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NTMFD5C446NLT1G

Onsemi

NTMFD5C446NLT1G by Onsemi

NTMFD5C446NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 2 elements with built-in diode configuration, and 644A max pulsed drain current. Ideal for applications requiring high power dissipation and operating temperatures up to 175°C. Suitable for use in various electronic devices due to its small outline package style and low drain-source resistance of 0.0039 ohm.

Median Price

$2.330

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 880 parts In-Stock

1+ parts

$2.300

100+ parts

$0.999

1k+ parts

$0.796

10k+ parts

-

880

$2.300

$0.999

$0.796

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Mouser Electronics

USA . 329 parts In-Stock

1+ parts

$2.360

100+ parts

$1.020

1k+ parts

-

10k+ parts

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329

$2.360

$1.020

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Flip Electronics (Authorized)

USA . 1,500 parts In-Stock

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-

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1,500

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Distributors (In-Stock)

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Digiode

USA . 518 parts In-Stock

1+ parts

$2.118

100+ parts

-

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518

$2.118

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$3.630

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15

$3.630

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Chip Stock

USA . 39,000 parts In-Stock

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39,000

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Vyrian

USA . 2,546 parts In-Stock

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2,546

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Flip Electronics

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$1.181

100+ parts

$1.075

1k+ parts

$0.968

10k+ parts

-

20

$1.181

$1.075

$0.968

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Corphita

USA . 1,955 parts In-Stock

1+ parts

$2.007

100+ parts

-

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1,955

$2.007

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$2.230

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59

$2.230

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Argo Parts USA

USA . 4,698 parts In-Stock

1+ parts

$3.620

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4,698

$3.620

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Continental Prestige Electronics

USA . 679 parts In-Stock

1+ parts

$3.620

100+ parts

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1k+ parts

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10k+ parts

$3.548

679

$3.620

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-

$3.548

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

$3.449

10k+ parts

$3.376

2,000

$3.630

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$3.449

$3.376

Ampacity Inc.

Singapore . 2,460 parts In-Stock

1+ parts

$4.130

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2,460

$4.130

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Microchip USA

USA . 8,287 parts In-Stock

1+ parts

$23.254

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8,287

$23.254

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Problanco Electronics

Mexico . 7,532 parts In-Stock

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7,532

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Kulean Microsystems

USA . 6,717 parts In-Stock

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6,717

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SupplyDigital Components

Austria . 6,359 parts In-Stock

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6,359

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 506 parts In-Stock

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506

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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350

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Overview

Elevate your power management solutions with the NTMFD5C446NLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that offer reliability and efficiency. This N-CHANNEL configuration comes with separate elements and a built-in diode, making it perfect for various applications. From enhancing performance to maximizing power dissipation, this FET provides unmatched value to customers looking for high-quality components.Upgrade your power systems today with Onsemi's NTMFD5C446NLT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and insulation, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for high-performance applications.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB integration, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 40 V

A high breakdown voltage ensures the FET can handle higher voltages, providing reliability in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer better performance, making this product suitable for various power management applications.

Maximum Pulsed Drain Current (IDM): 644 A

The high pulsed drain current rating allows for handling large current spikes, making this FET suitable for high-power applications.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this FET can handle significant power loads without overheating.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can operate reliably in harsh environmental conditions.

Maximum Drain-Source On Resistance: 0.0039 ohm

Low on-resistance results in minimal power loss and efficient power handling, making this FET suitable for high-speed switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD5C446NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

171 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

145 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0039 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

48 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

644 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFD5C446NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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