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XCZU7EV-L1FBVB900I

Xilinx

XCZU7EV-L1FBVB900I by Xilinx

The Xilinx XCZU7EV-L1FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100°C, with supply voltage ranging from 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 413 parts In-Stock

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$6.910

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Ampacity Inc.

Singapore . 905 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 699 parts In-Stock

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$24.375

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Aztec Data Supply Inc.

USA . 546 parts In-Stock

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$31.279

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MARBEL Systems

Belgium . 3,276 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Corohmni

South Africa . 1,032 parts In-Stock

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Modulus Dynamics

Lithuania . 1,744 parts In-Stock

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Qasali Group International

UK . 25 parts In-Stock

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Argo Parts USA

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Supply Digital

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Continental Prestige Electronics

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Vigor

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Overview

Experience the cutting-edge technology of the XCZU7EV-L1FBVB900I by Xilinx, a top-tier manufacturer known for delivering high-quality solutions. This versatile product falls under the category of Other Function uPs,uCs & Peripheral ICs, making it ideal for a wide range of applications. With its advanced features and reliable performance, customers can expect exceptional value and benefits. Elevate your projects with this innovative solution and stay ahead of the curve in today's competitive market.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers durability and allows for compact design.

Surface Mount:

YES - Makes it easier to mount on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage:

0.742 V - Ensures safe operation within specified voltage range.

Package Shape:

RECTANGULAR - Allows for efficient placement and organization in electronic devices.

No. of Terminals:

900 - Provides ample connectivity options for various functions and peripherals.

Package Style (Meter):

GRID ARRAY - Offers a sturdy and reliable package structure for enhanced performance.

Minimum Supply Voltage:

0.698 V - Ensures consistent power supply for uninterrupted functionality.

Maximum Operating Temperature:

100 °C - Can withstand high temperatures without compromising performance.

Minimum Operating Temperature:

40 °C - Can operate in extreme cold conditions without issues.

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) - Enhances electrical conductivity and resistance to corrosion.

Terminal Position:

BOTTOM - Facilitates easy connections and interactions with other components.

Maximum Time At Peak Reflow Temperature (s):

30 - Offers a quick and efficient reflow process during manufacturing.

Peak Reflow Temperature °C:

245 - Ensures proper soldering and bonding during assembly.

Temperature Grade:

INDUSTRIAL - Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Enables complex computational tasks and functions within the device.

Technology:

CMOS - Provides low power consumption and high noise immunity for efficient operation.

Terminal Form:

BALL - Enhances connectivity and reliability for seamless data transmission.

Nominal Supply Voltage:

0.72 V - Maintains stable voltage supply for consistent performance.

Moisture Sensitivity Level (MSL):

4 - Suitable for devices that may be exposed to moderate moisture levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-L1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-L1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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