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BALL Cellphone ICs 31

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
AD6657ABBCZRL by Analog Devices

AD6657ABBCZRL

Analog Devices

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

.51 mA

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657ABBCZ by Analog Devices

AD6657ABBCZ

Analog Devices

AD6657ABBCZ by Analog Devices is a Cellphone IC with 144 terminals in a square package. It operates at -40 to 85°C, with a supply voltage of 1.8V and max current of 0.51mA. This RF and baseband circuit is ideal for telecom applications due to its low profile, fine pitch design.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

.51 mA

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD9361BBCZ-REEL by Analog Devices

AD9361BBCZ-REEL

Analog Devices

AD9361BBCZ-REEL by Analog Devices is a CELLPHONE IC with 144 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for INDUSTRIAL telecom applications. Features include TIN SILVER COPPER finish, 1.3V supply voltage, and RF/BASEBAND circuit type.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

AD9361BBCZ by Analog Devices

AD9361BBCZ

Analog Devices

AD9361BBCZ by Analog Devices is a 144-terminal RF and baseband circuit IC with a nominal voltage of 1.3V. It operates in industrial temperature range (-40 to 85°C) and features a low profile, fine pitch grid array package suitable for cellphone applications. The IC is surface mountable, with terminal finish of tin silver copper, making it ideal for compact designs.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

TCM4400EGGM by Texas Instruments

TCM4400EGGM

Texas Instruments

Texas Instruments TCM4400EGGM is a BICMOS technology Cellphone IC with 80 terminals in a square package. It operates at -25 to 85 °C, consuming 0.03 mA at 3V. Ideal for BASEBAND CIRCUIT applications due to its low profile and fine pitch design.

S-PBGA-B80

10 mm

1

80

85 Cel

-25 Cel

PLASTIC/EPOXY

LFBGA

BGA80,10X10,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

3

Not Qualified

1.4 mm

Other Telecom ICs

.03 mA

3 V

YES

BICMOS

BASEBAND CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

10 mm

AD6650ABCZ by Analog Devices

AD6650ABCZ

Analog Devices

AD6650ABCZ by Analog Devices is a Cellphone IC with 121 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PBGA-B121

e1

12 mm

1

121

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

1.85 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

12 mm

CC1000YZR by Texas Instruments

CC1000YZR

Texas Instruments

CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

CC1000YZ by Texas Instruments

CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657BBCZ by Analog Devices

AD6657BBCZ

Analog Devices

AD6657BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8 V, suitable for RF and baseband circuits in telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

MAX4003EBL by Maxim Integrated

MAX4003EBL

Maxim Integrated

MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

AD6634BBC by Analog Devices

AD6634BBC

Analog Devices

AD6634BBC by Analog Devices is a Cellphone IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5-3.3V. This BASEBAND CIRCUIT technology uses CMOS and is ideal for telecom applications.

S-PBGA-B196

e0

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA196,14X14,40

SQUARE

GRID ARRAY

240

2.5,3.3

Not Qualified

Other Telecom ICs

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

15 mm

MAX4003EBL-T by Maxim Integrated

MAX4003EBL-T

Maxim Integrated

MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

AD6635BB by Analog Devices

AD6635BB

Analog Devices

AD6635BB by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5V and 3.3V. This BASEBAND CIRCUIT technology uses CMOS and is suitable for industrial telecom applications.

S-PBGA-B324

e0

19 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

225

2.5,3.3

Not Qualified

3.5 mm

Other Telecom ICs

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD SILVER

BALL

1 mm

BOTTOM

19 mm

GC5316IZED by Texas Instruments

GC5316IZED

Texas Instruments

GC5316IZED by Texas Instruments is a Cellphone IC with 388 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.5V and 3.3V. This RF and baseband circuit has a terminal pitch of 1mm, making it ideal for telecom applications.

S-PBGA-B388

e1

27 mm

3

1

388

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA388,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.5,3.3

Not Qualified

2.5 mm

Other Telecom ICs

1.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

27 mm

AD6636BBCZ by Analog Devices

AD6636BBCZ

Analog Devices

Analog Devices' AD6636BBCZ is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.

S-PBGA-B256

e1

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.85 mm

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

AD6636CBCZ by Analog Devices

AD6636CBCZ

Analog Devices

AD6636CBCZ by Analog Devices is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 1.8V, making it ideal for cellphone applications.

S-PBGA-B256

e1

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.85 mm

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

AD6654BBC by Analog Devices

AD6654BBC

Analog Devices

AD6654BBC by Analog Devices is a Cellphone IC with 256 terminals in a square grid array package. It operates b/w -25 °C to 85°C, with a nominal voltage of 1.8V. This BASEBAND CIRCUIT IC is designed for telecom applications, featuring surface mount capability and TIN LEAD SILVER terminal finish.

S-PBGA-B256

e0

17 mm

3

1

256

85 Cel

-25 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

240

Not Qualified

1.85 mm

1.8 V

YES

BASEBAND CIRCUIT

OTHER

TIN LEAD SILVER

BALL

1 mm

BOTTOM

17 mm

AD6634BBCZ by Analog Devices

AD6634BBCZ

Analog Devices

AD6634BBCZ by Analog Devices is a Cellphone IC with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features CMOS technology, 2.5V supply voltage, and baseband circuit for telecom applications.

S-PBGA-B196

e1

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

15 mm

AFE7921IABJ by Texas Instruments

AFE7921IABJ

Texas Instruments

AFE7921IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a compact size of 17x17 mm and is surface mountable.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7988IABJ by Texas Instruments

AFE7988IABJ

Texas Instruments

AFE7988IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit IC has a fine pitch of 0.8mm, making it ideal for telecom applications.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7989IABJ by Texas Instruments

AFE7989IABJ

Texas Instruments

AFE7989IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C and features RF AND BASEBAND CIRCUIT for telecom applications. The package is made of PLASTIC/EPOXY, measures 17x17 mm, and has a terminal pitch of 0.8 mm.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AD6688BBPZRL-3000 by Analog Devices

AD6688BBPZRL-3000

Analog Devices

AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.53 mm

.975 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

AFE7799IABJ by Texas Instruments

AFE7799IABJ

Texas Instruments

AFE7799IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C and features RF AND BASEBAND CIRCUIT for telecom applications. The package measures 17x17 mm with a terminal pitch of 0.8mm, making it suitable for compact mobile devices.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7920IABJ by Texas Instruments

AFE7920IABJ

Texas Instruments

AFE7920IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a terminal pitch of 0.8mm and measures 17x17mm, making it ideal for cellphone applications.

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

17 mm

AFE7700IALK by Texas Instruments

AFE7700IALK

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: FBGA; Package Shape: SQUARE;

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

17 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

150 mA

1.3 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9986BBPZ-4D2AC by Analog Devices

AD9986BBPZ-4D2AC

Analog Devices

AD9986BBPZ-4D2AC by Analog Devices is a Cellphone IC with 324 terminals in a square package. It operates b/w -40 to 120 °C, consuming 4070mA at 1V. This RF and baseband circuit is ideal for mobile phone applications due to its compact size and high performance capabilities.

S-PBGA-B324

15 mm

3

1

324

120 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

260

1.72 mm

4070 mA

1 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

30

15 mm

AFE8030IABJ by Texas Instruments

AFE8030IABJ

Texas Instruments

AFE8030IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40°C to 85°C, has a terminal pitch of 0.8mm, and features RF and baseband circuitry. Ideal for telecom applications requiring fine-pitch grid array packages.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

AFE8030EDIABJ by Texas Instruments

AFE8030EDIABJ

Texas Instruments

AFE8030EDIABJ by Texas Instruments is a cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with terminal finish of Tin Silver Copper. This RF and baseband circuit has a compact size of 17x17mm for telecom applications.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

AFE8030EDIALK by Texas Instruments

AFE8030EDIALK

Texas Instruments

AFE8030EDIALK by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40 to 85°C, with peak reflow temp of 220°C. This RF and baseband circuit is ideal for telecom applications due to its fine pitch grid array style and bottom terminal position.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN LEAD

BALL

.8 mm

BOTTOM

17 mm