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XCZU9EG-1FFVC900I

Xilinx

XCZU9EG-1FFVC900I by Xilinx

XCZU9EG-1FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 900 terminals is ideal for industrial applications requiring high performance and reliability.

Median Price

$3,951.870

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Mouser Electronics

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Overview

Upgrade your projects with the XCZU9EG-1FFVC900I by Xilinx, a cutting-edge microprocessor circuit that delivers unparalleled performance and reliability. Manufactured by Xilinx, a leader in the industry, this versatile chip is ideal for a wide range of applications. With its advanced technology and industrial-grade temperature tolerance, you can trust that this product will exceed your expectations. Experience seamless operation and enhanced efficiency with the XCZU9EG-1FFVC900I - the perfect solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it a good choice for mass production applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and enabling automated production processes.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage of 0.876 V provides flexibility in power requirements and compatibility with various voltage sources.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB and enables convenient positioning for connections.

No. of Terminals: 900

Having a high number of terminals (900) allows for a greater amount of input/output connections, expanding functionality and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers a high terminal count in a compact form factor, suitable for applications requiring dense board integration.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliability and performance in extreme temperature environments, making it suitable for industrial use.

Moisture Sensitivity Level (MSL): 4

With MSL 4, the product can withstand multiple reflows and has a higher resistance to moisture, ensuring reliability during assembly and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9EG-1FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9EG-1FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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