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STP180N10F3

STMicroelectronics

STP180N10F3 by STMicroelectronics

STP180N10F3 by STMicroelectronics is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has 120A Drain Current, 0.0048 ohm On Resistance, and 315W Power Dissipation. Ideal for SWITCHING applications in ENHANCEMENT MODE, it features a SINGLE configuration with BUILT-IN DIODE and operates at up to 175 °C.

Median Price

$5.990

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 918 parts In-Stock

1+ parts

$5.990

100+ parts

$2.890

1k+ parts

$2.413

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918

$5.990

$2.890

$2.413

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Distributors (In-Stock)

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Bristol Electronics

USA . 190 parts In-Stock

1+ parts

$4.401

100+ parts

$2.068

1k+ parts

$1.980

10k+ parts

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190

$4.401

$2.068

$1.980

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Digiode

USA . 2,576 parts In-Stock

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$5.690

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2,576

$5.690

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Vyrian

USA . 1,998 parts In-Stock

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1,998

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

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Anansix

USA . 516 parts In-Stock

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516

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Dan-Mar Components

USA . 190 parts In-Stock

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190

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ACDS - Activité Composants Distribution Service

France . 140 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.544

100+ parts

$0.495

1k+ parts

$0.446

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270

$0.544

$0.495

$0.446

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IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$0.627

100+ parts

-

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$0.564

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1,091

$0.627

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$0.564

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MKK Technologies

India . 2,262 parts In-Stock

1+ parts

$1.178

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2,262

$1.178

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DigiPath Technology Company

USA . 2,262 parts In-Stock

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$1.178

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2,262

$1.178

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Corphita

USA . 4,634 parts In-Stock

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$5.391

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$5.391

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Microchip USA

USA . 170 parts In-Stock

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$32.110

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170

$32.110

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Parana Technologies

USA . 2,120 parts In-Stock

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$0.749

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2,120

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$0.749

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,111 parts In-Stock

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Epart123

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 930 parts In-Stock

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930

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Alle Elektronik GmbH

Germany . 920 parts In-Stock

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920

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Overview

Unleash the power of STMicroelectronics with the STP180N10F3 Power Field Effect Transistor. This high-quality N-CHANNEL transistor is perfect for switching applications, offering a reliable and efficient solution for your electronic projects. With a maximum drain current of 120A and a low on-resistance of 0.0048 ohm, this transistor delivers exceptional performance. Trust in STMicroelectronics to provide innovative technology that exceeds expectations. Elevate your designs with the STP180N10F3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse voltage protection, enhancing the reliability of the transistor in various circuit designs.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers high efficiency and fast operation, making it ideal for power management in different systems.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes, allowing this FET to be used in demanding applications.

Maximum Pulsed Drain Current (IDM): 480 A

With a high pulsed drain current rating, this FET can handle large current spikes without compromising performance or reliability.

Maximum Power Dissipation (Abs): 315 W

The high power dissipation capability enables the transistor to handle high power levels without overheating, ensuring long-term stability and performance.

Maximum Drain-Source On Resistance: 0.0048 ohm

The low on-resistance minimizes power loss and improves efficiency in switching applications, making this FET an energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) STP180N10F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0048 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP180N10F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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