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TC366DP64F300SAAKXUMA1

Infineon Technologies

TC366DP64F300SAAKXUMA1 by Infineon Technologies

Infineon's TC366DP64F300SAAKXUMA1 is a 32-bit microcontroller with 180 terminals in a square grid array package. Operating at -40 to 125°C, it features ADC and DMA channels, PWM support, and flash ROM programmability. Ideal for automotive applications requiring high-speed processing and precise control in a compact form factor.

Median Price

$30.485

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 243 parts In-Stock

1+ parts

$30.340

100+ parts

$21.450

1k+ parts

$20.230

10k+ parts

-

243

$30.340

$21.450

$20.230

-

DigiKey

USA . 1,311 parts In-Stock

1+ parts

$30.630

100+ parts

$22.034

1k+ parts

-

10k+ parts

$19.855

1,311

$30.630

$22.034

-

$19.855

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 548 parts In-Stock

1+ parts

$57.000

100+ parts

-

1k+ parts

-

10k+ parts

-

548

$57.000

-

-

-

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$132.300

100+ parts

-

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-

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88

$132.300

-

-

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Vyrian

USA . 3,014 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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3,014

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$15.477

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$15.477

-

-

-

Modulus Dynamics

Lithuania . 647 parts In-Stock

1+ parts

$40.380

100+ parts

$38.765

1k+ parts

$37.150

10k+ parts

-

647

$40.380

$38.765

$37.150

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Corphita

USA . 89 parts In-Stock

1+ parts

$54.000

100+ parts

-

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-

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89

$54.000

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-

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Ampacity Inc.

Singapore . 139 parts In-Stock

1+ parts

$94.170

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$94.170

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$132.300

100+ parts

$129.654

1k+ parts

-

10k+ parts

-

2,000

$132.300

$129.654

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Continental Prestige Electronics

USA . 541 parts In-Stock

1+ parts

$132.300

100+ parts

-

1k+ parts

-

10k+ parts

$129.654

541

$132.300

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-

$129.654

Microchip USA

USA . 1,326 parts In-Stock

1+ parts

$158.760

100+ parts

-

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1,326

$158.760

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Argo Parts USA

USA . 2,111 parts In-Stock

1+ parts

-

100+ parts

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2,111

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Overview

Unleash the power of innovation with the TC366DP64F300SAAKXUMA1 microcontroller by Infineon Technologies. Crafted with precision and expertise, this cutting-edge device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as ADC channels, DMA channels, PWM channels, and ROM programmability, making it the perfect choice for automotive and other high-performance environments. Experience seamless operation and unmatched performance with the TC366DP64F300SAAKXUMA1 microcontroller - where excellence meets efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to temperature changes, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on the PCB, making it suitable for compact electronic devices.

Bit Size: 32

32-bit architecture provides high performance and processing power, making it suitable for applications requiring complex calculations and data processing.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

PWM Channels: YES

PWM channels provide the ability to generate analog-like signals for controlling motors, LEDs, and other devices, offering flexibility in system control.

Technical Specifications

Microcontrollers TC366DP64F300SAAKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5V NOM SUPPLY

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B180

JESD-609 Code:

e2

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

180

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

ROM Programmability:

FLASH

Speed:

300 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TC366DP64F300SAAKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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