Loading...

BGA Microcontrollers 140

Microcontrollers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors Digital To Analog Convertors
SPC5777CAK3MME3 by NXP Semiconductors

SPC5777CAK3MME3

NXP Semiconductors

The NXP Semiconductors SPC5777CAK3MME3 microcontroller features a 32-bit architecture, 416 terminals, and 8388608 ROM words. Ideal for automotive applications, it offers peripherals like DMA(128), PWM, and temperature sensor support. With a max clock frequency of 40 MHz and connectivity options including CAN(4) and ETHERNET, this CMOS technology-based microcontroller is designed for high-performance automotive systems.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CDK3MME3R by NXP Semiconductors

SPC5777CDK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CDK3MME3 by NXP Semiconductors

SPC5777CDK3MME3

NXP Semiconductors

The NXP Semiconductors SPC5777CDK3MME3 microcontroller features a 32-bit architecture with 8388608 ROM words and 524288 RAM bytes. It offers peripherals like DMA(128), PWM, and temperature sensor, suitable for automotive applications. With CAN(6), DSPI(5), EBI, Ethernet, and SCI(5) connectivity options, it operates at a max clock frequency of 40 MHz in an automotive-grade package.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CDK3MMO3R by NXP Semiconductors

SPC5777CDK3MMO3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MME3R by NXP Semiconductors

SPC5777CLK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MME3 by NXP Semiconductors

SPC5777CLK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MMO3R by NXP Semiconductors

SPC5777CLK3MMO3R

NXP Semiconductors

NXP SPC5777CLK3MMO3R is a 32-bit microcontroller with 516 terminals, operating at up to 40 MHz. It features ADC and DMA channels, along with peripherals like PWM and temperature sensor. Ideal for automotive applications due to its flash ROM programmability, CAN, DSPI, Ethernet connectivity, and wide temperature range from -40°C to 125°C.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MMO3 by NXP Semiconductors

SPC5777CLK3MMO3

NXP Semiconductors

NXP Semiconductors' SPC5777CLK3MMO3 is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications with an operating temperature range of -40 to 125 °C and a max clock frequency of 40 MHz.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CRK3MME3 by NXP Semiconductors

SPC5777CRK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CRK3MMO3 by NXP Semiconductors

SPC5777CRK3MMO3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MME3R by NXP Semiconductors

SPC5777CSK3MME3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MME3 by NXP Semiconductors

SPC5777CSK3MME3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B416

e2

27 mm

3

416

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MMO3R by NXP Semiconductors

SPC5777CSK3MMO3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

27 mm

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MMO3 by NXP Semiconductors

SPC5777CSK3MMO3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

27 mm

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

STM32F303VEY6TR by STMicroelectronics

STM32F303VEY6TR

STMicroelectronics

STM32F303VEY6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max clock frequency of 32 MHz, and supports multiple ADC and PWM channels. Ideal for embedded applications, it offers robust performance in compact designs. Its rectangular grid array package ensures efficient surface mounting.

YES

24

32

32 MHz

YES

32

5.041 mm

77

100

YES

BGA

RECTANGULAR

GRID ARRAY

NOT SPECIFIED

72 rpm

3.6 V

2 V

3.3 V

YES

BALL

.4 mm

BOTTOM

NOT SPECIFIED

4.775 mm

MICROCONTROLLER, RISC

LPC18S57JET256E by NXP Semiconductors

LPC18S57JET256E

NXP Semiconductors

LPC18S57JET256E by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 164 I/O lines and supports ADC and DMA channels, making it suitable for applications requiring precise analog-to-digital conversion and efficient data transfer.

YES

0

32

25 MHz

YES

0

17 mm

3

164

256

YES

BGA

SQUARE

GRID ARRAY

260

180 rpm

3.6 V

2.4 V

3.3 V

YES

BALL

1 mm

BOTTOM

17 mm

MICROCONTROLLER, RISC

STM32F405OGY6VTR by STMicroelectronics

STM32F405OGY6VTR

STMicroelectronics

STM32F405OGY6VTR by STMicroelectronics is a 32-bit microcontroller with 50 MHz clock frequency, 72 I/O lines, and ADC/DMA channels. It operates b/w 1.8-3.6 V, suitable for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs like IoT devices or industrial automation systems.

YES

0

32

50 MHz

YES

0

4.188 mm

72

90

YES

BGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

168 rpm

3.6 V

1.8 V

3.3 V

YES

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.934 mm

MICROCONTROLLER, RISC

SPC5533MVM80R by NXP Semiconductors

SPC5533MVM80R

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 208; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

YES

0

32

80 MHz

NO

0

e1

17 mm

3

208

NO

BGA

SQUARE

GRID ARRAY

240

80 rpm

1.65 V

1.35 V

1.5 V

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

17 mm

MICROCONTROLLER, RISC

SPC5645SF1CVU by NXP Semiconductors

SPC5645SF1CVU

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);

YES

0

32

16 MHz

YES

0

e2

27 mm

3

177

416

YES

BGA

SQUARE

GRID ARRAY

260

125 rpm

1.32 V

1.08 V

1.2 V

YES

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

UPD60510BF1-HN4-M1-A by Renesas Electronics

UPD60510BF1-HN4-M1-A

Renesas Electronics

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

NO

0

32

100 MHz

NO

YES

0

S-PBGA-B324

e6

19 mm

96

324

85 Cel

-40 Cel

NO

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

524288

100 rpm

1.1 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN BISMUTH

BALL

1 mm

BOTTOM

19 mm

MICROCONTROLLER, RISC

CAN(2), CSI(2), ETHERNET, I2C(2), UART(2)

DMA(4), TIMER(4), WDT

SAC57D53MCVMOR by NXP Semiconductors

SAC57D53MCVMOR

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

3145728

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D53MCVMO by NXP Semiconductors

SAC57D53MCVMO

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; ADC Channels: YES;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

3145728

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D54HCVMOR by NXP Semiconductors

SAC57D54HCVMOR

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

4194304

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D54HCVMO by NXP Semiconductors

SAC57D54HCVMO

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

4194304

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SPC5777CDK3MME4R by NXP Semiconductors

SPC5777CDK3MME4R

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 416; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

YES

0

32

40 MHz

YES

0

e2

27 mm

3

416

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MME4 by NXP Semiconductors

SPC5777CDK3MME4

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MME4 microcontroller features 32-bit architecture, 40 MHz clock frequency, and 416 terminals in a square package. Ideal for applications requiring ADC and DMA channels, with a peak reflow temperature of 260°C.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

416

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MMO4R by NXP Semiconductors

SPC5777CDK3MMO4R

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MMO4R is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, PWM support, and a RISC architecture. This square-shaped microcontroller with grid array packaging is suitable for applications requiring high-speed processing and precise control in automotive electronics.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

516

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MMO4 by NXP Semiconductors

SPC5777CDK3MMO4

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MMO4 is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and PWM control. Ideal for use in automotive electronics due to its robust design and advanced capabilities.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

516

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

TC336DA32F200SAAKXUMA1 by Infineon Technologies

TC336DA32F200SAAKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

NO

YES

0

R-PBGA-B180

e2

12 mm

3

180

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

200 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC336DA32F300SAAKXUMA1 by Infineon Technologies

TC336DA32F300SAAKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

NO

YES

0

R-PBGA-B180

e2

12 mm

3

180

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC336LP32F200SAAKXUMA1 by Infineon Technologies

TC336LP32F200SAAKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

NO

YES

0

R-PBGA-B180

12 mm

3

180

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

200 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC336LP32F200SAALXUMA1 by Infineon Technologies

TC336LP32F200SAALXUMA1

Infineon Technologies

MICROCONTROLLER; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE; ROM Programmability: FLASH;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

NO

YES

0

R-PBGA-B180

12 mm

3

180

8

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

200 rpm

3.3 V

YES

CMOS

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC356TA64F300SABKXUMA1 by Infineon Technologies

TC356TA64F300SABKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

NO

YES

0

R-PBGA-B180

e2

12 mm

3

180

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC366DP64F300SAAKXUMA1 by Infineon Technologies

TC366DP64F300SAAKXUMA1

Infineon Technologies

Infineon's TC366DP64F300SAAKXUMA1 is a 32-bit microcontroller with 180 terminals in a square grid array package. Operating at -40 to 125°C, it features ADC and DMA channels, PWM support, and flash ROM programmability. Ideal for automotive applications requiring high-speed processing and precise control in a compact form factor.

YES

IT ALSO OPERATES AT 5V NOM SUPPLY

0

32

NO

YES

0

S-PBGA-B180

e2

12 mm

3

180

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

TC366DP64F300SAALXUMA1 by Infineon Technologies

TC366DP64F300SAALXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 180; Package Code: BGA; Package Shape: SQUARE;

YES

IT ALSO OPERATES AT 5V NOM SUPPLY

0

32

NO

YES

0

S-PBGA-B180

e2

12 mm

3

180

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

FLASH

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

12 mm

MICROCONTROLLER

SPC5673FK0MVY2 by NXP Semiconductors

SPC5673FK0MVY2

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

FLASH

2.55 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

MSP430F5308IZXHR by Texas Instruments

MSP430F5308IZXHR

Texas Instruments

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 80; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

47

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

16384

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

MSP430F5308IZXH by Texas Instruments

MSP430F5308IZXH

Texas Instruments

MSP430F5308IZXH by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 18 timers, I2C/SPI/UART connectivity, and on-chip flash ROM programmability.

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

47

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

16384

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

MSP430F5309IZXHR by Texas Instruments

MSP430F5309IZXHR

Texas Instruments

MSP430F5309IZXHR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, CRC, DMA(3), PWM, RTC, and WDT for efficient system control. With a wide temperature range of -40 to 85 °C, this microcontroller offers high performance in various environments.

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

47

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

24576

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

MSP430F5309IZXH by Texas Instruments

MSP430F5309IZXH

Texas Instruments

MSP430F5309IZXH by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and low power mode. Features include BOD, CRC, DMA(3), PWM, RTC, WDT for versatile connectivity via I2C(2), IRDA(2), LIN(2), SPI(4), UART interfaces.

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

47

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

24576

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

MSP430F5310IZXHR by Texas Instruments

MSP430F5310IZXHR

Texas Instruments

MSP430F5310IZXHR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications requiring low power consumption and high-speed processing. Features include BOD, CRC, DMA(3), PWM, RTC, WDT for versatile connectivity via I2C(2), IRDA(2), LIN(2), SPI(4), UART interfaces.

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

31

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

32768

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

MSP430F5310IZXH by Texas Instruments

MSP430F5310IZXH

Texas Instruments

MSP430F5310IZXH by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications requiring low power consumption, it features BOD, CRC, DMA(3), PWM, RTC, WDT peripherals and operates in temperature range of -40 to 85 °C.

YES

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

0

16

YES

MSP430

32 MHz

NO

YES

0

FIXED POINT

NO

S-PBGA-B80

e1

5 mm

YES

3

3

0

47

4

80

18

16

8

85 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA80,9X9,20

SQUARE

GRID ARRAY

260

6144

3072

32768

FLASH

1 mm

25 rpm

6.5 mA

3.6 V

2.4 V

3 V

YES

BIPOLAR

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

MICROCONTROLLER, RISC

0

I2C(2), IRDA(2), LIN(2), SPI(4), UART

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

12-Ch 10-Bit

SC511660MZP40 by NXP Semiconductors

SC511660MZP40

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

YES

IT ALSO OPERATES AT 5 V

24

32

YES

MPC500

20 MHz

NO

NO

32

FLOATING POINT

YES

S-PBGA-B272

27 mm

YES

3

8

101

4

272

3

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA272,20X20,50

SQUARE

GRID ARRAY

235

26624

458752

FLASH

2.65 mm

40 rpm

250 mA

3.6 V

3 V

3.3 V

YES

HCMOS

AUTOMOTIVE

BALL

1.27 mm

BOTTOM

30

27 mm

MICROCONTROLLER, RISC

0

CAN(2), SCI(2), QSPI

POR, RTC, TIMER(52), WDT

32-Ch 10-Bit

SAL-TC298TP-128F300NBC by Infineon Technologies

SAL-TC298TP-128F300NBC

Infineon Technologies

Infineon's SAL-TC298TP-128F300NBC microcontroller features 32-bit architecture, 40 MHz clock frequency, and 745472 bytes of RAM. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN, I2C, SPI, and more. With low power mode and integrated cache, this device ensures efficient performance in a compact package.

YES

32

YES

TC29X

40 MHz

NO

YES

FLOATING-POINT

YES

S-PBGA-B416

e4

27 mm

YES

3

128

416

3

8

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA416,26X26,40

SQUARE

GRID ARRAY

745472

8388608

FLASH

ISO 26262

2.15 mm

300 rpm

290 mA

1.43 V

1.235 V

1.3 V

YES

CMOS

NICKEL GOLD

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER

131072

ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5)

DMA(128), POR, RTC, TIMER(3), WDT

94-Ch 12-Bit