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MSP430F5309IZXHR

Texas Instruments

MSP430F5309IZXHR by Texas Instruments

MSP430F5309IZXHR by Texas Instruments is a 16-bit microcontroller with 32 MHz clock frequency, 12-Ch 10-Bit ADC, and 18 timers. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, CRC, DMA(3), PWM, RTC, and WDT for efficient system control. With a wide temperature range of -40 to 85 °C, this microcontroller offers high performance in various environments.

Median Price

$2.814

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,572 parts In-Stock

1+ parts

$2.814

100+ parts

$2.466

1k+ parts

$1.393

10k+ parts

-

7,572

$2.814

$2.466

$1.393

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,207 parts In-Stock

1+ parts

$2.673

100+ parts

-

1k+ parts

-

10k+ parts

-

3,207

$2.673

-

-

-

Vyrian

USA . 5,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,659

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,549 parts In-Stock

1+ parts

$2.533

100+ parts

-

1k+ parts

-

10k+ parts

-

2,549

$2.533

-

-

-

Microchip USA

USA . 2,079 parts In-Stock

1+ parts

$12.160

100+ parts

$12.090

1k+ parts

$12.050

10k+ parts

$12.010

2,079

$12.160

$12.090

$12.050

$12.010

AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$20.190

100+ parts

-

1k+ parts

-

10k+ parts

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436

$20.190

-

-

-

Parana Technologies

USA . 2,218 parts In-Stock

1+ parts

$36.786

100+ parts

$3,416.172

1k+ parts

$33.108

10k+ parts

-

2,218

$36.786

$3,416.172

$33.108

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DigiPath Technology Company

USA . 1,783 parts In-Stock

1+ parts

$40.506

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$40.506

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-

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ChromeModa Solutions

Germany . 1,996 parts In-Stock

1+ parts

$41.333

100+ parts

$33.893

1k+ parts

-

10k+ parts

-

1,996

$41.333

$33.893

-

-

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$41.333

100+ parts

$39.266

1k+ parts

$37.200

10k+ parts

-

217

$41.333

$39.266

$37.200

-

Overview

Texas Instruments' MSP430F5309IZXHR microcontroller offers unparalleled quality and reliability for a wide range of applications. With advanced features like multiple ADC channels, DMA capabilities, and a maximum clock frequency of 32 MHz, this product provides exceptional value to customers seeking high performance in a compact package. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the MSP430F5309IZXHR is the perfect choice for efficient and dependable operation. Trust Texas Instruments for cutting-edge technology that delivers superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications while ensuring stable performance.

On Chip Data RAM Width: 16

Provides sufficient memory for data storage and processing tasks.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, making it suitable for compact designs.

Bit Size: 16

Offers a good balance between processing power and energy efficiency.

No. of Terminals: 80

Provides ample connectivity options for interfacing with other components and peripherals.

Maximum Clock Frequency: 32 MHz

Enables fast execution of instructions, making the product suitable for high-performance applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the product to interface with various sensors and devices.

DMA Channels: YES

Supports direct memory access for efficient data transfer, enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430F5309IZXHR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5309IZXHR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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