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TC364DP64F300FAALXUMA1

Infineon Technologies

TC364DP64F300FAALXUMA1 by Infineon Technologies

Infineon's TC364DP64F300FAALXUMA1 is a 32-bit microcontroller with 144 terminals, operating at up to 160 MHz. Ideal for automotive applications, it features ADC and DMA channels, PWM support, and flash ROM programmability. With a temperature range of -40 to 150°C, this CMOS technology chip offers high performance in a compact square package.

Median Price

$46.808

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 759 parts In-Stock

1+ parts

$36.020

100+ parts

$25.749

1k+ parts

$23.899

10k+ parts

-

759

$36.020

$25.749

$23.899

-

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$57.596

100+ parts

$52.412

1k+ parts

$47.229

10k+ parts

-

1,000

$57.596

$52.412

$47.229

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 459 parts In-Stock

1+ parts

$54.716

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$54.716

-

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$77.857

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$77.857

-

-

-

Vyrian

USA . 898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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898

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 737 parts In-Stock

1+ parts

$48.960

100+ parts

-

1k+ parts

-

10k+ parts

-

737

$48.960

-

-

-

Corphita

USA . 221 parts In-Stock

1+ parts

$51.836

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$51.836

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$57.596

100+ parts

$52.412

1k+ parts

$47.229

10k+ parts

-

1,000

$57.596

$52.412

$47.229

-

Continental Prestige Electronics

USA . 2,863 parts In-Stock

1+ parts

$77.857

100+ parts

-

1k+ parts

-

10k+ parts

$76.300

2,863

$77.857

-

-

$76.300

Netroflash

USA . 100 parts In-Stock

1+ parts

$77.857

100+ parts

-

1k+ parts

$73.965

10k+ parts

$72.407

100

$77.857

-

$73.965

$72.407

Modulus Dynamics

Lithuania . 2,074 parts In-Stock

1+ parts

$79.512

100+ parts

$76.332

1k+ parts

$73.151

10k+ parts

-

2,074

$79.512

$76.332

$73.151

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Component Stockers USA

USA . 902 parts In-Stock

1+ parts

$106.210

100+ parts

$91.140

1k+ parts

$84.810

10k+ parts

-

902

$106.210

$91.140

$84.810

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Microchip USA

USA . 2,936 parts In-Stock

1+ parts

$223.146

100+ parts

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10k+ parts

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2,936

$223.146

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Argo Parts USA

USA . 3,718 parts In-Stock

1+ parts

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100+ parts

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3,718

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Overview

Unlock limitless possibilities with the TC364DP64F300FAALXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality microcontrollers that offer unparalleled performance and reliability. Ideal for automotive applications, this microcontroller boasts advanced features like ADC and DMA channels, ROM programmability, and PWM channels. With a maximum clock frequency of 160 MHz and a wide temperature range, this product ensures optimal functionality and durability. Elevate your projects with the TC364DP64F300FAALXUMA1 and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into various electronic designs.

Maximum Supply Voltage: 3.63 V

The higher maximum supply voltage provides flexibility in power supply options.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a PCB.

Bit Size: 32

A 32-bit architecture allows for faster and more efficient processing of data.

No. of Terminals: 144

The large number of terminals provides ample connectivity options for peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer versatility in mounting and thermal management.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage allows for efficient power consumption.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels enables analog input capabilities.

DMA Channels: YES

DMA channels enhance data transfer speed and efficiency.

Terminal Position: QUAD

Quad terminal positioning allows for easy PCB layout and soldering.

Maximum Seated Height: 1.2 mm

The low seated height makes the product suitable for compact electronic designs.

Width: 16 mm

The compact width allows for space-efficient PCB layout.

Maximum Clock Frequency: 160 MHz

High maximum clock frequency enables fast processing speeds.

Length: 16 mm

The small length contributes to a compact overall product size.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product is capable of integrating various functions in a single chip.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable operation within specified limits.

PWM Channels: YES

PWM channels enable precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming of the device.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for most environments.

Speed: 300 rpm

High processing speed of 300 rpm ensures fast execution of tasks.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM offers efficient storage and processing capabilities.

Technical Specifications

Microcontrollers TC364DP64F300FAALXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5V NOM SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TC364DP64F300FAALXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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