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NTMFS4823NT3G

Onsemi

NTMFS4823NT3G by Onsemi

NTMFS4823NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 85A IDM, 28.8mJ EAS, and 0.018 ohm RDS(on). Operating from -55 to 150 °C, it has a max power dissipation of 32.5W in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,129 parts In-Stock

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Digiode

USA . 472 parts In-Stock

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AZTECH Wire

Italy . 115 parts In-Stock

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SupplyDigital Components

Austria . 8,225 parts In-Stock

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Kulean Microsystems

USA . 7,073 parts In-Stock

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Corphita

USA . 2,391 parts In-Stock

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Problanco Electronics

Mexico . 1,883 parts In-Stock

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TANS Electronics

Latvia . 1,341 parts In-Stock

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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Corohmni

South Africa . 335 parts In-Stock

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Overview

Experience the power and reliability of the NTMFS4823NT3G by Onsemi. Crafted with precision and quality in mind, this Power Field Effect Transistor offers exceptional performance in switching applications. With a maximum pulsing drain current of 85A and a minimum breakdown voltage of 30V, this N-channel transistor delivers efficiency and durability. Perfect for a wide range of electronic devices, this product showcases Onsemi's commitment to excellence. Trust in the NTMFS4823NT3G to elevate your projects with its superior capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current-handling capabilities, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and can help protect the circuit from voltage spikes and reverse currents.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in scenarios where rapid on/off switching is required.

Surface Mount: YES

Surface mount capability makes for easier and more efficient integration onto circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 30 V

A relatively high breakdown voltage provides a safety margin for the transistor, preventing damage from voltage spikes or surges.

Maximum Drain-Source On Resistance: 0.018 ohm

Low ON resistance minimizes power loss and heat generation in the transistor, leading to higher efficiency and better performance.

Maximum Drain Current (ID): 30 A

Capable of handling high current loads, making it suitable for applications that require significant power output.

Maximum Power Dissipation (Abs): 32.5 W

With a high power dissipation rating, this transistor can handle higher power levels without overheating or failing prematurely.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature range allows for operation in a wide range of environmental conditions, ensuring reliability and performance in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMFS4823NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

28.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

6.9 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

85 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

85 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4823NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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