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MSP430F5308IZXH

Texas Instruments

MSP430F5308IZXH by Texas Instruments

MSP430F5308IZXH by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 18 timers, I2C/SPI/UART connectivity, and on-chip flash ROM programmability.

Median Price

$4.289

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,086 parts In-Stock

1+ parts

$3.608

100+ parts

$3.161

1k+ parts

$1.786

10k+ parts

-

6,086

$3.608

$3.161

$1.786

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DigiKey

USA . 571 parts In-Stock

1+ parts

$4.970

100+ parts

$3.163

1k+ parts

$3.008

10k+ parts

-

571

$4.970

$3.163

$3.008

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,108 parts In-Stock

1+ parts

$3.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,108

$3.192

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-

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Vyrian

USA . 7,046 parts In-Stock

1+ parts

-

100+ parts

-

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-

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7,046

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,078 parts In-Stock

1+ parts

$3.024

100+ parts

-

1k+ parts

-

10k+ parts

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3,078

$3.024

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Component Stockers USA

USA . 5,447 parts In-Stock

1+ parts

$4.660

100+ parts

$3.430

1k+ parts

$1.910

10k+ parts

-

5,447

$4.660

$3.430

$1.910

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Parana Technologies

USA . 1,763 parts In-Stock

1+ parts

$32.235

100+ parts

-

1k+ parts

$102.549

10k+ parts

-

1,763

$32.235

-

$102.549

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ChromeModa Solutions

Germany . 3,336 parts In-Stock

1+ parts

$36.219

100+ parts

$29.700

1k+ parts

-

10k+ parts

-

3,336

$36.219

$29.700

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IDEA Electronic Components Group

UK . 2,370 parts In-Stock

1+ parts

$36.219

100+ parts

$34.408

1k+ parts

$32.597

10k+ parts

-

2,370

$36.219

$34.408

$32.597

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QUARKTWIN TECHNOLOGY LTD

USA . 15,722 parts In-Stock

1+ parts

-

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15,722

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

-

100+ parts

$32.655

1k+ parts

-

10k+ parts

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1,910

-

$32.655

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F5308IZXH microcontroller! Designed for high-performance applications, this top-of-the-line device offers unmatched reliability and efficiency. With a wide range of peripherals including BOD, CRC, DMA, PWM, RTC, and more, it's perfect for a variety of projects. The MSP430 family is known for its cutting-edge technology and exceptional quality, making it a top choice for engineers and hobbyists alike. Upgrade your designs with the MSP430F5308IZXH and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing, resulting in faster and more reliable performance.

Maximum Clock Frequency: 32 MHz

High clock frequency enables the microcontroller to handle complex operations and computations quickly.

ADC Channels: YES

Integrated ADC channels allow for analog signals to be converted to digital data, expanding the range of applications that can be supported.

DMA Channels: YES

DMA channels enable direct memory access, improving data transfer speeds and reducing the workload on the CPU.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and efficient firmware updates and configuration changes.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures that the microcontroller can function reliably in harsh environmental conditions.

Technical Specifications

Microcontrollers MSP430F5308IZXH attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e1

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

47

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), LIN(2), SPI(4), UART

Peripherals:

BOD, CRC, COMPARATOR(8), DMA(3), PWM, RTC, TIMER(18), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430F5308IZXH Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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