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SAL-TC298TP-128F300NBC

Infineon Technologies

SAL-TC298TP-128F300NBC by Infineon Technologies

Infineon's SAL-TC298TP-128F300NBC microcontroller features 32-bit architecture, 40 MHz clock frequency, and 745472 bytes of RAM. Ideal for automotive applications with ISO 26262 screening level, it offers connectivity options like CAN, I2C, SPI, and more. With low power mode and integrated cache, this device ensures efficient performance in a compact package.

Median Price

$40.251

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$40.251

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10

$40.251

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Vyrian

USA . 7,317 parts In-Stock

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7,317

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Digiode

USA . 863 parts In-Stock

1+ parts

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863

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$17.864

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744

$17.864

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Ampacity Inc.

Singapore . 590 parts In-Stock

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$34.000

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590

$34.000

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$40.250

100+ parts

$38.238

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$35.822

500

$40.250

$38.238

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$35.822

Microchip USA

USA . 2,418 parts In-Stock

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2,418

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Corphita

USA . 391 parts In-Stock

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391

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Overview

Elevate your projects with the SAL-TC298TP-128F300NBC microcontroller by Infineon Technologies. Crafted with precision and innovation, this versatile device offers unparalleled performance and reliability for a wide range of applications. From automotive systems to industrial automation, this microcontroller guarantees seamless operation and enhanced efficiency. Experience the power of cutting-edge technology in a compact package with the SAL-TC298TP-128F300NBC, where quality meets value for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, ensuring its longevity and reliability in various operating conditions.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing the access time to frequently used instructions or data.

Surface Mount: YES

Being surface mountable makes the microcontroller easy to mount on PCBs, enabling efficient assembly processes and saving space in electronic designs.

Maximum Supply Voltage: 1.43 V

The maximum supply voltage of 1.43 V allows for safe operation without risking damage to the microcontroller, ensuring stability in the system.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits allows for efficient data processing and storage within the microcontroller, enhancing its performance capabilities.

Screening Level: ISO 26262

The ISO 26262 screening level ensures that the microcontroller meets the strict safety requirements for automotive applications, making it a reliable choice for such critical systems.

Package Shape: SQUARE

The square package shape offers a uniform and compact form factor, facilitating easier integration into electronic systems and optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data in larger chunks, allowing for faster computations and improved overall performance.

No. of Terminals: 416

The high number of terminals provides ample connectivity options for interfacing with external components, making the microcontroller versatile and adaptable to various system requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers robust mechanical support and easy soldering, ensuring reliable connections and durability in challenging environmental conditions.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage of 1.235 V allows for efficient power consumption and reliable operation even in scenarios with limited power availability.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, the microcontroller can function reliably in harsh environmental conditions without risking overheating or performance degradation.

CPU Family: TC29X

Belonging to the TC29X CPU family indicates compatibility and interoperability with other products in the same family, offering a seamless integration platform for diverse applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the microcontroller can withstand extreme cold environments and continue to function reliably without any issues.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides superior conductivity, corrosion resistance, and durability, ensuring reliable connections and longevity in demanding operating conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion functionality, allowing the microcontroller to interface with various analog sensors and devices, increasing its versatility in system design.

DMA Channels: YES

Having DMA channels facilitates efficient data transfer and processing operations, reducing the workload on the CPU and enhancing the overall performance of the microcontroller.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, making it easier for designers to incorporate the microcontroller into their electronic systems efficiently.

ROM Words: 8388608

With a large ROM capacity of 8388608 words, the microcontroller can store a significant amount of program instructions and data, enabling complex applications and firmware implementations.

Maximum Seated Height: 2.15 mm

The maximum seated height of 2.15 mm ensures compatibility with slim and compact electronic designs, allowing for space-efficient integration of the microcontroller in various applications.

Width: 27 mm

The compact width of 27 mm makes the microcontroller suitable for applications where space is limited, offering flexibility in design and installation options.

Data EEPROM Size: 131072

The generous data EEPROM size of 131072 bytes provides ample non-volatile memory for storing critical data and configurations, enhancing the microcontroller's versatility in data retention.

Technical Specifications

Microcontrollers SAL-TC298TP-128F300NBC attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TC29X

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B416

JESD-609 Code:

e4

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

416

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA416,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

RAM Bytes:

745472

ROM Words:

8388608

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

2.15 mm

Speed:

300 rpm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Data EEPROM Size:

131072

Connectivity:

ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5)

Peripherals:

DMA(128), POR, RTC, TIMER(3), WDT

Analog To Digital Convertors:

94-Ch 12-Bit

Trade Compliance

SAL-TC298TP-128F300NBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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