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NTMFS002P03P8ZT1G

Onsemi

NTMFS002P03P8ZT1G by Onsemi

NTMFS002P03P8ZT1G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max ID of 34.6A, 0.0017 ohm Drain-Source Resistance, and 138.9W Power Dissipation. With METAL-OXIDE SEMICONDUCTOR technology and ENHANCEMENT MODE operation, it offers high performance in a small outline package.

Median Price

$1.509

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,307 parts In-Stock

1+ parts

$3.610

100+ parts

$1.720

1k+ parts

-

10k+ parts

-

2,307

$3.610

$1.720

-

-

Rochester

USA . 618,020 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.230

10k+ parts

$1.090

618,020

-

$1.480

$1.230

$1.090

Verical

USA . 476,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.538

10k+ parts

$1.363

476,600

-

-

$1.538

$1.363

DigiKey

USA . 4,490 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$1.090

4,490

-

-

-

$1.090

Arrow

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

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$1.139

1,500

-

-

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$1.139

RS (Exports)

UK . 1,250 parts In-Stock

1+ parts

-

100+ parts

$2.087

1k+ parts

$1.978

10k+ parts

-

1,250

-

$2.087

$1.978

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,277 parts In-Stock

1+ parts

$1.150

100+ parts

-

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1,277

$1.150

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Component Electronics Inc.

Canada . 1,000 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

1,000

$1.540

$1.150

$1.000

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.064

100+ parts

-

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500

$2.064

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Vyrian

USA . 153,287 parts In-Stock

1+ parts

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153,287

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Sensible Micro Corp

USA . 13,582 parts In-Stock

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13,582

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Chip Stock

USA . 10,962 parts In-Stock

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Flip Electronics

USA . 10,458 parts In-Stock

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10,458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 136 parts In-Stock

1+ parts

$1.089

100+ parts

-

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136

$1.089

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Corohmni

South Africa . 204 parts In-Stock

1+ parts

$1.210

100+ parts

-

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204

$1.210

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$2.023

100+ parts

-

1k+ parts

$1.942

10k+ parts

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2,000

$2.023

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$1.942

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Argo Parts USA

USA . 3,751 parts In-Stock

1+ parts

$2.064

100+ parts

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3,751

$2.064

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Continental Prestige Electronics

USA . 99 parts In-Stock

1+ parts

$2.064

100+ parts

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10k+ parts

$2.023

99

$2.064

-

-

$2.023

Ampacity Inc.

Singapore . 153,024 parts In-Stock

1+ parts

$2.240

100+ parts

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153,024

$2.240

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Microchip USA

USA . 7,537 parts In-Stock

1+ parts

$11.119

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7,537

$11.119

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Lixinc

USA . 13,972 parts In-Stock

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13,972

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SupplyDigital Components

Austria . 6,382 parts In-Stock

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6,382

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TANS Electronics

Latvia . 5,353 parts In-Stock

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Problanco Electronics

Mexico . 2,028 parts In-Stock

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Perfect Parts

USA . 1,210 parts In-Stock

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1,210

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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Kulean Microsystems

USA . 41 parts In-Stock

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Overview

Unleash the power of innovation with the NTMFS002P03P8ZT1G by Onsemi. As a leader in Power Field Effect Transistors, Onsemi delivers top-notch quality and reliability in every product. Ideal for switching applications, this P-Channel FET offers unparalleled performance with its high drain current and low on-resistance. With a built-in diode and small outline package, this transistor is perfect for compact designs. Trust Onsemi to provide cutting-edge technology that exceeds expectations and brings value to your projects. Elevate your designs with the NTMFS002P03P8ZT1G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable in various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs can offer lower on-resistance and higher current-carrying capabilities compared to N-channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse currents, enhancing the efficiency of the switching operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient transitions between on and off states.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, reducing assembly time and enabling compact designs.

Maximum Drain Current (Abs) (ID): 226 A

High maximum drain current capability allows the FET to handle large loads without overheating, making it suitable for high-current applications.

Maximum Power Dissipation (Abs): 138.9 W

With a high power dissipation rating, the FET can handle substantial power levels while maintaining stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide easy gate control and low input capacitance, improving efficiency and enabling rapid switching.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without performance degradation, ensuring reliability in demanding conditions.

Maximum Drain-Source On Resistance: 0.0017 ohm

Low on-resistance leads to reduced power losses and heat generation, contributing to overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS002P03P8ZT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

226 A

Maximum Drain Current (ID):

34.6 A

Maximum Drain-Source On Resistance:

.0017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4880 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS002P03P8ZT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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