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STM32F303VEY6TR

STMicroelectronics

STM32F303VEY6TR by STMicroelectronics

STM32F303VEY6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max clock frequency of 32 MHz, and supports multiple ADC and PWM channels. Ideal for embedded applications, it offers robust performance in compact designs. Its rectangular grid array package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,247 parts In-Stock

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Anansix

USA . 1,045 parts In-Stock

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1,045

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Digiode

USA . 735 parts In-Stock

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735

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Distributors (Availability)

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Vigor

Singapore . 2,608 parts In-Stock

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$6.230

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2,608

$6.230

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Microchip USA

USA . 8,601 parts In-Stock

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$20.428

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8,601

$20.428

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AZTECH Wire

Italy . 173 parts In-Stock

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$21.110

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173

$21.110

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IDEA Electronic Components Group

UK . 491 parts In-Stock

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$69.652

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$62.687

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491

$69.652

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$62.687

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MKK Technologies

India . 2,232 parts In-Stock

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$130.977

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$130.977

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DigiPath Technology Company

USA . 2,232 parts In-Stock

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$130.977

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$130.977

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Corphita

USA . 3,388 parts In-Stock

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Parana Technologies

USA . 508 parts In-Stock

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$83.280

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508

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$83.280

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Overview

Unlock the power of innovation with the STM32F303VEY6TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced microcontroller is perfect for a wide range of applications, from automotive to IoT devices. Experience enhanced performance with integrated ADC and DMA channels, ensuring seamless data processing. Choose STM32F303VEY6TR for unmatched value, empowering your designs with efficiency and cutting-edge technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for more compact designs and easier integration into printed circuit boards, enhancing manufacturing efficiency.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is suitable for a variety of low-power applications, ensuring efficient operation.

Address Bus Width: 24

A 24-bit address bus width allows the microcontroller to access a large memory space, making it versatile for complex applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs and can facilitate easier placement and soldering processes.

Bit Size: 32

As a 32-bit microcontroller, it offers enhanced processing power and efficiency, allowing for advanced computations and operations.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals and I/O expansion, making it suitable for complex projects.

Package Style (Meter): GRID ARRAY

The grid array package style supports high-density I/O configurations, which is essential for advanced applications requiring multiple connections.

Minimum Supply Voltage: 2 V

With the capability of operating at a minimum supply voltage of 2 V, this microcontroller is highly adaptable to various power sources.

ADC Channels: YES

The inclusion of ADC (Analog-to-Digital Converter) channels allows the microcontroller to process real-world analog signals, making it suitable for sensor applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency by allowing peripherals to communicate directly with memory without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning can simplify PCB layout and reduce inductance, leading to better signal integrity.

Width: 4.775 mm

A compact width of 4.775 mm allows it to fit into space-constrained environments, suitable for portable devices.

External Data Bus Width: 32

A 32-bit external data bus width ensures high throughput and efficient data processing capabilities, crucial for demanding applications.

Maximum Clock Frequency: 32 MHz

With a maximum clock frequency of 32 MHz, this microcontroller can handle multiple tasks swiftly, improving overall system performance.

Length: 5.041 mm

Its length of 5.041 mm contributes to its compact form factor, making it ideal for designs where space is limited.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient execution of instructions, resulting in faster performance and lower power consumption.

Terminal Form: BALL

Ball terminal forms promote robust soldering connections, enhancing reliability and durability in various applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V strikes a balance between performance and power efficiency, ideal for battery-operated devices.

PWM Channels: YES

Support for PWM (Pulse Width Modulation) channels allows for precise control of motors and other devices, making this microcontroller suitable for automation.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm enables high-density PCB designs, providing greater flexibility in complex circuits.

Speed: 72 rpm

While this spec may appear related to motors, it's indicative of the microcontroller's potential applications in speed control systems.

No. of I/O Lines: 77

With 77 I/O lines, this microcontroller provides extensive interfacing options for sensors, actuators, and communication modules.

Technical Specifications

Microcontrollers STM32F303VEY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

5.041 mm

No. of I/O Lines:

77

No. of Terminals:

100

PWM Channels:

YES

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.775 mm

Peripheral IC Type:

Trade Compliance

STM32F303VEY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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