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NTMFS4937NT1G

Onsemi

NTMFS4937NT1G by Onsemi

NTMFS4937NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 210A IDM, and 0.007 ohm RDS(on). Ideal for SWITCHING applications, it features a built-in diode, 43W power dissipation, and operates in ENHANCEMENT MODE. Suitable for high-power electronics requiring efficient switching capabilities.

Median Price

$0.368

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 15 parts In-Stock

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$0.169

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15

$0.169

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Farnell

UK . 14,118 parts In-Stock

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$1.063

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$0.678

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$0.429

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14,118

$1.063

$0.678

$0.429

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Rochester

USA . 70,366 parts In-Stock

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-

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$0.346

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$0.287

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$0.256

70,366

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$0.346

$0.287

$0.256

Verical

USA . 42,700 parts In-Stock

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$0.390

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$0.320

42,700

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$0.390

$0.320

Distributors (In-Stock)

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Digiode

USA . 587 parts In-Stock

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$0.822

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587

$0.822

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Bristol Electronics

USA . 966 parts In-Stock

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$1.800

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$1.116

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$0.675

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966

$1.800

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$0.675

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Chip Stock

USA . 73,261 parts In-Stock

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Flip Electronics

USA . 25,500 parts In-Stock

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Vyrian

USA . 8,537 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 966 parts In-Stock

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Dan-Mar Components

USA . 966 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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LWI Electronics Inc

India . 40 parts In-Stock

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Semicontronic

India . 21,863 parts In-Stock

1+ parts

$0.166

100+ parts

$0.162

1k+ parts

$0.161

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21,863

$0.166

$0.162

$0.161

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Ampacity Inc.

Singapore . 18,773 parts In-Stock

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$0.740

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18,773

$0.740

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.766

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$0.728

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$0.728

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600

$0.766

$0.728

$0.728

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Corphita

USA . 1,299 parts In-Stock

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$0.778

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1,299

$0.778

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Continental Prestige Electronics

USA . 25,035 parts In-Stock

1+ parts

$0.841

100+ parts

$0.536

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$0.339

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25,035

$0.841

$0.536

$0.339

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Corohmni

South Africa . 278 parts In-Stock

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$0.865

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278

$0.865

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Aztec Data Supply Inc.

USA . 368 parts In-Stock

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$0.970

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368

$0.970

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Microchip USA

USA . 386 parts In-Stock

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$5.785

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AZTECH Wire

Italy . 972 parts In-Stock

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$10.730

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S.R.D Solutions

India . 231,000 parts In-Stock

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Lixinc

USA . 13,418 parts In-Stock

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TANS Electronics

Latvia . 8,315 parts In-Stock

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SupplyDigital Components

Austria . 6,240 parts In-Stock

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Kulean Microsystems

USA . 4,815 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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A-Z Elektronik GmbH

Germany . 2,328 parts In-Stock

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Futuretech Components

Singapore . 1,175 parts In-Stock

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Assy Fe

Spain . 1,160 parts In-Stock

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iodParts Technologies Inc.

India . 966 parts In-Stock

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Problanco Electronics

Mexico . 917 parts In-Stock

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Argo Parts USA

USA . 484 parts In-Stock

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UHIMA Technologies

Türkiye . 362 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the power of seamless switching with the NTMFS4937NT1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor boasts a single configuration with a built-in diode, perfect for various applications. Experience enhanced performance with a maximum pulsed drain current of 210 A and a low on-resistance of 0.007 ohm. Trust in Onsemi's cutting-edge technology to deliver reliable results every time. Embrace efficiency, reliability, and innovation with the NTMFS4937NT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have better performance and lower resistance compared to P-CHANNEL FETs, making this product a good choice for high power applications.

Minimum DS Breakdown Voltage: 30 V

With a high minimum breakdown voltage, this FET can withstand higher voltages without failing, making it suitable for demanding applications.

Maximum Pulsed Drain Current (IDM): 210 A

The high maximum pulsed drain current capability allows this FET to handle large currents for short durations, making it ideal for high-power switching applications.

Maximum Power Dissipation (Abs): 43 W

The high maximum power dissipation rating indicates that this FET can handle significant power without overheating, ensuring reliability in operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in a wide range of temperature environments, increasing its versatility and reliability.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4937NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

68.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

17.1 A

Maximum Drain Current (ID):

10.2 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

210 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4937NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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