.872

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Bürklin Elektronik

Germany . 1,490 parts In-Stock

1+ parts

$2.990

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1,490

$2.990

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Mouser Electronics

USA . 3,386 parts In-Stock

1+ parts

$3.660

100+ parts

$2.320

1k+ parts

$2.010

10k+ parts

$1.810

3,386

$3.660

$2.320

$2.010

$1.810

DigiKey

USA . 3,451 parts In-Stock

1+ parts

$5.980

100+ parts

$2.885

1k+ parts

$2.849

10k+ parts

$2.328

3,451

$5.980

$2.885

$2.849

$2.328

Verical

USA . 5 parts In-Stock

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5

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Digiode

USA . 200 parts In-Stock

1+ parts

$1.820

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200

$1.820

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Nova Conductors

Japan . 92 parts In-Stock

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$4.048

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92

$4.048

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Chip Stock

USA . 63,238 parts In-Stock

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63,238

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Vyrian

USA . 1,494 parts In-Stock

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1,494

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Sensible Micro Corp

USA . 1,438 parts In-Stock

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1,438

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Speed Components Ltd

Israel . 105 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,450 parts In-Stock

1+ parts

$1.480

100+ parts

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2,450

$1.480

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Semicontronic

India . 1,473 parts In-Stock

1+ parts

$1.630

100+ parts

$1.589

1k+ parts

$1.581

10k+ parts

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1,473

$1.630

$1.589

$1.581

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Ampacity Inc.

Singapore . 1,017 parts In-Stock

1+ parts

$1.630

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1,017

$1.630

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Corphita

USA . 2,160 parts In-Stock

1+ parts

$1.724

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2,160

$1.724

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Corohmni

South Africa . 204 parts In-Stock

1+ parts

$1.916

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204

$1.916

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Continental Prestige Electronics

USA . 3,703 parts In-Stock

1+ parts

$4.048

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$3.967

3,703

$4.048

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$3.967

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.048

100+ parts

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$3.845

10k+ parts

$3.764

100

$4.048

-

$3.845

$3.764

Argo Parts USA

USA . 77 parts In-Stock

1+ parts

$4.048

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77

$4.048

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Microchip USA

USA . 8,044 parts In-Stock

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$23.148

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8,044

$23.148

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Kepictronics

USA . 65,000 parts In-Stock

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Lixinc

USA . 19,672 parts In-Stock

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TANS Electronics

Latvia . 7,710 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,659 parts In-Stock

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6,659

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SupplyDigital Components

Austria . 3,589 parts In-Stock

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Kulean Microsystems

USA . 3,343 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,239 parts In-Stock

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1,239

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UHIMA Technologies

Türkiye . 61 parts In-Stock

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61

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the NTMFS5C404NLT1G from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. This N-CHANNEL FET offers unmatched performance and reliability, with a high maximum drain current and power dissipation. Experience the benefits of cutting-edge METAL-OXIDE SEMICONDUCTOR technology, ensuring optimal efficiency and durability. Trust Onsemi to provide you with the value and advantage you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching capabilities, making them suitable for various power applications.

Configuration: SINGLE

Single configuration FETs are easier to control and integrate into circuits compared to multiple configuration FETs, providing simplicity in design.

Surface Mount: YES

Surface mount FETs are compact, lightweight, and easy to assemble, making them ideal for space-constrained applications and automated manufacturing processes.

Maximum Drain Current (Abs) (ID): 339 A

With a high maximum drain current rating, this FET can handle heavy loads and provide reliable performance in power applications requiring high current.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation rating ensures the FET can efficiently dissipate heat generated during operation, leading to improved reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low gate voltage operation, high input impedance, and high speed switching characteristics, making them suitable for power switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate reliably in elevated temperature environments, ensuring stable performance under varying conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides good solderability and corrosion resistance, while the annealed finish improves the durability of the connections for long-term usage.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature allows for quick and efficient soldering during assembly, reducing the risk of thermal damage to the FET.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the FET to the circuit board, leading to reliable electrical connections and performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5C404NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

339 A

Maximum Drain Current (ID):

339 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS5C404NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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