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MSP430F5309IZXH

Texas Instruments

MSP430F5309IZXH by Texas Instruments

MSP430F5309IZXH by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and low power mode. Features include BOD, CRC, DMA(3), PWM, RTC, WDT for versatile connectivity via I2C(2), IRDA(2), LIN(2), SPI(4), UART interfaces.

Median Price

$4.236

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,478 parts In-Stock

1+ parts

$3.753

100+ parts

$3.289

1k+ parts

$1.858

10k+ parts

-

1,478

$3.753

$3.289

$1.858

-

DigiKey

USA . 576 parts In-Stock

1+ parts

$4.720

100+ parts

$2.998

1k+ parts

$2.744

10k+ parts

-

576

$4.720

$2.998

$2.744

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,312 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,312

$3.050

-

-

-

Vyrian

USA . 4,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 295 parts In-Stock

1+ parts

$2.889

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$2.889

-

-

-

Parana Technologies

USA . 630 parts In-Stock

1+ parts

$28.517

100+ parts

-

1k+ parts

$48.432

10k+ parts

-

630

$28.517

-

$48.432

-

ChromeModa Solutions

Germany . 4,552 parts In-Stock

1+ parts

$32.042

100+ parts

$26.274

1k+ parts

-

10k+ parts

-

4,552

$32.042

$26.274

-

-

IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$32.042

100+ parts

$30.440

1k+ parts

$28.838

10k+ parts

-

1,764

$32.042

$30.440

$28.838

-

Microchip USA

USA . 1,104 parts In-Stock

1+ parts

$32.310

100+ parts

$32.110

1k+ parts

$32.010

10k+ parts

$31.910

1,104

$32.310

$32.110

$32.010

$31.910

QUARKTWIN TECHNOLOGY LTD

USA . 23,621 parts In-Stock

1+ parts

-

100+ parts

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23,621

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iodParts Technologies Inc.

India . 2,880 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,880

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-

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DigiPath Technology Company

USA . 1,159 parts In-Stock

1+ parts

-

100+ parts

$28.889

1k+ parts

-

10k+ parts

-

1,159

-

$28.889

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,000

-

-

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F5309IZXH microcontroller. Built with top-notch quality and reliability, this product from a trusted manufacturer offers unparalleled performance for various applications. From power management to industrial automation, this versatile microcontroller provides value-added features such as low power modes and multiple peripherals like timers, UART, and SPI. Experience efficiency, innovation, and seamless connectivity with the MSP430F5309IZXH – the perfect solution for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body is lightweight and durable, making the microcontroller easy to handle and resistant to physical damage.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle higher power requirements and is suitable for a wide range of applications.

No. of Terminals: 80

Having a large number of terminals allows for more connectivity options and peripherals to be integrated, making the microcontroller versatile in different applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers high performance with reduced instruction set computing, making it efficient in processing complex tasks quickly.

Maximum Clock Frequency: 32 MHz

With a high maximum clock frequency, this microcontroller can perform tasks at a faster rate, making it suitable for applications that require real-time processing.

Technical Specifications

Microcontrollers MSP430F5309IZXH attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5309IZXH Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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