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NTMFD5C674NLT1G

Onsemi

NTMFD5C674NLT1G by Onsemi

NTMFD5C674NLT1G by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. Featuring 2 elements with built-in diode, it has a max IDM of 119A and EAS of 61mJ. Ideal for power applications requiring high drain current handling and low on-resistance in a small outline package.

Median Price

$1.495

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 680 parts In-Stock

1+ parts

$1.250

100+ parts

$0.517

1k+ parts

$0.402

10k+ parts

$0.288

680

$1.250

$0.517

$0.402

$0.288

Newark

USA . 977 parts In-Stock

1+ parts

$1.290

100+ parts

$0.531

1k+ parts

$0.414

10k+ parts

-

977

$1.290

$0.531

$0.414

-

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$1.450

100+ parts

$0.590

1k+ parts

-

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141

$1.450

$0.590

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-

Arrow

USA . 1,500 parts In-Stock

1+ parts

$1.540

100+ parts

$1.468

1k+ parts

$1.397

10k+ parts

$1.397

1,500

$1.540

$1.468

$1.397

$1.397

Farnell

UK . 2,298 parts In-Stock

1+ parts

-

100+ parts

$1.630

1k+ parts

$1.550

10k+ parts

$1.320

2,298

-

$1.630

$1.550

$1.320

Element14

Singapore . 2,298 parts In-Stock

1+ parts

-

100+ parts

$2.900

1k+ parts

$2.350

10k+ parts

$2.240

2,298

-

$2.900

$2.350

$2.240

RS (Exports)

UK . 1,500 parts In-Stock

1+ parts

-

100+ parts

$2.261

1k+ parts

$2.091

10k+ parts

-

1,500

-

$2.261

$2.091

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Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$0.288

1,500

-

-

-

$0.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 325 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

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325

$1.102

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.965

100+ parts

-

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300

$1.965

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Chip Stock

USA . 22,500 parts In-Stock

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22,500

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Vyrian

USA . 2,344 parts In-Stock

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2,344

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Flip Electronics

USA . 1,500 parts In-Stock

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1,500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,927 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

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1,927

$0.990

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Semicontronic

India . 1,802 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

-

1,802

$0.990

$0.965

$0.960

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Corphita

USA . 335 parts In-Stock

1+ parts

$1.044

100+ parts

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335

$1.044

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Corohmni

South Africa . 284 parts In-Stock

1+ parts

$1.160

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284

$1.160

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Continental Prestige Electronics

USA . 1,501 parts In-Stock

1+ parts

$1.370

100+ parts

$0.925

1k+ parts

$0.670

10k+ parts

-

1,501

$1.370

$0.925

$0.670

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Aztec Data Supply Inc.

USA . 121 parts In-Stock

1+ parts

$1.560

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121

$1.560

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Argo Parts USA

USA . 2,932 parts In-Stock

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$1.965

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2,932

$1.965

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Netroflash

USA . 100 parts In-Stock

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$1.965

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100

$1.965

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Microchip USA

USA . 9,936 parts In-Stock

1+ parts

$11.456

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9,936

$11.456

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RC Electronics

USA . 39,029 parts In-Stock

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39,029

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iodParts Technologies Inc.

India . 18,000 parts In-Stock

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Lixinc

USA . 16,513 parts In-Stock

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Problanco Electronics

Mexico . 2,948 parts In-Stock

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2,948

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Kulean Microsystems

USA . 2,789 parts In-Stock

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2,789

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SupplyDigital Components

Austria . 2,302 parts In-Stock

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UHIMA Technologies

Türkiye . 764 parts In-Stock

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764

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TANS Electronics

Latvia . 321 parts In-Stock

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321

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Overview

Enhance your power management solutions with the NTMFD5C674NLT1G by Onsemi. Crafted with precision and quality, this N-CHANNEL Power FET offers reliability and efficiency in a compact design. Perfect for applications requiring high performance, this transistor features an enhanced mode for optimal operation. With a maximum drain current of 42 A and a minimum DS breakdown voltage of 60 V, this product delivers exceptional power dissipation and durability. Trust Onsemi's cutting-edge technology to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection against environmental factors, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and higher current carrying capabilities compared to P-Channel, making them efficient for various applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, while the separate elements provide versatility in circuit design and functionality.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing overall production costs and improving space utilization.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltage applications without risk of damage or failure.

Maximum Power Dissipation (Abs): 37 W

The high power dissipation rating ensures the FET can handle high power loads and operate efficiently without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NTMFD5C674NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

61 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

42 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.0204 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7.7 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

119 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMFD5C674NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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