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XM4C129XNCZADI1

Texas Instruments

XM4C129XNCZADI1 by Texas Instruments

XM4C129XNCZADI1 by Texas Instruments is a 32-bit microcontroller with 24-Ch 12-Bit ADC channels, 262144 bytes of RAM, and 1048576 ROM words. It operates at a max clock frequency of 25 MHz and features various peripherals like PWM(8) and UART(8). Ideal for industrial applications requiring high-speed data processing and connectivity options such as CAN(2) and USB.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,370 parts In-Stock

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Digiode

USA . 766 parts In-Stock

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766

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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Dan-Mar Components

USA . 18 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,222 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 504 parts In-Stock

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$12.111

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Parana Technologies

USA . 776 parts In-Stock

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$61.243

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776

$61.243

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DigiPath Technology Company

USA . 450 parts In-Stock

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$67.436

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$62.041

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$67.436

$62.041

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ChromeModa Solutions

Germany . 4,302 parts In-Stock

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$68.812

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$56.426

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IDEA Electronic Components Group

UK . 228 parts In-Stock

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$68.812

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$65.371

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$61.931

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228

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$61.931

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Microchip USA

USA . 4,515 parts In-Stock

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Corphita

USA . 4,172 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the XM4C129XNCZADI1 by Texas Instruments, a cutting-edge microcontroller that offers unparalleled quality and reliability. Designed for a wide range of applications, this device from a trusted manufacturer boasts advanced features and capabilities that set it apart from the competition. With its state-of-the-art technology and impressive performance, the XM4C129XNCZADI1 delivers exceptional value, benefits, and advantages to customers seeking a superior solution for their projects. Elevate your designs to new heights with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliability in various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options and compatibility with a wide range of power sources.

Package Shape: SQUARE

A compact and space-efficient design that can fit well in tight spaces or densely populated PCB layouts.

Bit Size: 32

Offers high processing capabilities and performance for handling complex tasks and computations.

No. of Terminals: 212

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enhances signal integrity and minimizes crosstalk in high-speed applications, ensuring reliable data transmission.

Minimum Supply Voltage: 1.14 V

Allows for operation at lower power levels, helping to conserve energy and extend battery life in portable devices.

Maximum Operating Temperature: 85 °C

Ensures stable operation even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions, allowing for reliable operation in harsh environments.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data, expanding its capabilities for sensor interfacing and signal processing.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer and processing, improving overall system performance.

Terminal Position: BOTTOM

Simplifies PCB layout and routing, optimizing signal paths and reducing interference for enhanced system reliability.

ROM Words: 1048576

Provides ample storage space for program and data storage, accommodating complex algorithms and applications.

Maximum Seated Height: 1 mm

Offers a low-profile design that can be easily integrated into slim and compact electronic devices.

Width: 10 mm

Compact size allows for space-efficient placement on the PCB, enabling versatile design layouts.

Data EEPROM Size: 6K

Stores non-volatile data for system configuration and parameter storage, preserving critical information even during power loss.

Peripherals: BOR, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), RTC, TIMER(9), WDT(2)

A wide range of peripheral options for interfacing with various sensors, displays, and communication interfaces, enhancing system functionality.

Maximum Clock Frequency: 25 MHz

Delivers high-speed processing capabilities for real-time applications and time-critical tasks.

Length: 10 mm

Compact form factor that can be easily integrated into space-constrained designs, offering flexibility in PCB layout.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with varying temperature conditions, ensuring long-term performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient instruction execution and faster processing speeds, suitable for high-performance applications.

RAM Bytes: 262144

Provides sufficient memory for data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered devices and noise-sensitive applications.

Terminal Form: BALL

Ball grid array (BGA) terminal form for reliable solder connections and signal integrity, ensuring robust performance in demanding applications.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high resolution for precise analog signal conversion, expanding the scope of sensor interfacing and data acquisition.

Nominal Supply Voltage: 1.2 V

Standard supply voltage level for stable and efficient operation, ensuring compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog outputs, enabling fine-tuning of motor speeds, LED brightness, and other parameters.

Connectivity: 1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Versatile connectivity options for interfacing with a wide range of devices and peripherals, facilitating seamless communication in diverse systems.

ROM Programmability: FLASH

Flash programmable memory for easy and quick firmware updates, enabling efficient maintenance and enhancement of system functionalities.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density interconnections, optimizing PCB layout and signal integrity in compact electronic devices.

Speed: 120 rpm

Suitable for applications requiring consistent and precise motor speed control, enhancing performance in robotics, automation, and motion control systems.

On Chip Program ROM Width: 8

Provides sufficient storage capacity for program instructions, supporting complex algorithms and system functionalities.

No. of I/O Lines: 140

Abundant I/O lines for interfacing with external devices and peripherals, offering flexibility in system configuration and expansion.

Technical Specifications

Microcontrollers XM4C129XNCZADI1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B212

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

212

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XM4C129XNCZADI1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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