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NTMFS5832NLT1G

Onsemi

NTMFS5832NLT1G by Onsemi

NTMFS5832NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 443A pulsed drain current. Ideal for applications requiring high power dissipation and low on-resistance in small outline packages.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 5,070 parts In-Stock

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$0.290

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$0.220

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$0.190

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5,070

$0.290

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Digiode

USA . 1,584 parts In-Stock

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$0.276

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Flip Electronics

USA . 27,000 parts In-Stock

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Chip Stock

USA . 9,730 parts In-Stock

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Vyrian

USA . 4,667 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Bristol Electronics

USA . 159 parts In-Stock

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Atlantic Semiconductor

USA . 147 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 4,747 parts In-Stock

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$0.246

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$0.240

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$0.239

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4,747

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$0.239

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Ampacity Inc.

Singapore . 4,713 parts In-Stock

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$0.246

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Corphita

USA . 1,233 parts In-Stock

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$0.261

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Continental Prestige Electronics

USA . 5,070 parts In-Stock

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$0.290

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$0.220

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Corohmni

South Africa . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 306 parts In-Stock

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$0.380

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306

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Component Stockers USA

USA . 818 parts In-Stock

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$7.710

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$7.330

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AZTECH Wire

Italy . 872 parts In-Stock

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$12.270

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Authorized Procurement Solutions

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Lixinc

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Problanco Electronics

Mexico . 7,180 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,094 parts In-Stock

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SupplyDigital Components

Austria . 5,186 parts In-Stock

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Kulean Microsystems

USA . 4,444 parts In-Stock

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TANS Electronics

Latvia . 3,756 parts In-Stock

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Kepictronics

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Argo Parts USA

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 53 parts In-Stock

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iodParts Technologies Inc.

India . 1 parts In-Stock

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Overview

Unlock the power of innovation with the NTMFS5832NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This Power FET is designed for various applications, offering efficient performance and enhanced functionality. Experience seamless operation with its built-in diode configuration and N-channel polarity. Trust in Onsemi's expertise to deliver exceptional value and benefits to meet all your power needs. Elevate your projects with the NTMFS5832NLT1G and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and low ON resistance, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the circuit from voltage spikes, ensuring the safety of the overall system.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer high input impedance, making them ideal for switching applications.

Maximum Power Dissipation (Abs): 96 W

The high power dissipation capability of this FET allows it to handle large amounts of power without overheating.

Maximum Drain-Source On Resistance: 0.0065 ohm

The low on-resistance of the FET results in minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS5832NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

134 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

111 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.0065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

443 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFS5832NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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